JPS604805A - Thickness measuring device - Google Patents
Thickness measuring deviceInfo
- Publication number
- JPS604805A JPS604805A JP11391983A JP11391983A JPS604805A JP S604805 A JPS604805 A JP S604805A JP 11391983 A JP11391983 A JP 11391983A JP 11391983 A JP11391983 A JP 11391983A JP S604805 A JPS604805 A JP S604805A
- Authority
- JP
- Japan
- Prior art keywords
- thermistor
- thickness
- heat
- tip
- probe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 claims abstract description 26
- 238000010438 heat treatment Methods 0.000 claims abstract description 5
- 239000000523 sample Substances 0.000 abstract description 22
- 239000002184 metal Substances 0.000 abstract description 17
- 239000003566 sealing material Substances 0.000 abstract description 13
- 239000011810 insulating material Substances 0.000 abstract description 4
- 238000012360 testing method Methods 0.000 abstract description 2
- 230000006378 damage Effects 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
- 239000000565 sealant Substances 0.000 description 7
- 230000007423 decrease Effects 0.000 description 5
- 239000000945 filler Substances 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000005070 sampling Methods 0.000 description 2
- 238000009423 ventilation Methods 0.000 description 2
- 239000011449 brick Substances 0.000 description 1
- 238000009435 building construction Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- 238000009658 destructive testing Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000006261 foam material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000002747 voluntary effect Effects 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
- G01B7/02—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness
- G01B7/06—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
- Length Measuring Devices With Unspecified Measuring Means (AREA)
Abstract
Description
【発明の詳細な説明】
〔技術分野〕
本発明は、建築物のコンクリートパネル等の間に充填さ
れるシーリング材等の厚みを計測するのに用いられる厚
み計測装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a thickness measuring device used to measure the thickness of a sealant, etc. filled between concrete panels, etc. of a building.
建築物の力也工において、レンガやコンクリートブロッ
ク等を組積する場合、接合部分には、各ブロックの熱膨
張・収縮あるいはそりによって応力が作用するので、こ
の応力を軽減する為に目地か形成される。In building construction, when bricks, concrete blocks, etc. are assembled, stress is applied to the joints due to thermal expansion, contraction, or warping of each block, so joints are formed to reduce this stress. Ru.
この目地部分をシールするために、第１図に示すように
、コンクリート１の間の目地２に、発泡材にてなる充填
材３を充填することが行なわれる。In order to seal this joint, as shown in FIG. 1, the joint 2 between the concrete 1 is filled with a filler 3 made of a foam material.
充填材３は、表面側のシーリング層３ａと基材３ｂの２
層で構成される。シーリンク材３ａは、外観と強度上の
問題から、密度の高い高価な材料か用いられ、また、内
側基材３ｂは、密度が低い多孔性の材料か用いられる。The filler 3 is a sealing layer 3a on the surface side and a base material 3b.
Composed of layers. Due to problems in appearance and strength, the sealing material 3a is made of a dense and expensive material, and the inner base material 3b is made of a porous material with a low density.
この種の充填材３は、シーリング材３ａが一定以上の厚
さを必要とするが、この充填材３が目地２に充填された
後ではコンクリート１て囲まれてしまうので、シーリン
グ材３ａの厚さを目視で計ることはできない。This type of filler 3 requires the thickness of the sealant 3a to be at least a certain level, but after the filler 3 is filled into the joint 2, it is surrounded by the concrete 1, so the thickness of the sealant 3a is It is not possible to measure it visually.
その為、従来では、超音波厚み計等を使用してシーリン
グ材の厚みを計測することが試みられたが、シーリング
材が粘性に富んでおり計測できなかった。この為、従来
では、精度および経済性が悪い破壊試験が、シーリング
材の厚みを計測する唯−の方法であった。Therefore, in the past, attempts have been made to measure the thickness of the sealant using an ultrasonic thickness meter or the like, but the sealant is highly viscous and cannot be measured. For this reason, conventionally, the only method for measuring the thickness of a sealing material has been a destructive test that is not accurate or economical.
本発明の目的は、従来の破壊試験によらなくても、目地
に充填される部材のように、異なる複数の材料を接合し
て形成された部材の各材料の厚みを正確かつ容易に計測
できる厚み計測装置を提供することにある。An object of the present invention is to accurately and easily measure the thickness of each material of a member formed by joining a plurality of different materials, such as a member filled in a joint, without using conventional destructive testing. An object of the present invention is to provide a thickness measuring device.
本発明は、各材料の熱伝導性の差に着目して、自己加熱
機能を備えた感熱素子を先端に有する探針を各材料の接
合面に向けて部材に挿入して、この感熱素子の温度変化
率が各材料の熱伝導性に依存していることから、この温
度変化を検出することによって挿入された探針の先端部
分の材料を検知して、探針の挿入長さより各材料の厚み
を計測しようとするものである。The present invention focuses on the difference in thermal conductivity of each material, and inserts a probe having a heat-sensitive element at the tip with a self-heating function into a member toward the bonding surface of each material. Since the rate of temperature change depends on the thermal conductivity of each material, by detecting this temperature change, the material at the tip of the inserted probe can be detected, and the material of each material can be determined from the insertion length of the probe. The purpose is to measure the thickness.
第２図および３図において、４は、先端に感熱素子とし
てサーミスタ５が装着された探針であり、探針４は、目
地に充填されたシーリング材３の厚みよりも十分に大き
な長さを有する。また、探針４の内部は中草になってお
り、図示しない２本の被覆導線が探針４内に挿入されて
おり、この導線の一端はサーミスタ５に接続されるとと
もに、他端は詳細後述の電気回路に接続されている。In FIGS. 2 and 3, 4 is a probe with a thermistor 5 attached as a heat-sensitive element at the tip, and the probe 4 has a length sufficiently larger than the thickness of the sealant 3 filled in the joint. have Furthermore, the inside of the probe 4 has a hollow structure, and two coated conductive wires (not shown) are inserted into the probe 4, one end of which is connected to the thermistor 5, and the other end of which is connected to the thermistor 5. Connected to the electric circuit described below.
６は、探針４かその内面と接触しないように挿入された
円筒形状の金属管であり、金属管６の先端は、シーリン
グ材３に挿入しやすいように斜めに切断されている。サ
ーミスタ５は、金属管６の先端部にある。７は、サーミ
スタ５か発する熱を金属管６へ伝導させない為の断熱材
であり、断熱イ４７は、探針４のサーミスタ５近傍の部
分と金属管６との間に設けられている。Reference numeral 6 denotes a cylindrical metal tube that is inserted so as not to contact the probe 4 or its inner surface, and the tip of the metal tube 6 is cut diagonally so that it can be easily inserted into the sealing material 3. The thermistor 5 is located at the tip of the metal tube 6. Reference numeral 7 denotes a heat insulating material for preventing heat generated by the thermistor 5 from being conducted to the metal tube 6, and a heat insulating material 47 is provided between a portion of the probe 4 near the thermistor 5 and the metal tube 6.
断熱材７を設ける代わりに、第４図に示すように、サー
ミスタ５を放熱させる多数の通風孔８を、金属管６の先
端部近傍に形成してもよい。Instead of providing the heat insulating material 7, as shown in FIG. 4, a large number of ventilation holes 8 for dissipating heat from the thermistor 5 may be formed near the tip of the metal tube 6.
」−記の構造を有する金属管６が、第１図に示すように
、目地２に充填されたシーリング材３ａの表面に垂直に
挿入され、金属管６先端のサーミスタ５の熱抵抗変化に
より、シーリング材３ａと基材３ｂとの接合位置が検出
される。1, the metal tube 6 having the structure shown in FIG. The joining position between the sealing material 3a and the base material 3b is detected.
第５図には、その抵抗変化を検出する電気回路９が示さ
れている。電気回路９において、サーミスタ５は、抵抗
Ｒ１，Ｒ２，Ｒ３とともにホイートストンブリッジを形
成する。抵抗Ｒ１とサーミスタ５との中継点Ａは、演算
増幅器ｏｐ１の反転入力端子に接続されるとともに、抵
抗Ｒ２と抵抗Ｒ３の中継点Ｂは、演算増幅器ｏｐ１の非
反転入力端子に接続される。そして、サーミスタ５の抵
抗ｋ。FIG. 5 shows an electric circuit 9 for detecting the resistance change. In the electric circuit 9, the thermistor 5 forms a Wheatstone bridge together with resistors R1, R2, R3. A node A between the resistor R1 and the thermistor 5 is connected to the inverting input terminal of the operational amplifier op1, and a node B between the resistor R2 and the resistor R3 is connected to the non-inverting input terminal of the operational amplifier op1. And the resistance k of the thermistor 5.
の変化が、演算増幅器ｏｐ１において、中継点Ａの電位
■Ａと中継点Ｂの電位ＶＢとの間の電位差ＶＢ−■八と
して検出され、電位差ＶＢ−■Ａが、演算増幅器ｏｐ１
から出力される。is detected in the operational amplifier op1 as a potential difference VB-■8 between the potential ■A at the relay point A and the potential VB at the relay point B, and the potential difference VB-■A is detected at the operational amplifier op1.
is output from.
１０は、入力端子が演算増幅器ＯＰ１の出力端子に接続
されたサンプルホールド回路であり、サンプルホールド
回路１０は、タイミングパルスにしたがって一定時間毎
に、入力端子に印加されている電圧■１３−■八をサン
プルして、次のサンプリング時点まで、サンプルした′
電圧をその出力端子に保持する。10 is a sample and hold circuit whose input terminal is connected to the output terminal of the operational amplifier OP1, and the sample and hold circuit 10 detects the voltages 13 to 8 that are applied to the input terminals at regular intervals according to timing pulses. until the next sampling point, the sampled ′
Holds the voltage at its output terminal.
サンプルホールド回路１０の出力端子は、演算増幅器Ｏ
Ｐ２の反転入力端子に接続されるとともに、演算増幅器
ｏｐ２の非反転入力端子には、演算増幅器ＯＰＩの出力
端子が接続される。そして、演算増幅器ＯＰ２では、電
圧ＶＢ−■Ａとそのサンプルリング電圧とが比較されて
、電圧ＶＢ ＶＡの変化率か検出される。The output terminal of the sample and hold circuit 10 is an operational amplifier O.
The output terminal of the operational amplifier OPI is connected to the non-inverting input terminal of the operational amplifier op2. Then, the operational amplifier OP2 compares the voltage VB-■A with its sampling voltage to detect the rate of change of the voltages VB-VA.
以上の回路構成において、金属管６が充填材３に挿入さ
れていない時、ホイーストンブリッジの端１ｃに所定重
圧Ｖ。が印加され、サーミスタ５カ月」己発熱を開始し
ても、この熱はすべて空気中に放熱される。その結果、
サーミスタ５の温度が変化しないので、その低溶に５は
一定であり、第６図に示すよう（乙電圧ＶＢ−ＶＡも一
定である。In the above circuit configuration, when the metal tube 6 is not inserted into the filling material 3, a predetermined heavy pressure V is applied to the end 1c of the Wheatstone bridge. Even if the thermistor starts to generate heat by itself for 5 months, all of this heat is radiated into the air. the result,
Since the temperature of the thermistor 5 does not change, the temperature of the thermistor 5 remains constant, and as shown in FIG. 6, the voltage VB-VA is also constant.
次に、金属管６がシーリング材３ａに一定速度で垂直に
挿入されると、シーリング材３ａの熱伝導率は低いので
、放熱量が少なく、サーミスタ５の温度が自己発熱によ
り上昇し、その抵抗ＲＳが減少する。その結果、Ａ点の
電位■Ａが低下して、電圧ＶＢ−ｖＡが増大する。Next, when the metal tube 6 is vertically inserted into the sealing material 3a at a constant speed, since the thermal conductivity of the sealing material 3a is low, the amount of heat dissipated is small, the temperature of the thermistor 5 rises due to self-heating, and its resistance increases. RS decreases. As a result, the potential ■A at point A decreases and the voltage VB-vA increases.
川に、金属管６の先端が基材３ｂに達して、基材３ｂ中
に進入すると、その熱伝導率はシーリング材３ａよりも
高く、サーミスタ５の放熱量が多くなるので、サーミス
タ５の温度が低下する。その結果、サーミスタ５の抵抗
Ｒｓが増大して、電位ｖＡカ月−昇するので、電圧Ｖｎ
ＶＡが減少する。When the tip of the metal tube 6 reaches the base material 3b and enters the base material 3b, its thermal conductivity is higher than that of the sealing material 3a, and the amount of heat dissipated by the thermistor 5 increases, so the temperature of the thermistor 5 decreases. decreases. As a result, the resistance Rs of the thermistor 5 increases and the potential rises by vA months, so the voltage Vn
VA decreases.
したがって、第６図に示すように、サーミスタ５の抵抗
に逆比例する電圧ＶＢ−■Ａの極点Ｐにおける金属管６
の挿入長さが、シーリング材３ａの厚みに等しい。Therefore, as shown in FIG.
The insertion length of is equal to the thickness of the sealing material 3a.
演算増幅器ＯＰＩの出力変化は、第７図に示すように、
−上述した電圧ＶＢ−■Ａの変化に等しい。また、サン
プルホールダ回路１０の出力は、タイミングパルスが立
」−るまでは、演算増幅器ＯＰ１の出力の前のサンプル
電圧を保持し、タイミングパルスが立」−ると、その時
点の演算増幅器ｏｐ１の出力電圧がサンプルされて、そ
の電圧が保持される。The output change of the operational amplifier OPI is as shown in Fig. 7.
