JPS6042841A - Device for automatic detachment of image sensor integrated circuit - Google Patents

Abstract

PURPOSE:To shorten the measuring time by a method wherein firstly finger prints and the like attaching to the photo receiving surface of an IC are kept removed by gas jetting, etc. out of a dark box, when the title IC is contained, by means of a lid, in the dark box having an optical system controlled by an external optical control system and a socket, and is then subjected to quality judgement by photo irradiation after the lid is closed. CONSTITUTION:The optical system C controlled by the optical control system D provided outside and the socket B connecting said IC are provided in the dark box, and the front surface of the box is provided with the lid A freely opening and closing. Next, an IC element F to be measured is connected to the socket B with the photo receiving surface E upward by means of fingers G or a robot H. At this time, the surface E is cleaned not after the element F is inserted in the box, but when it is outside the box. Thereafter, the surface E of the element F is irradiated in the box wth the light from the system C, and the quality is judged by the processing of the obtained analog signal.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an automatic attachment/detachment device used in optical testing of integrated circuits for image sensors.

In conventional optical testing of integrated circuits for image sensors (hereinafter abbreviated as DUT), the method for attaching and detaching the DUT was as follows. In other words, a dark box as shown in Figure 1 (closing the lid shuts off light from the outside, and inside is an IC socket for attaching and detaching the optical system 0 whose light intensity is changed by external control and the DUT). Close the lid of the box with (c) and insert the DUT into the socket (b). Next, wipe the glue inside the dark box and the light-receiving surface of the UT with a cloth, close the lid, and prepare for the test. Next, when the test is finished, one cycle is completed by removing the lid and removing the DUT.

The problem here is when inserting the DUT into the IC socket. Generally, when performing an optical test of a DUT (processing the analog signal obtained by irradiating a certain amount of light onto the light receiving surface of the DUT to determine pass/fail), dust or fingerprints may be found on the light receiving surface of the DUT. If there are filth such as
A shadow is created on the light-receiving element in the UT, and when dirt is removed, a product that is considered good is marked as defective due to the shadow. Therefore, when performing an optical test, be sure to wipe the light-receiving surface of the DLIT clean. The conventional method involved inserting the DUT into the IC socket (b) and then wiping the light-receiving surface. With this method, the light-receiving surface is clean, but the dust from the object being wiped or the dust that was wiped off to improve light reception accumulates inside the dark box, and when the lid (A) is opened and closed, the dust inside the dark box is disturbed.
It sometimes adhered to the light-receiving surface of the T, and a good product was sometimes considered to be a defective product.

Even if the DUT's light-receiving surface is wiped externally, the second
When holding it in the stock shown in the figure and inserting it into the IC socket, does it inevitably fall on the light receiving surface? If the kf came into contact with it, and even if I was wearing gloves, I would have to wipe it off after inserting the IC socket IIK due to dust from the gloves or water vapor from my fingers. In addition, when it comes to opening and closing the lid, there are differences in the amount of force applied manually, and there are many failures in the opening/closing part of the lid (on the lid) and failures in the locking mechanism used to keep it closed.

The object of the invention is to eliminate the above-mentioned drawbacks.

The features of the present invention include a mechanism for rinsing the liquid in the dark box described above, opening and closing the cover of the dark box, wiping off dirt on the light receiving surface of the DUT outside the dark box, and further spraying gas onto the light receiving surface of the DUT, and the dark box. This is an automatic device for attaching and detaching integrated circuits for image sensors and sensors using a robot, which is equipped with a mechanism for attaching and detaching a DUT to an IC socket inside the device.

By using the device of the present invention, there are the following advantages.

First, use the finger diaphragm in the light receiving direction of the DUT to wipe off any dust.
Furthermore, using Shingayu, which sprays gas onto the light-receiving surface of the DUT, outside the dark box shown in Figure 1, the dirt such as fingerprints adhering to the light-receiving surface of the DLIT is wiped away by spraying the gas. The dust generated from the wiped object is removed by the sound of gas.This leaves the light receiving surface of the DOT outside the dark box free of dirt.Then, the DU to the IC socket (b) inside the dark box is removed.
Using the T attachment/detachment mechanism, attach the DUTψ)? as shown in Figure 3. ]−
The IC socket inside the dark box is grabbed by a robot. With this body, the light receiving surface of the DUT inserted into 9. Since no material that generates dust is used, there is no need to disturb the dust caused by closing the lid.Next, when using the mechanism to open and close the lid (6), it works with a constant force, so the minimum amount of dust is generated. If the lid (6) is set so that it can be opened and closed by force, there will be less chance of damage to the lid (6), and even if a locking mechanism is not installed, the robot can be set to hold the lid during the test. It is also easier to operate, and there are fewer failures.

Also, conventionally, the DUT is inserted into the IC socket.
g) There was a task of wiping the light-receiving surface, but by using the device of the present invention, the light-receiving surface of the next DUT can be processed during the test, so wiping the conventional light-receiving surface is no longer necessary. Since the time is shortened, the measurement time is also shortened.

[Brief explanation of the drawing]

Figure 1 is an external view of the dark box, Figure 2 is a side view of the DUT gripped by hand, and Figure 3 is a side view of the DUT gripped by a robot. In addition, in ImK-, A... the lid of the dark box, B...
...IC socket for DLIT insertion, C...
Optical system, optical control system for D...D U
Light receiving direction of '1', F...DU 'I'. G... Human IM, H...:...1) A part of the robot that holds the UT comes out.

Claims (1)

[Claims] It is used with a dark box that blocks external light by closing the lid, and is equipped with an optical system that changes the amount of light by external control and a socket for a red integrated circuit for attaching and detaching an integrated circuit for an image sensor. a mechanism for opening and closing the lid of the dark box; a mechanism for wiping the light-receiving surface of the integrated circuit outside the dark box; and a mechanism for spraying gas onto the light-receiving surface; and a mechanism for attaching and detaching the integrated circuit to the integrated circuit socket. An automatic attachment/detachment device for an integrated circuit for an image sensor, characterized by comprising: