JPS6071196U - Heat dissipation structure of electronic equipment package - Google Patents

Heat dissipation structure of electronic equipment package

Info

Publication number
JPS6071196U
JPS6071196U JP16374983U JP16374983U JPS6071196U JP S6071196 U JPS6071196 U JP S6071196U JP 16374983 U JP16374983 U JP 16374983U JP 16374983 U JP16374983 U JP 16374983U JP S6071196 U JPS6071196 U JP S6071196U
Authority
JP
Japan
Prior art keywords
heat dissipation
dissipation structure
electronic equipment
equipment package
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16374983U
Other languages
Japanese (ja)
Inventor
小井詰　善孝
高萩　富夫
Original Assignee
東洋通信機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東洋通信機株式会社 filed Critical 東洋通信機株式会社
Priority to JP16374983U priority Critical patent/JPS6071196U/en
Publication of JPS6071196U publication Critical patent/JPS6071196U/en
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案に係る電子機器パッケージの構１・・・
・・・パワ・トランジスタ、７・・・・・・台座、１０
・・・・・・固定部材、９・・・・・・パッケージ（シ
ャーシ）、１１・・・・・・蓋体。Figure 1 shows the structure 1 of an electronic device package according to the present invention...
...Power transistor, 7...Pedestal, 10
...Fixing member, 9...Package (chassis), 11...Lid body.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 所に固定すると共に前記固定部材を前記パッケージの蓋
体に密着することによって前記蓋体表面から前記高発熱
部品が発生する熱を放散せしめるようにしたことを特徴
とする電子機器パッケージの放熱構造。1. A heat dissipation structure for an electronic device package, characterized in that the fixing member is fixed in place and the fixing member is brought into close contact with the lid of the package, thereby dissipating heat generated by the high heat generation component from the surface of the lid.
JP16374983U 1983-10-21 1983-10-21 Heat dissipation structure of electronic equipment package Pending JPS6071196U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16374983U JPS6071196U (en) 1983-10-21 1983-10-21 Heat dissipation structure of electronic equipment package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16374983U JPS6071196U (en) 1983-10-21 1983-10-21 Heat dissipation structure of electronic equipment package

Publications (1)

Publication Number Publication Date
JPS6071196U true JPS6071196U (en) 1985-05-20

Family

ID=30359196

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16374983U Pending JPS6071196U (en) 1983-10-21 1983-10-21 Heat dissipation structure of electronic equipment package

Country Status (1)

Country Link
JP (1) JPS6071196U (en)

Similar Documents

Publication Publication Date Title
JPS59187153U (en) Parts cooling structure
JPS6018550U (en) Heat dissipation structure
JPS6113947U (en) Semiconductor heat dissipation equipment for audio products
JPS5942098U (en) Heat sink mounting device
JPS5929048U (en) Heatsink mounting structure for semiconductor components
JPS5961542U (en) Heat dissipation device for electrical equipment
JPS58114050U (en) Power IC mounting device
JPS58116235U (en) Heat dissipation device for electronic components
JPS5929047U (en) Heat dissipation device using speaker yoke
JPS5926253U (en) hybrid integrated circuit
JPS60109332U (en) Hybrid integrated circuit device
JPS5933342U (en) Chassis base structure
JPS58148989U (en) Chassis device
JPS585394U (en) Heat dissipation device for electrical equipment
JPS58116236U (en) hybrid integrated circuit
JPS6122394U (en) Cooling device inside the package
JPS58147256U (en) power hybrid integrated circuit
JPS5965542U (en) Power transistor insulation mounting device
JPS6063980U (en) Chip carrier package structure
JPS6049639U (en) Cooling fins for semiconductor devices
JPS6014002U (en) embedded hardware
JPS58193417U (en) Power cable heat sink
JPS59158337U (en) Cooling device for power semiconductors
JPS60158795U (en) Heat dissipation device for electrical equipment
JPS58135957U (en) semiconductor equipment