-Equivalent to the change in voltage VB-■A mentioned above. Further, the output of the sample holder circuit 10 holds the sample voltage before the output of the operational amplifier OP1 until the timing pulse is raised, and when the timing pulse is raised, the sample voltage of the operational amplifier OP1 at that point is held. The output voltage is sampled and held.
したがって、演算増幅器ＯＰ１の出力電圧が上昇する極
点Ｐの前では、増幅器ＯＰ１の出力はサンプルホールド
回路１０の出力以上であり、増幅器ＯＰ２の出力電圧が
下降する極点Ｐの後では、増幅器ＯＰ１の出力はサンプ
ルホールド回路１０の出力以下となる。Therefore, before the pole point P where the output voltage of the operational amplifier OP1 increases, the output of the amplifier OP1 is equal to or higher than the output of the sample and hold circuit 10, and after the pole point P where the output voltage of the amplifier OP2 drops, the output of the amplifier OP1 is less than the output of the sample and hold circuit 10.
その結果、増幅器ＯＰ１の出力からサンプルホールド回
路１０の出力を減算する演算増幅器ＯＰ２の出力は、極
点１′の前では正となり、極点Ｐの後では負となる。As a result, the output of the operational amplifier OP2, which subtracts the output of the sample-and-hold circuit 10 from the output of the amplifier OP1, is positive before the pole point 1' and negative after the pole point P.
したがって、演算増幅器ＯＰ２の出力電圧が正から負へ
変化する時点に、金属管６を止めて、充填材３に挿入し
た金属管６の長さを測定すれは、その長さがシーリング
材３ａの厚みに等しい。このようにしてシーリング材３
ａの厚みを計測することができる。Therefore, when the output voltage of the operational amplifier OP2 changes from positive to negative, the metal tube 6 is stopped and the length of the metal tube 6 inserted into the filling material 3 is measured. equal to thickness. In this way, the sealant 3
The thickness of a can be measured.
なお、本発明は、上述したような目地２に充填されたシ
ーリング材３ａの厚み計測だけでなく、熱伝導率が異な
る複数の材料を重ねて形成された部材の各材料の厚みを
計測するのに広く用いることができる。Note that the present invention not only measures the thickness of the sealing material 3a filled in the joint 2 as described above, but also measures the thickness of each material of a member formed by stacking a plurality of materials with different thermal conductivities. It can be widely used.
以」−に詳述したように、木発′明によれば、自己加熱
機能を備えた感熱素子を先端に有する計測棒を、複数の
材質を重ねて形成された部材に挿入し、各材質の熱伝導
間に依存する上記感熱素子の温度変化率を検出して、各
材質の厚みを計測するようにしたので、コンクリート等
を破壊することなく、目地に充填された充填材のシーリ
ング材の厚みを正確かつ容易に計測できる厚み計測装置
を提供することかできる。As detailed below, according to the wood invention, a measuring rod having a heat-sensitive element with a self-heating function at the tip is inserted into a member formed by stacking multiple materials, and each material is The thickness of each material can be measured by detecting the rate of temperature change of the heat-sensitive element, which depends on the heat conduction of the material. It is possible to provide a thickness measuring device that can accurately and easily measure thickness.
＄１図はコンクリートブロックの接合部に設けられた目
地を示す断面図、第２図は本発明の一実施例による計測
棒を示す断ｍ１図、第３図は第２図の側面図、第４図は
断熱材の代わりに垣風孔を設けた金属管を示す側面図、
第５図はこの発明の実ｈｉｌ１例に用いられる電気回路
を示す回路図、第６図はサーミスタ５の温度に比例した
電圧ｖ１３−ｖＡの変１化を示す線図、第７図は演算増
幅器ＯＰ１ 、 ＯＦ２およびサンプルホールド回路１
０の出力を示す線図−Ｃある。
：３１）・・・基材、；３ａ・・・シーリング材、４・
・・探針、５・・・サーミスタ、ｏｐｌ 、 ｏｐ２・
・・演算増幅器、１０・・・→ノーンプルホールド回路
。
特許出願人 ザンスター技研株式会社
代理人りｒ理士青山 葆外１名
第４図
十Ｖｃｃ
第６図
息
第７図
金孤菅ｎ神入軽湯吟凋（挿入速度一定ン手続補正書（峠
１事件の表示
昭和５８年特許願第 １１３９１９ 号２発明の名称
厚み計測装置
３補正をする者
事件との関係 特許出願人
住所 大阪府高槻市明田町７番１号
名称 ザンスター技研株式会社
４代理人
住所 大阪府大阪市東区本町２−１０ 本町ビルト氏名
弁理士（６２１４，）青 山 葆 はかＪ 〈５補正
命令の日付 自 発
６袖正の対象 図 面
７、補正の内容 第７図を別紙のとお９訂正する。
第７図Figure 1 is a cross-sectional view showing a joint provided at a joint of concrete blocks, Figure 2 is a cross-sectional view showing a measuring rod according to an embodiment of the present invention, and Figure 3 is a side view of Figure 2, and Figure 3 is a side view of Figure 2. Figure 4 is a side view showing a metal pipe with ventilation holes instead of insulation.
