JPS6063253A - Phenolic resin molding compound - Google Patents
Phenolic resin molding compoundInfo
- Publication number
- JPS6063253A JPS6063253A JP17133783A JP17133783A JPS6063253A JP S6063253 A JPS6063253 A JP S6063253A JP 17133783 A JP17133783 A JP 17133783A JP 17133783 A JP17133783 A JP 17133783A JP S6063253 A JPS6063253 A JP S6063253A
- Authority
- JP
- Japan
- Prior art keywords
- phenolic resin
- glass fiber
- resin molding
- molding compound
- asbestos
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000005011 phenolic resin Substances 0.000 title claims abstract description 27
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 title claims abstract description 16
- 229920001568 phenolic resin Polymers 0.000 title claims abstract description 16
- 238000000465 moulding Methods 0.000 title claims abstract description 8
- 150000001875 compounds Chemical class 0.000 title abstract 3
- 239000003365 glass fiber Substances 0.000 claims abstract description 14
- 239000012778 molding material Substances 0.000 claims description 17
- -1 Revioly 1- Substances 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 239000010425 asbestos Substances 0.000 abstract description 9
- 229910052895 riebeckite Inorganic materials 0.000 abstract description 9
- 239000000835 fiber Substances 0.000 abstract description 8
- 239000004113 Sepiolite Substances 0.000 abstract 2
- 229910052624 sepiolite Inorganic materials 0.000 abstract 2
- 235000019355 sepiolite Nutrition 0.000 abstract 2
- 239000000654 additive Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 239000000945 filler Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000004898 kneading Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- HCWCAKKEBCNQJP-UHFFFAOYSA-N magnesium orthosilicate Chemical compound [Mg+2].[Mg+2].[O-][Si]([O-])([O-])[O-] HCWCAKKEBCNQJP-UHFFFAOYSA-N 0.000 description 3
- 239000000391 magnesium silicate Substances 0.000 description 3
- 229910052919 magnesium silicate Inorganic materials 0.000 description 3
- 235000019792 magnesium silicate Nutrition 0.000 description 3
- 230000008719 thickening Effects 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- VKYKSIONXSXAKP-UHFFFAOYSA-N hexamethylenetetramine Chemical compound C1N(C2)CN3CN1CN2C3 VKYKSIONXSXAKP-UHFFFAOYSA-N 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000006082 mold release agent Substances 0.000 description 2
- 239000004014 plasticizer Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000011134 resol-type phenolic resin Substances 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- ZWRLWJAFBLTMSQ-UHFFFAOYSA-N Docosa-7,10,14-triensaeure Chemical class C1C(C)=C2CC(C)(C)CC2C(O)C2=COC=C21 ZWRLWJAFBLTMSQ-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical class OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 239000002734 clay mineral Substances 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 235000013312 flour Nutrition 0.000 description 1
- YKASHPSKFYVZRC-UHFFFAOYSA-M furan-2-ylmethyl(trimethyl)azanium;iodide Chemical class [I-].C[N+](C)(C)CC1=CC=CO1 YKASHPSKFYVZRC-UHFFFAOYSA-M 0.000 description 1
- 235000010299 hexamethylene tetramine Nutrition 0.000 description 1
- 239000004312 hexamethylene tetramine Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 229920005610 lignin Polymers 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 235000013379 molasses Nutrition 0.000 description 1
- 239000010680 novolac-type phenolic resin Substances 0.000 description 1
- 229920002866 paraformaldehyde Polymers 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- XQQWBPOEMYKKBY-UHFFFAOYSA-H trimagnesium;dicarbonate;dihydroxide Chemical compound [OH-].[OH-].[Mg+2].[Mg+2].[Mg+2].[O-]C([O-])=O.[O-]C([O-])=O XQQWBPOEMYKKBY-UHFFFAOYSA-H 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【発明の詳細な説明】
［発明の技術分野］
本発明は、充填剤アスベストの代替として、セビオライ
トという４１Ｎ状のケイ酸マグネシウムと、ガラス繊維
とを含有した、耐熱性、機械的強度、電気特性等に優れ
たフェノール樹脂成形材料に関づる。Detailed Description of the Invention [Technical Field of the Invention] The present invention provides a material containing 41N-type magnesium silicate called Seviolite and glass fiber as a substitute for filler asbestos, which has heat resistance, mechanical strength, and electrical properties. Related to phenolic resin molding materials with excellent properties.
［発明の技術的背景とその問題点］
従来からフェノール樹脂は、基材、可塑剤、着色剤、離
型剤等と混練し−Ｃ１成形材料とし−Ｃ幅広く用いられ
ている。 近年、電気部品、自動車部品等の分野にフェ
ノール樹脂成形品が用いられ、厳しい条件下での耐熱性
、機械的強度、電気特性が要求されている。[Technical background of the invention and its problems] Phenol resins have been widely used as -C1 molding materials by kneading them with base materials, plasticizers, colorants, mold release agents, etc. In recent years, phenolic resin molded products have been used in fields such as electrical parts and automobile parts, and are required to have heat resistance, mechanical strength, and electrical properties under severe conditions.
このような特性を満足させるフェノール樹脂成形月利に
は、これまでアスベスト及びガラス繊維が一般的な充填
材として用いられていた。 しかしながら最近では、ア
スベストが作業環境等を悪化させ、かつ人体に対してイ
ｊ害であるという１！Ｉ！由からアスベスト−の使用を
避けることが望まれている。 これらの理由から、アス
ベストフリー材料として種々の方法が検問されている。Up until now, asbestos and glass fiber have been used as general fillers for phenolic resin moldings that satisfy these characteristics. However, recently, it has become clear that asbestos worsens the working environment and is harmful to the human body! I! For these reasons, it is desirable to avoid the use of asbestos. For these reasons, various methods are being investigated as asbestos-free materials.
づなわち、（イ）ガラス繊維のみ用いる、〈口）ガラス
ｍｌとアスベスト以外の無機充填材を用いる、（ハ）ガ
ラス基層と鉱物加工繊維（Ｐ Ｍ Ｆ＝ 。Namely, (a) only glass fiber is used; (c) glass base layer and mineral processed fiber (PMF=) are used.
ミクロフ？イバー、セラミック繊維）を用いる等の方法
がある。Mikulov? There are methods such as using fiber, ceramic fiber).
しかしながら（イ）の方法は、アスベスト、木粉等のよ
うにレジン−フィラー比のバランス（壜粘化）を調整す
るのが容易でなく、また材料としてのかさぼりが大きく
なる欠点がある。 その上混練する場合には作業性が低
下し、射出成形時にはシリンダーおよび金型を著しく摩
耗し、さらに完成した成形品の外観不良をおこづ欠点が
ある。However, method (a) has the disadvantage that it is not easy to adjust the resin-filler ratio balance (bottle viscosity) as with asbestos, wood flour, etc., and the material is bulky. In addition, kneading reduces workability, and during injection molding, cylinders and molds are significantly worn, and the finished molded product has poor appearance.
（ロ）の方法では、ガラス繊維と組合わされる無機質充
填材（例えばシリカ、炭酸カルシウム、タルク、マイカ
粉、クレー等）からなる成形材料は（イ）のごとき欠点
はないものの成形品としての機械的強度が低下し、かつ
耐熱性もやや低下する欠点がある。 （ハ）の方法は（
イ）と（ロ）の中間の特性が得られるもののコスト当り
の機械的強度は小さくなる欠点がある。 このように充
填材としてアスベス１へ以外のものを使用した場合は、
特性上バランスのとれたフェノール樹脂成形材料が望め
ないのが実情であった。In method (b), the molding material consisting of an inorganic filler (for example, silica, calcium carbonate, talc, mica powder, clay, etc.) combined with glass fiber does not have the drawbacks of (b), but it is difficult to machine as a molded product. The disadvantage is that the mechanical strength and heat resistance are slightly reduced. Method (c) is (
Although properties intermediate between (a) and (b) can be obtained, the mechanical strength per unit cost is low. If you use something other than asbeth 1 as a filler like this,
The reality is that a phenolic resin molding material with well-balanced properties cannot be expected.
［発明の目的］
本発明は、上記の実情に鑑みてなされたものでアスベス
トフリーで耐熱性、機械的強度、電気特性に優れたバラ
ンスのよいフェノール樹脂成形材料を提供することを［
１的としている。[Objective of the Invention] The present invention was made in view of the above-mentioned circumstances, and an object of the present invention is to provide a well-balanced phenolic resin molding material that is asbestos-free and has excellent heat resistance, mechanical strength, and electrical properties.
It is considered to be one target.
［発明の概要］
本発明は上記の目的を達成すべく鋭意研究を重ねた結果
、セビオライ１〜という繊維状のケイ酸マグネシウムを
用いることでアスベストと同程度もしくはそれ以上の特
性を有することを見い出したものである。[Summary of the Invention] As a result of intensive research to achieve the above object, the present invention discovered that by using fibrous magnesium silicate called Sevioly 1, it has properties comparable to or better than asbestos. It is something that
即ち、本発明は、フェノール樹脂と、ゼビオライ１〜と
、カラスｌｉ帷とを含有覆ることを特徴とするフェノー
ル樹脂成形材料である。 本発明に用いるフェノール樹
脂は、フェノール、クレゾール等のフｒノール類、又は
糖蜜、リグニン、キシレン、ナフタレン、石油系芳香族
炭化水素による変性フェノール類と、ホルマリン、若し
くはパラホルムアルデヒド類とを適宜のモル比に配合し
、触媒下で反応させたノボラック型フェノール樹脂縮合
物、レゾール型フェノール樹脂縮合物、又はレゾール型
フ１ノール樹脂縮合物とノボラック型フ１ノール樹脂縮
合物の混合物等が挙げられる。That is, the present invention is a phenolic resin molding material containing and covering a phenol resin, Zevioly 1~, and crow li cloth. The phenolic resin used in the present invention is a combination of phenol, furanol such as cresol, or phenol modified with molasses, lignin, xylene, naphthalene, or petroleum aromatic hydrocarbon, and formalin or paraformaldehyde in an appropriate molar amount. Examples include a novolak-type phenol resin condensate, a resol-type phenol resin condensate, or a mixture of a resol-type phenol resin condensate and a novolak-type phenol resin condensate, which are blended in a ratio and reacted under a catalyst.
本発明に用いるセビオライトは、一般に（ト１２０）４
（ＯＨＩＭ ｇ ａＳｉ＋２０ ３ｏ−６〜８１−１
２０
なる化学式を有する繊維状のケイ酸マグネシウムである
。 このセビオライトは繊維長が３−＊ｏμ、繊維径が
０．１μ以内が好ましく、金生興業社で市販されている
。 セビオライトはアスベストのようなＭ（１０と５１
０２がバイメタル状に連なった管状構造（゛はなく、複
鎖式のトンネル構造を持った繊維状多孔質結晶であるた
め、増粘性、吸着性、固結性を兼ねそなえた天然の粘土
鉱物Ｃある。Seviolite used in the present invention is generally (T120)4
(OHIM g aSi+20 3o-6~81-1
It is a fibrous magnesium silicate having the chemical formula: This Seviolite preferably has a fiber length of 3-*oμ and a fiber diameter of 0.1μ or less, and is commercially available from Kinsei Kogyo Co., Ltd. Seviolite is M (10 and 51) like asbestos.
Since it is a fibrous porous crystal with a bimetallic tubular structure (without ゛) and a double-chain tunnel structure, it is a natural clay mineral C that has thickening, adsorption, and caking properties. be.
これらの特徴によってセビオライ１〜はアスベストと同
程度の特性を有すると考えられる。 セビオライ［・の
配合量は成形材料に対して１０〜５０重量％含有するこ
とが好ましい。 より好ましくは１５〜３５重■％であ
る。 配合量が１０重最％未満ではレジン−フィラー比
のバランス（増粘性）が低下し、かつｌｊクラス維の金
属との摩耗が犬さく好ましくない。 ま１ζ５０重最％
を超えると増粘効果が大きくなり、成形時に月利の流動
性が悪くなり好ましくない。 本発明に用いるガラス繊
維は２〜２０μ径の単繊維が収束されたストランドを０
．１〜２５ｍｍに切断したもの等が挙げられる。 ガラ
ス繊維の配合量は、成形材料に対して１０〜３０重量％
がよく、好ましくは１５〜２５重葦％である。 １０重
量％未）１４では機械的強電が低下し、３０車ｍ％を超
えるど混練時の作業性が悪化しまた金型の摩耗が大ぎく
なり好ましくない。 よつ（前記の範囲に限定される。Due to these characteristics, Sevioly 1~ is considered to have properties comparable to asbestos. It is preferable that Seviolye is added in an amount of 10 to 50% by weight based on the molding material. More preferably, it is 15 to 35% by weight. If the blending amount is less than 10% by weight, the balance of the resin-filler ratio (thickening property) will deteriorate, and the abrasion of the lj class fibers with the metal will be extremely undesirable. Ma1ζ50 weight maximum%
Exceeding this is not preferable since the thickening effect becomes large and the fluidity of the monthly rate deteriorates during molding. The glass fiber used in the present invention is a strand of single fibers with a diameter of 2 to 20μ.
．． Examples include those cut into 1 to 25 mm. The amount of glass fiber blended is 10 to 30% by weight based on the molding material.
The content is preferably 15 to 25%. If the amount is less than 10% by weight), the mechanical strength decreases, and if it exceeds 30% by weight, the workability during kneading deteriorates and the wear of the mold increases, which is not preferable. Yotsu (limited to the above range)
本発明の成形材料は前記の他に必要に応じ、硬化剤、着
色剤、硬化促進剤、難燃剤、離形剤、滑剤、カップリン
グ処理剤、可塑剤等を配合りることかできる。In addition to the above, the molding material of the present invention may contain a curing agent, a coloring agent, a curing accelerator, a flame retardant, a mold release agent, a lubricant, a coupling agent, a plasticizer, etc., if necessary.
本発明の）〕ノール樹脂成形祠斜は、通常法のようにし
で製造される。The knoll resin molded gutter of the present invention is manufactured in a conventional manner.
まず所定量のフェノール樹脂、セピＡライ１−、ガラス
繊維、その他必要に応じて添加剤を）昆合し均一に分散
させた後、混練機で加熱混練し、次いで冷却固化さｌて
粉砕機で適当な大ぎさにわ）砕してフェノール樹脂成形
材料とする。First, a predetermined amount of phenol resin, Sepi-A-Ly 1-, glass fiber, and other additives as required) are mixed and uniformly dispersed, then heated and kneaded in a kneader, then cooled and solidified, and then crushed in a pulverizer. Crush it to an appropriate size) and use it as a phenolic resin molding material.
［発明の効果］
本発明のフェノール樹脂成形月利は、アスベストフリー
にもかかわらず耐熱性が高く、機械的強度が大きく、電
気特性及び耐摩耗性に優れた、極めてバランスの良い成
形材料である。[Effects of the invention] The phenolic resin molding material of the present invention is an extremely well-balanced molding material that has high heat resistance, high mechanical strength, excellent electrical properties and abrasion resistance despite being asbestos-free. .
し発明の実施例］
以下、本発明を実施例により具体的に説明するが、本発
明はこれらの実施例によって限定されるものではない。Examples of the Invention] Hereinafter, the present invention will be specifically explained with reference to Examples, but the present invention is not limited to these Examples.
以下１％」とは１重量％」を意味覆る。``1% or less'' means 1% by weight.
実施例 １
ノボラック型ノ１ノール樹脂４５％、ヘキザメチレンテ
１〜ラミン７％、ガラス繊維２０％、セビオライ１〜２
０％、その他添加剤８％を常温で混合し、９０〜１１０
℃で混練しで冷却したのち、粉砕してフェノール樹脂成
形月利を得た。 この成形材料を用い、圧縮成形及び射
出成形で１７０℃に加熱した金型中に成形硬化さけて成
形品とした。 得られた成形品についてその特性を試験
したので第１表に示した。Example 1 45% novolac-type nol resin, 7% hexamethylenete 1-lamin, 20% glass fiber, Sevioly 1-2
0% and other additives 8% are mixed at room temperature, 90-110
After kneading and cooling at ℃, the mixture was pulverized to obtain a phenol resin molding product. Using this molding material, a molded product was obtained by compression molding and injection molding in a mold heated to 170° C. while avoiding mold hardening. The properties of the obtained molded articles were tested and are shown in Table 1.
