JPS6044827B2 - electronic components - Google Patents
electronic componentsInfo
- Publication number
- JPS6044827B2 JPS6044827B2 JP52114581A JP11458177A JPS6044827B2 JP S6044827 B2 JPS6044827 B2 JP S6044827B2 JP 52114581 A JP52114581 A JP 52114581A JP 11458177 A JP11458177 A JP 11458177A JP S6044827 B2 JPS6044827 B2 JP S6044827B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- copper foil
- resin
- electronic components
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/701—Tape-automated bond [TAB] connectors
Landscapes
- Casings For Electric Apparatus (AREA)
- Wire Bonding (AREA)
Description
【発明の詳細な説明】
本発明は、テープキャリア方式でしかも樹脂封止され
た半導体素子等の電子部品に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an electronic component such as a semiconductor element that uses a tape carrier method and is sealed with resin.
一般に、電子部品特にＩＣの製造においては、製造原
価の大きな部分がボンディング、組立プロセスで占めら
れており、このプロセスの改善、自動化のために種々の
ボンディング、組立プロセスが考えられてきた。Generally, in the manufacture of electronic components, especially ICs, a large portion of the manufacturing cost is accounted for by bonding and assembly processes, and various bonding and assembly processes have been considered to improve and automate this process.
それらは、従来のワイヤボンドに対しワイヤレ方式は
、ワイヤレスボンディングの一方式であつて、これは金
属ワイヤの代りにビーム状のパターンのついた銅箔（フ
ィンガーリード）を使つてＩＣチップ上のパッド電極部
と外部リードとの間を接続させるもので、ボンディング
速度が従来に比較してきわめて大きく、組立自動化が可
能となり、したがつてＩＣ製造のコストを安くすること
ができる特徴がある。In contrast to conventional wire bonding, wireless bonding is a method of wireless bonding that uses copper foil with a beam-like pattern (finger leads) instead of metal wires to pad the pads on the IC chip. It connects the electrode part and the external lead, and has a feature that the bonding speed is extremely high compared to the conventional method, and assembly automation is possible, thereby reducing the cost of IC manufacturing.
し力士ながら、従来のテープキャリア方式のＩＣは、
第１図に平面図、第２図にその一部拡大最矢視縦断面図
を示すように、ポリイミド（樹脂）フィルム１にラミネ
ートされた面側のフィンガーリード（銅箔２を基材とし
、その表面に錫めつき膜３を設けたもの）表面にＩＣチ
ップ４におけるパッド電極５を１回で同時各点接合し、
それらを樹脂６によつて封止したものである。Although he is a sumo wrestler, the conventional tape carrier type IC is
As shown in FIG. 1 as a plan view and as shown in FIG. 2 as a partially enlarged vertical cross-sectional view, the surface side finger leads laminated to polyimide (resin) film 1 (using copper foil 2 as a base material) The pad electrodes 5 of the IC chip 4 are bonded to each point simultaneously at one time on the surface (with a tinned film 3 provided on the surface),
These are sealed with resin 6.
なお、７は、ソルダーレジストあるいは配線保護用オー
バーレイフィルムで、ポリイミドフィルム１、フィンガ
ーリード２〜３の折り曲げ強度を保つためのものである
。そして、この種のものが外部電子部品（たとえば時計
用モジユールに使用され、ゼブラコネクタを介したＬＣ
Ｄ等）に接続される場合には、オーミツクコンタクト性
を良くするために、露出せるフインガーリード２に金め
つき層８が施されている。そのため、この種の金めつき
層８は、フインガーリード２の銅箔表面に直接フラツシ
ユ金めつきを行なつて形成したものであるため、金めつ
き層８の耐熱性や表面接触抵抗の信頼性が悪い欠点があ
る。Note that 7 is a solder resist or an overlay film for protecting wiring, which is used to maintain the bending strength of the polyimide film 1 and the finger leads 2 and 3. And this kind of thing is used in external electronic components (e.g. watch module, LC via zebra connector)
D, etc.), the exposed finger leads 2 are coated with a gold plating layer 8 in order to improve ohmic contact. Therefore, this type of gold plating layer 8 is formed by flash gold plating directly on the copper foil surface of the finger lead 2, so the heat resistance and surface contact resistance of the gold plating layer 8 are low. It has the drawback of poor reliability.
