JPS605532A - Controlling method of semiconductor resin sealing device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a method for controlling a semiconductor resin encapsulation device used in semiconductor manufacturing.

[Technical background of the invention]

A conventional method of controlling a semiconductor resin sealing device will be explained with reference to FIG. FIG. 1 is a diagram illustrating an outline of a conventional semiconductor resin stabbing device 4 of a type in which the upper die is fixed and the lower die is movable. An upper mold 1 and a lower mold 2 each containing a built-in heater I-I l and H2 are fastened to platens 5a and 5b by a clamper (mold fastening device) 3.4. And heater H,
, H, are connectors 6a, 6b and 7a, respectively.
It is connected to a temperature control device 8 via 7b, whereby the temperatures of the upper mold 1 and the lower mold 2 are controlled to desired values. Here, the connectors 6a and 6b are connected and disconnected by a connector coupling device 9 driven by a hydraulic cylinder or the like, and the connectors 7a and 7b are similarly connected and disconnected by a connector coupling device 10.

Resin encapsulation work using the semiconductor resin encapsulation equipment as described above is
Conventionally, this has been done according to a sealing sequence provided in the control device. That is, the predetermined move 11
According to @, a sealing sequence consisting of driving the mold, heating the heater, etc. is executed by a control device constituted by a relay circuit or a microcomputer.

[Problems with background technology]

However, if the standard, size, etc. of the semiconductor device to be resin-sealed differs, the mold must be replaced with a new mold accordingly. The following operations are usually required to replace the mold. In other words, ■stop the power supply to the heater, ■disconnect the heater, ■unclamp the upper and lower old molds, ■carry the old mold out of the equipment, and ■carry the new mold into the equipment and install it. The following steps are required: ■ Clamping the upper and lower new molds; ■ Connecting the heater; and ■ Supplying power to the heater.

Among the above operations ■ to ■, there are examples of automation in the loading and unloading of new and old molds (■ and ■) by equipping mold transport vehicles with these functions, but other operations are This is done by the operator's main work. As mentioned above, in the past, exchanging the old and new molds (mainly done by an operator's operation) has the disadvantage that exchanging the molds takes a lot of time and reduces the operating rate of the equipment. In particular, in high-volume glaze, small-volume production systems, molds are frequently replaced.
Reducing the time for changing molds is one of the six major challenges in increasing operating rates.

[Purpose of the invention]

The present invention has been made in view of the above-mentioned drawbacks of the prior art, and it is an object of the present invention to provide a method for controlling a semiconductor resin encapsulation device that allows mold replacement without manual intervention.

[Summary of the invention]

In order to achieve the above object, the present invention generates a removal enable signal after unclamping the mold at an unloading position after stopping the power supply and removing the connector connection when removing the mold. The present invention provides a method for controlling a semiconductor resin encapsulation apparatus, in which a mold is clamped, a connector is connected, power is supplied, and a mounting completion signal is generated when a mold is mounted.

[Embodiments of the invention]

An embodiment of the present invention will be described with reference to FIGS. 2 to 4. FIG. 2 is a block diagram of a control device for implementing the control method of the same embodiment, and the same elements as in FIG. 1 are indicated by the same symbols. [Circuit for controlling mold exchange] 0 is a temperature control circuit 9 and connectors 6a, 6b, ? It consists of an attachment/detachment detection device 11 that detects the attachment/detachment state of parts a and 7b, and a sequence control device 12 that controls a series of operations such as a sealing sequence. Ancillary equipment 13-1, 13-2, 13-2, 13-2, 13-2, 13-2, 13-2, 13-2, 13-2, 13-2, 13-2, 13-2, 13-2, 13-2, 13-2, 13-2, 13-2, 13-2, 13-2, 13-2, 13-2, 13-2, 13-2, 13-2, 13-2, 13-2, 13-2, 13-2, 13-2, 13-2, 13-2, 13-2, 13-2, 13-2, 13-2, 13-2, 13-2, 13-2, 13-2, 13-2, 13-2.
n are collectively controlled by the auxiliary control device side 4.

Here, the incidental devices 13-1.13-2. ..., 13-
A signal indicating the operating state of the auxiliary device 13-i is given to the auxiliary control device 14, and the auxiliary control device 14 sends an operating signal to the auxiliary device 13-i, 13-2,...
, 13-n. In addition, an operator's instruction signal inputted from an operation console (not shown) or a remote instruction signal from the auxiliary control device 14 is applied to the sequence control device 2 via a mode changeover switch 15. Ru.

When the mode selector switch is set to A (Lt:I), the operation selection and sequence opening commands are given by the operator. The installation is done at the discretion of the operator. When the mode selector switch 15 selects b;

FIG. 3 is a diagram illustrating in detail the structure of the connectors 6a and 6b of the device shown in FIG. 2, and the same elements as in FIGS. , connectors 7a, 7
There are also 4f and G'l for b. The connector 6a is provided with a corresponding number of U) plugs 16, 17, and a plurality of jacks 18 into which the connector 6bK+t plug 16 is inserted. and,
Two of the jacks 18 are connected to the attachment/detachment detection device 11, and the corresponding plugs 17 are short-circuited to each other. The remaining jack 18 is connected to the temperature control device 8, and the corresponding plug 17 is connected to the heaters us and H□.