実施例 ２
レゾール型フェノール樹脂５０％、ガラス繊維２０％、
セビオライト２５％、その他添加剤５％を実施例１と同
様に操作処理してフェノール樹脂成形月利を得た。 次
いで実施例１と同様に成形品となし、その特性を試験し
たので第１表に示した。Example 2 50% resol type phenolic resin, 20% glass fiber,
25% of Seviolite and 5% of other additives were treated in the same manner as in Example 1 to obtain a phenol resin molding yield. Next, a molded article was made in the same manner as in Example 1, and its properties were tested and are shown in Table 1.
比較例 １
ノボラック型フェノール樹脂４５％、ヘキザメチレンテ
トラミン７％、ガラス繊維２０％、炭酸ノＪルシウム２
０％、その他添加剤８％を実施例１と同様に操作処理し
てフェノール樹脂成形材料を得た。Comparative Example 1 45% novolac type phenolic resin, 7% hexamethylenetetramine, 20% glass fiber, 2 lucium carbonate
A phenolic resin molding material was obtained by processing in the same manner as in Example 1 using 0% and 8% of other additives.
次いで実施例１と同様にして成形品となし、その特性を
試験したので第１表に示した。Next, a molded article was made in the same manner as in Example 1, and its properties were tested and are shown in Table 1.
比較例 ２
レゾール型フェノール樹脂５０％、ガラス１ｊ１４５％
、その他添加剤５％を比較例１と同様に操作処理してフ
ェノール樹脂成形材料を得た。 次いで比較例１と同様
に成形品となし、その特性を試験し７ｊので第１表に示
した。Comparative example 2 50% resol type phenolic resin, 145% glass 1j
, and 5% of other additives were treated in the same manner as in Comparative Example 1 to obtain a phenolic resin molding material. Next, a molded article was made in the same manner as in Comparative Example 1, and its properties were tested and the results are shown in Table 1.
第１表
第１表から明らかなように、本発明のフェノール樹脂成
形材料は比較例に比べて優れて（Ｘることが確認できた
。As is clear from Table 1, it was confirmed that the phenolic resin molding material of the present invention was superior to the comparative example.
Claims (1)
とを含有づることを特徴とするフェノール樹脂成形月利
。 ２ セビオライトの含有率が１０〜５０重量％、ガラス
ｖＡ組の含有率が１０〜３０重量％である特許請求の範
囲第１項記載のフェノール樹脂成形月利。[Scope of Claims] 1. A phenol resin molding product characterized by containing a phenol resin, Revioly 1-, and glass fiber. 2. The phenolic resin molding material according to claim 1, wherein the content of Seviolite is 10 to 50% by weight, and the content of glass vA group is 10 to 30% by weight.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17133783A JPS6063253A (en) | 1983-09-19 | 1983-09-19 | Phenolic resin molding compound |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17133783A JPS6063253A (en) | 1983-09-19 | 1983-09-19 | Phenolic resin molding compound |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6063253A true JPS6063253A (en) | 1985-04-11 |
Family
ID=15921350
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17133783A Pending JPS6063253A (en) | 1983-09-19 | 1983-09-19 | Phenolic resin molding compound |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6063253A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0269510A (en) * | 1988-09-02 | 1990-03-08 | Matsushita Electric Works Ltd | Molding material of phenolic resin |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51106155A (en) * | 1975-03-15 | 1976-09-20 | Matsushita Electric Works Ltd | TAINETSUSEIDANNETSUSEIKEIHIN |
| JPS53113196A (en) * | 1977-03-11 | 1978-10-03 | Takeda Chemical Industries Ltd | Noncombustible material |
-
1983
- 1983-09-19 JP JP17133783A patent/JPS6063253A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51106155A (en) * | 1975-03-15 | 1976-09-20 | Matsushita Electric Works Ltd | TAINETSUSEIDANNETSUSEIKEIHIN |
| JPS53113196A (en) * | 1977-03-11 | 1978-10-03 | Takeda Chemical Industries Ltd | Noncombustible material |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0269510A (en) * | 1988-09-02 | 1990-03-08 | Matsushita Electric Works Ltd | Molding material of phenolic resin |
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