JPS6073321A - optical sensor device - Google Patents

optical sensor device

Info

Publication number
JPS6073321A
JPS6073321A JP18027983A JP18027983A JPS6073321A JP S6073321 A JPS6073321 A JP S6073321A JP 18027983 A JP18027983 A JP 18027983A JP 18027983 A JP18027983 A JP 18027983A JP S6073321 A JPS6073321 A JP S6073321A
Authority
JP
Japan
Prior art keywords
optical sensor
polyimide resin
sensor device
insulating film
glass substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18027983A
Other languages
Japanese (ja)
Inventor
Susumu Saito
進 斉藤
Ryoji Oritsuki
折付 良二
Hiromi Kanai
紘美 金井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP18027983A priority Critical patent/JPS6073321A/en
Publication of JPS6073321A publication Critical patent/JPS6073321A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 すに係り、特に多層配線絶縁膜としてのボリイミにおけ
る多層配線にポリイミド樹脂を用いたものがある。この
ような従来のものではポリイミド樹脂塗布の直前にアル
ミキレート処理を行なっていたが、異物等によるポリイ
ミド樹脂の膜欠陥が多く、B6ラインセンサのように大
面積を必要とす絶縁膜との密着性が良い光センサデバイ
スを提供2ス基板上にAt2Q3をペースコートし、こ
の上に下部配線を行なった後、ポリイミド樹脂絶縁膜間
する。
DETAILED DESCRIPTION OF THE INVENTION In particular, polyimide resin is used for multilayer wiring in polyimide as a multilayer wiring insulating film. In such conventional products, aluminum chelate treatment was performed immediately before applying polyimide resin, but there were many defects in the polyimide resin film due to foreign particles, etc., and it was difficult to adhere to the insulating film, which requires a large area like the B6 line sensor. Providing an optical sensor device with good performance. After coating At2Q3 on a 2-substrate and forming lower wiring thereon, a polyimide resin insulating film is interposed.

スパッター装置によシ、ガラス基板1上にAt20Bベ
ースコート2を150OAの厚さに付け、続イてcrを
250OAの厚さに付ける。このCrで下部配線3を形
成する。さらにこの上にポリイミド樹脂を塗布し、23
0℃で乾燥して絶縁B4を形成した後350℃で熱硬化
させる。ポリイミド樹脂絶縁膜4の上にAtを1μmの
厚さで蒸着し、−ヒ部配線5ことによシガラス基板とポ
リイミド樹脂絶縁膜との密着性を良くシ、且つポリイミ
ド樹脂膜を無欠陥で大面積化できる効果がある。
Using a sputtering device, an At20B base coat 2 is applied to a thickness of 150 OA on a glass substrate 1, and then a CR is applied to a thickness of 250 OA. The lower wiring 3 is formed using this Cr. Furthermore, polyimide resin is applied on top of this, and 23
After drying at 0°C to form insulation B4, it is thermally cured at 350°C. At is deposited to a thickness of 1 μm on the polyimide resin insulating film 4 to improve the adhesion between the glass substrate and the polyimide resin insulating film, and to form the polyimide resin film without defects. It has the effect of increasing the area.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の光センサデノ(イスにおける多層配線
部の平面図、第2図は第1図のA−A’の断面図である
。 1・・・・ガラス基板、2・・・・AA203ベースコ
ート、3・・・・下部配線、4・・・Φポリイミド樹脂
絶縁膜、5・・・・上部配m。 代理人 弁理士 高 橋 −〜 夫 7・ \。 (、;′ 第1II 第2図
FIG. 1 is a plan view of a multilayer wiring section in an optical sensor denomination (chair) of the present invention, and FIG. 2 is a cross-sectional view taken along line AA' in FIG. 1. 1...Glass substrate, 2... AA203 base coat, 3... lower wiring, 4... Φ polyimide resin insulating film, 5... upper wiring m. Agent: Patent Attorney Takahashi - ~ Husband 7. \. (,;' 1st II. Figure 2

Claims (1)

【特許請求の範囲】[Claims] ガラス基板上にAt203をペースコートし、その上に
絶縁膜としてポリイミド樹脂膜を形成する多層配線構造
を有することを特徴とする光センサデバイス。
An optical sensor device characterized by having a multilayer wiring structure in which At203 is paste-coated on a glass substrate and a polyimide resin film is formed as an insulating film thereon.
JP18027983A 1983-09-30 1983-09-30 optical sensor device Pending JPS6073321A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18027983A JPS6073321A (en) 1983-09-30 1983-09-30 optical sensor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18027983A JPS6073321A (en) 1983-09-30 1983-09-30 optical sensor device

Publications (1)

Publication Number Publication Date
JPS6073321A true JPS6073321A (en) 1985-04-25

Family

ID=16080440

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18027983A Pending JPS6073321A (en) 1983-09-30 1983-09-30 optical sensor device

Country Status (1)

Country Link
JP (1) JPS6073321A (en)

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