JPS6048252U - lead frame - Google Patents

lead frame

Info

Publication number
JPS6048252U
JPS6048252U JP1983139311U JP13931183U JPS6048252U JP S6048252 U JPS6048252 U JP S6048252U JP 1983139311 U JP1983139311 U JP 1983139311U JP 13931183 U JP13931183 U JP 13931183U JP S6048252 U JPS6048252 U JP S6048252U
Authority
JP
Japan
Prior art keywords
lead frame
metal layer
forming
external lead
semiconductor chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1983139311U
Other languages
Japanese (ja)
Other versions
JPH0143872Y2 (en
Inventor
瑛一 綱島
Original Assignee
松下電子工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 松下電子工業株式会社 filed Critical 松下電子工業株式会社
Priority to JP1983139311U priority Critical patent/JPS6048252U/en
Publication of JPS6048252U publication Critical patent/JPS6048252U/en
Application granted granted Critical
Publication of JPH0143872Y2 publication Critical patent/JPH0143872Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は、従来のリードフレームとこれを用いて形成し
た半導体装置の構造を示す断面図、第２図は、本考案の
リードフレームとこれを用いて形成した半導体装置の構
造を示す断面図である。 １・・・・・・ポリイミドフィルム、２・・・・・・半
導体チップ載置部、３，４・・・・・・外部リード部、
５・・・・・・金属めっき層、６・・・・・・半導体チ
ップ、７・・・・・・金属細線、８・・・・・・被接続
基板、９，１０・・・・・・導体層、１１〜１４・・・
・・・折り曲げ加工部、１５・・・・・・凹所。FIG. 1 is a cross-sectional view showing the structure of a conventional lead frame and a semiconductor device formed using the lead frame, and FIG. 2 is a cross-sectional view showing the structure of the lead frame of the present invention and a semiconductor device formed using the lead frame. It is. 1... Polyimide film, 2... Semiconductor chip mounting part, 3, 4... External lead part,
5...Metal plating layer, 6...Semiconductor chip, 7...Metal thin wire, 8...Connected substrate, 9, 10...・Conductor layer, 11 to 14...
...Bending part, 15...Concavity.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体チップ載置部および外部リード部形成用の金属層
が一方の面上に形成された可撓性絶縁基体の、前記外部
リード部形成用金属層の形成面部分に、９０°以下の２
重折り返し曲げ加工が施されていることを特徴とするリ
ードフレーム。A flexible insulating base on which a metal layer for forming a semiconductor chip mounting part and an external lead part is formed has a 90° angle or less on the surface where the metal layer for forming the external lead part is formed.
A lead frame characterized by double folding and bending.
JP1983139311U 1983-09-08 1983-09-08 lead frame Granted JPS6048252U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983139311U JPS6048252U (en) 1983-09-08 1983-09-08 lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983139311U JPS6048252U (en) 1983-09-08 1983-09-08 lead frame

Publications (2)

Publication Number Publication Date
JPS6048252U true JPS6048252U (en) 1985-04-04
JPH0143872Y2 JPH0143872Y2 (en) 1989-12-19

Family

ID=30312289

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983139311U Granted JPS6048252U (en) 1983-09-08 1983-09-08 lead frame

Country Status (1)

Country Link
JP (1) JPS6048252U (en)

Also Published As

Publication number Publication date
JPH0143872Y2 (en) 1989-12-19

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