JPS5895655U - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS5895655U
JPS5895655U JP1981192112U JP19211281U JPS5895655U JP S5895655 U JPS5895655 U JP S5895655U JP 1981192112 U JP1981192112 U JP 1981192112U JP 19211281 U JP19211281 U JP 19211281U JP S5895655 U JPS5895655 U JP S5895655U
Authority
JP
Japan
Prior art keywords
header
semiconductor chip
lead frame
semiconductor equipment
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1981192112U
Other languages
English (en)
Inventor
依田　和光
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1981192112U priority Critical patent/JPS5895655U/ja
Publication of JPS5895655U publication Critical patent/JPS5895655U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図ａ、　　ｂは従来の電力用半導体装置の一例の樹
脂封止前の平面図及び側面図、第２図は第１図ａ、　ｂ
に示す電力用半導体装置の樹脂封止後の側面図、第３図
は本考案の第１の実施例の断面図、第４図は本考案の第
２の実施例の断面図である。 １・・・・・・ヘッダ一部、２・・・・・・外部リード
線、３・・・・・・半導体チップ、４・・・・・・金属
細線、５・・・・・・樹脂、１１・・・・・・ヘッダ一
部、１２・・・・・・外部リード線、１５・・・・・・
樹脂、１６．１７・・・・・・放熱ブロック。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体チップを搭載するヘッダ一部と外部リード線とが
    同一材料で同一厚さに形成されたリードフレームと、前
    記ヘッダ一部の半導体チップ搭載面と反対側の面に接触
    し、該接触面がその反対側の露出面となる表面より大き
    くなるように形成された放熱ブロックと、前記ヘッダ一
    部に搭載され前記リードフレームと結線接続される半導
    体チップと、前記放熱ブロックの露出面及び外部リード
    の一部を露出せしめて他を包みこんで封止する樹脂とを
    含むことを特徴とする半導体装置。
JP1981192112U 1981-12-23 1981-12-23 半導体装置 Pending JPS5895655U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981192112U JPS5895655U (ja) 1981-12-23 1981-12-23 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981192112U JPS5895655U (ja) 1981-12-23 1981-12-23 半導体装置

Publications (1)

Publication Number Publication Date
JPS5895655U true JPS5895655U (ja) 1983-06-29

Family

ID=30105538

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981192112U Pending JPS5895655U (ja) 1981-12-23 1981-12-23 半導体装置

Country Status (1)

Country Link
JP (1) JPS5895655U (ja)

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