Fig. 5 is a circuit diagram showing an electric circuit used in a practical example of the present invention, Fig. 6 is a diagram showing a change in the voltage v13-vA proportional to the temperature of the thermistor 5, and Fig. 7 is an operational amplifier. OP1, OF2 and sample hold circuit 1
There is a diagram-C showing the output of 0. :31)...Base material,;3a...Sealing material, 4.
... Probe, 5... Thermistor, opl, op2.
...Operation amplifier, 10...→No-pull hold circuit. Patent Applicant: Zanstar Giken Co., Ltd. Agent: Aoyama, 1 person Display of the case 1982 Patent Application No. 113919 2 Name of the invention Thickness measuring device 3 Person making the correction Relationship to the case Patent applicant address 7-1 Akeda-cho, Takatsuki City, Osaka Name Zanstar Giken Co., Ltd. 4 Address of the agent 2-10 Honmachi, Higashi-ku, Osaka-shi, Osaka Prefecture Honmachi Bild Name Patent Attorney (6214,) Aoyama Haka J 〈5 Date of amendment order Voluntary 6 Subject of correction Drawing 7, Contents of amendment Fig. 7 is attached as attached. Too 9 Correct. Figure 7
Claims (1)
形成された部材の一方の厚みを計測する厚み計測装置で
あって、上記部材に挿入し得る計測針と、計狙）針の先
端部に設けられた、自己加熱機能を有する感熱素子と、
感熱素子の出力信号が急変したことを検出する回路とを
備えたことを特徴とする厚み計測装置。(1) A thickness measuring device that measures the thickness of one of a member formed by stacking at least two materials with different thermal conductivities, including a measuring needle that can be inserted into the member, and a tip of the needle. a heat-sensitive element with a self-heating function provided in the
A thickness measuring device comprising: a circuit for detecting a sudden change in an output signal of a heat-sensitive element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11391983A JPS604805A (en) | 1983-06-23 | 1983-06-23 | Thickness measuring device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11391983A JPS604805A (en) | 1983-06-23 | 1983-06-23 | Thickness measuring device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS604805A true JPS604805A (en) | 1985-01-11 |
| JPH0230645B2 JPH0230645B2 (en) | 1990-07-09 |
Family
ID=14624472
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11391983A Granted JPS604805A (en) | 1983-06-23 | 1983-06-23 | Thickness measuring device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS604805A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114544716A (en) * | 2020-11-24 | 2022-05-27 | 娄底市安地亚斯电子陶瓷有限公司 | A kind of urban pipeline sludge detection equipment, detection method and manufacturing method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5517315A (en) * | 1978-07-24 | 1980-02-06 | Masayuki Ishikawa | Novel 1-phthalazone derivative |
| JPS574501A (en) * | 1980-06-12 | 1982-01-11 | Jeol Ltd | Monitoring device |
| JPS5724842A (en) * | 1980-07-22 | 1982-02-09 | Toa Medical Electronics Co Ltd | Particle analyzing device |
-
1983
- 1983-06-23 JP JP11391983A patent/JPS604805A/en active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5517315A (en) * | 1978-07-24 | 1980-02-06 | Masayuki Ishikawa | Novel 1-phthalazone derivative |
| JPS574501A (en) * | 1980-06-12 | 1982-01-11 | Jeol Ltd | Monitoring device |
| JPS5724842A (en) * | 1980-07-22 | 1982-02-09 | Toa Medical Electronics Co Ltd | Particle analyzing device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114544716A (en) * | 2020-11-24 | 2022-05-27 | 娄底市安地亚斯电子陶瓷有限公司 | A kind of urban pipeline sludge detection equipment, detection method and manufacturing method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0230645B2 (en) | 1990-07-09 |
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