これは、銅箔２の上に直接金めつきを施したものであり
、ＣＵ−ＡＵ２重層が合金を作りやすいためであると考
えられる。そこで、本発明は、上述する従来の諸欠点を
解消することを目的とするもので、耐熱性およびオーミ
ツクコンタクト性にすぐれたテープキヤリア方式の電子
部品を提供することにある。This is thought to be because gold plating is applied directly onto the copper foil 2, and the CU-AU double layer makes it easy to form an alloy. SUMMARY OF THE INVENTION An object of the present invention is to overcome the above-mentioned conventional drawbacks, and to provide a tape carrier type electronic component with excellent heat resistance and ohmic contact properties.
以下、本発明の好適な実施例を用いて本発明を具体的に
詳述する。Hereinafter, the present invention will be specifically described in detail using preferred embodiments of the present invention.
第３図〜第４図は、本発明の一実施例であるＩＣを示す
図で、第３図は平面図、第４図は第３図の一部拡大品矢
視縦断面図てある。3 and 4 are diagrams showing an IC that is an embodiment of the present invention, with FIG. 3 being a plan view and FIG. 4 being a partially enlarged vertical cross-sectional view taken in the direction of the arrows in FIG. 3.
同図に示すように、本発明にかかるＩＣは、ポリイミド
フイルム１にラミネートされた面側のフインガーリード
（銅箔２を基材とし、その表面に錫めつき膜３を設けた
もの）表面にＩＣチツプ４におけるパツド電極５を１回
で同時多点接合し、それらを樹脂６によつて封止したも
のである。As shown in the figure, the IC according to the present invention has a finger lead (copper foil 2 as a base material and a tinned film 3 provided on the surface) surface side laminated on a polyimide film 1. The pad electrodes 5 of the IC chip 4 are bonded at multiple points simultaneously at one time, and then they are sealed with a resin 6.
７は、ソルダーレジストあるいは配線保護用オーバレイ
フイルムで、ポリイミドフイルム１、フインガーリード
２〜３の折り曲げ強度を保つためのものである。7 is a solder resist or an overlay film for protecting wiring, which is used to maintain the bending strength of the polyimide film 1 and the finger leads 2 and 3.
そして、本発明にかかるフインガーリード２〜３におけ
る外部電子部品と接続される部分は、フインガーリード
２〜３における錫めつき膜３が取り除かれており、基材
である銅箔２表面にニツケルめつき膜９を設けたのち、
その表面に金めつき層１０が設けられておるものである
。The tinned film 3 of the finger leads 2 to 3 is removed from the portions of the finger leads 2 to 3 according to the present invention that are connected to external electronic components, and the surface of the copper foil 2 that is the base material is After providing the nickel plating film 9,
A gold plating layer 10 is provided on its surface.
上述したように、本発明にかかるテープキヤリア方式の
ＩＣは、外部電子部品と接続されるフインガーリードが
、銅箔２を基材とし、その表面にニツケルめつき膜９と
金めつき層１０との二重層膜を設けたものであることに
特徴がある。As described above, in the tape carrier type IC according to the present invention, the finger leads connected to external electronic components are made of copper foil 2 as a base material, and have a nickel plating film 9 and a gold plating layer 10 on the surface thereof. It is characterized by having a double layer membrane.
この種のフインガーリード部は、耐熱性およびオーミツ
クコンタクト性のすぐれたものであり、Ｃｕ−Ｎｉ一Ａ
ｕの３重層構造は耐熱構造でかつ各層間の接着強度の強
いものでオーミツクコンタクト性や表面接触抵抗の極め
て小さなものである。この種フインガーリード部として
は、銅箔を基材とし、その表面の錫めつき膜をはくりし
た状態で、厚膜の錫めつき膜を施こしたもの、はんだめ
つき膜あるいは銀めつき膜等を設けたものであつても、
耐熱性およびオーミツクコンタクト性にすぐれた構造の
ものとすることができる。This type of finger lead part has excellent heat resistance and ohmic contact properties, and is made of Cu-Ni-A.
The three-layer structure of U is a heat-resistant structure with strong adhesive strength between each layer, and has extremely low ohmic contact properties and surface contact resistance. This type of finger lead part is made of copper foil as a base material, with the tin plating film on the surface removed and a thick tin plating film applied, a solder plating film, or a silver plated film. Even if it has a plating film etc.
It can have a structure with excellent heat resistance and ohmic contact properties.
この種テープキヤリア方式のＩＣの製作にあたつては、
従来と同じくＩＣチツプ４をテープキヤリアにボンドし
たのち樹脂封止を行ない、その後、封止樹脂６とソルダ
ーレジストあるいは配線保護用オーバレイフイルム７を
マスクとして、表面が露出するフインガーリード部にお
ける錫めつ”き膜３をエツチング除去したのち、ニツケ
ルめつきと金めつき（無電解めつき法あるいは電解めつ
き法）を順次行なつて製作することができる。When manufacturing this kind of tape carrier type IC,
As in the conventional case, the IC chip 4 is bonded to the tape carrier and then resin-sealed. Then, using the sealing resin 6 and solder resist or overlay film 7 for wiring protection as a mask, tin is applied to the finger leads where the surface is exposed. After removing the coating film 3 by etching, it can be manufactured by sequentially performing nickel plating and gold plating (electroless plating method or electrolytic plating method).
なお、金めつきを電解めつき法にて行なう際には、各フ
インガーリードを相互接続して行なう必要があるが、無
電解めつき法に比して厚膜の金めつき層１０を形成する
ことができる。Note that when gold plating is performed by electrolytic plating, it is necessary to interconnect each finger lead, but compared to electroless plating, it is necessary to form a thick gold plating layer 10. can be formed.
第１図は従来のテープキヤリア方式のＩＣを示す平面図
、第２図は第１図の一部拡大ＡＡ矢視縦・断面図、第３
図は本発明の一実施例であるテープキヤリア方式のＩＣ
を示す平面図、第４図は第３図の一部拡大品矢視縦断面
図である。
１・・・・・ポリイミド（樹脂）フイルム、２・・・・
・・フインガーリードの基材である銅箔、３・・・・・
・錫めつき膜、４・・・・・・ＩＣチツプ、５・・・・
・・パツド電極、６・・・・封止樹脂、７・・・・・・
ソルダーレジストあるいは配線保護用オーバレイフイル
ム、８・・・・・・金めつき層、９・・・・・ニツケル
めつき膜、１０・・・・・・金めつき層。Fig. 1 is a plan view showing a conventional tape carrier type IC, Fig. 2 is a partially enlarged longitudinal/sectional view taken along arrow AA in Fig. 1, and Fig.
The figure shows a tape carrier type IC that is an embodiment of the present invention.
FIG. 4 is a partially enlarged vertical sectional view taken in the direction of arrows in FIG. 3. 1...Polyimide (resin) film, 2...
...Copper foil, which is the base material of finger leads, 3...
・Tin plating film, 4...IC chip, 5...
...Pad electrode, 6...Sealing resin, 7...
Solder resist or overlay film for wiring protection, 8...Gold plating layer, 9...Nickel plating film, 10...Gold plating layer.
Claims (1)
の表面に錫薄膜をもつ個所にて素子チップのパッド電極
が接続されており、それが樹脂封止されてなり、前記樹
脂から露出され、外部電気導体が接続される個所である
前記リードの部分は、銅箔を基材とし、その表面にニッ
ケル薄膜の下層と金薄膜の上層との二重層膜が設けられ
ていることを特徴とする電子部品。1. The copper foil that is the lead of the tape carrier is used as a base material, and the pad electrode of the element chip is connected at a place with a thin tin film on the surface, which is sealed with a resin and exposed from the resin, The portion of the lead to which the external electrical conductor is connected is made of copper foil as a base material, and the surface thereof is provided with a double-layer film consisting of a lower layer of a thin nickel film and an upper layer of a thin gold film. electronic components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP52114581A JPS6044827B2 (en) | 1977-09-26 | 1977-09-26 | electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP52114581A JPS6044827B2 (en) | 1977-09-26 | 1977-09-26 | electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5448166A JPS5448166A (en) | 1979-04-16 |
| JPS6044827B2 true JPS6044827B2 (en) | 1985-10-05 |
Family
ID=14641417
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP52114581A Expired JPS6044827B2 (en) | 1977-09-26 | 1977-09-26 | electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6044827B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6329722B1 (en) * | 1999-07-01 | 2001-12-11 | Texas Instruments Incorporated | Bonding pads for integrated circuits having copper interconnect metallization |
-
1977
- 1977-09-26 JP JP52114581A patent/JPS6044827B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5448166A (en) | 1979-04-16 |
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