The connectors 6a, 6b are coupled and detached by actuating the connector 6b in the direction of the arrow 19 (for example, by driving a hydraulic cylinder).

Next, a mold exchange sequence according to the present invention will be explained with reference to FIG. Figure 4 is a flowchart η of the mold exchange sequence, Figure 4(a) shows mold removal, and Figure 4(a) shows the mold removal.
Figure (b) shows the mold attachment.

First, the sequence for removing the mold will be explained based on FIG. 4(a).

When removal of the mold is specified by the auxiliary control device 14,
Power supply to the upper and lower heaters H, 1-12 is stopped (block 101). Then, the hydraulic cylinder is driven. This causes the connector coupling device 9.10 to operate in reverse,
Seven connectors 6a, 6b, 7a.

7b is detached (block 102).

Next, the lower platen 5b is raised and the upper mold l of the block 103 and the lower mold 2 are layered closely together (block 104,
105).

Next, the clamper 3 is reversely operated to unclamp the upper mold 1 (block 106), and the lower platen 5b is lowered with the upper mold 1 placed on the lower mold 2 (block 107).
), when the lower mold is lowered to the mold unloading position, the lower mold is stopped and the lower mold is unclamped (blocks 108' and 109).

Through the above operations, the upper and lower molds 1 and 2 can be removed, so a removable signal is output. This signal is given to the auxiliary control device 14, which instructs the loading and unloading of the mold. Then, the upper and lower molds 1 and 2 are taken out by a robot, an operator, or the like operated by a command from the auxiliary control device 14.

Next, the sequence of the mold apparatus will be explained based on FIG. 4(b). Note that the cutting mold is carried into a predetermined mounting position by a robot or operator operated by a command from the auxiliary control device 14, and at this time, the auxiliary control device 14 issues a command to start the mold mounting sequence. Ru.

First, operate the clamper 4 to move the lower mold 2 onto the lower platen 5.
(block 2o1) and lower platen 5b.
is raised until the upper surface of the upper mold 1 contacts the upper platen 5a (blocks 202 and 203).

Next, operate the clamper 3 to move the upper mold 1 to the upper platen 5.
a (block 2o4), and operate the connector coupling devices 9, 10 to connect the connectors 6a, 6b, 7a, 7.
b are respectively combined (block 205).

Completion of the connector connection is detected by the attachment/detachment detection device 11, and the heater H is sent to the temperature control device.

, ■, is instructed to supply power (block 206).

Next, the lower platen 5b is lowered to lower the lower mold 2 (block 2o7) and stopped when the resin sealing operation position is reached (blocks 208 and 209). Since the mounting sequence ends as described above, a mounting completion signal is generated (block 21o).

This signal is given to an auxiliary control device, which then performs the resin sealing operation itself.

Although one embodiment has been described above, the control of the connector, the control of power supply to the heater, etc. can be performed on the side of the belt control device. Further, the auxiliary control device can also be configured integrally with a device that controls mold exchange.

[Efficacy of invention]

As described above, according to the present invention, when removing the mold, after stopping the power supply and removing the connector connection, the mold is unclamped at the unloading position, and then a removal enable signal is generated. When using the equipment, after the mold is clamped, the connector is connected and power is supplied before a mounting completion signal is generated, so the semiconductor resin seal can be replaced automatically without manual intervention. A method for controlling a stop device can be obtained. According to the method of the invention,
Mold replacement work can be automated, saving labor and improving safety in resin sealing work. Furthermore, since the resin sealing sequence and mold exchange sequence can be controlled remotely from the outside, communication with auxiliary equipment is easy, and the semiconductor resin sealing apparatus, including mold exchange, can be fully automated.

[Brief explanation of drawings]

FIG. 1 is a diagram illustrating the outline of a conventional semiconductor resin encapsulation device, and FIG. 2 is a diagram showing an actual control method according to an embodiment of the present invention.
FIG. 3 is a diagram illustrating a part of the device shown in FIG. 2 in detail, and FIG. 4 is a flowchart of a control method according to the embodiment. 1.2... Mold 1. Hl, H, ... heater, 3,
4... Clamper, 5a, 5b... Platen, 6a,
6b. 7a, 7b... Connector, 9.10... Connector coupling device, 15... Mode changeover switch, 16.17.
...Plug, 18...Jack. Applicant's agent Seiji Inomata 4 (G,) (b)

Claims (1)

[Scope of Claim] A method for controlling a semiconductor resin encapsulation device comprising a heater to which external power is supplied via a connector, and a stopper mold and a lower mold respectively built into the heater, comprising the steps of: when removing the mold; In this step, the supply of external power is stopped, the connection of the connector is removed, and the upper mold and the lower mold are respectively moved to the unloading position and unclamped,
Next, a mold removable signal is generated, and when mounting the mold, the upper mold and the lower mold are moved to clamp positions and clamped, and then the connector is connected to connect the heater to the outside. provides power,
Next, the method for controlling a semiconductor resin encapsulation apparatus includes moving the upper mold and the lower mold to respective working positions and generating a mold mounting end signal.