JPS607496Y2 - semiconductor equipment - Google Patents
semiconductor equipmentInfo
- Publication number
- JPS607496Y2 JPS607496Y2 JP19029080U JP19029080U JPS607496Y2 JP S607496 Y2 JPS607496 Y2 JP S607496Y2 JP 19029080 U JP19029080 U JP 19029080U JP 19029080 U JP19029080 U JP 19029080U JP S607496 Y2 JPS607496 Y2 JP S607496Y2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- cavity
- peripheral edge
- cap
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
【考案の詳細な説明】
本考案は、半導体チップを搭載した基板をキャップ内に
挿入し接着用樹脂材で接着した半導体装置に関するもの
である。[Detailed Description of the Invention] The present invention relates to a semiconductor device in which a substrate on which a semiconductor chip is mounted is inserted into a cap and bonded with an adhesive resin material.
第１図は本考案に係るプラグ・イン・タイプのパッケー
ジの半導体装置の断面図である。FIG. 1 is a sectional view of a semiconductor device in a plug-in type package according to the present invention.
１はセラミックの基板で表面に半導体チップ２が搭載さ
れ、裏面に外部端子３が垂直に設けられている。A ceramic substrate 1 has a semiconductor chip 2 mounted on its front surface and external terminals 3 vertically provided on its back surface.
半導体チップ２はワイヤー４により基板１の表面の内部
リード５を介して外部端子３に導通している。The semiconductor chip 2 is electrically connected to an external terminal 3 via a wire 4 and an internal lead 5 on the surface of the substrate 1 .
６はキャップでその空洞は基板１の外周に略一致してお
り、基板１をその空洞内に挿入し接着用の樹脂材７によ
り接着することにより半導体チップ１は封止される。Reference numeral 6 denotes a cap whose cavity substantially coincides with the outer periphery of the substrate 1, and the semiconductor chip 1 is sealed by inserting the substrate 1 into the cavity and bonding it with an adhesive resin material 7.
ところでこの接着か、基板１とキャップ６との間にエポ
キン系樹脂材を置き、高温状態にして樹脂材を軟化せし
め、基板１の自重又は基板１への荷重により基板１をキ
ャップ６の空洞内に挿入し沈み込ませて行なっている。By the way, by this adhesion, an Epoquin resin material is placed between the substrate 1 and the cap 6, the resin material is softened in a high temperature state, and the substrate 1 is moved into the cavity of the cap 6 due to the weight of the substrate 1 or the load on the substrate 1. This is done by inserting it into the tube and letting it sink.
その場合生じる問題として、各部品の寸法のばらつき、
基板１の空洞内への沈み込み量のばらつき及び樹脂材の
量のばらつき等により、第１図に示す８の如き樹脂材の
未充填や９の如き外への流れ出しが生じることがある。Problems that arise in this case include variations in the dimensions of each part,
Due to variations in the amount of sinking of the substrate 1 into the cavity, variations in the amount of the resin material, etc., the resin material may not be filled as shown in 8 in FIG. 1, or may flow out as shown in 9.
特にキャップ６の空洞周囲と基板１の外周とは略一致し
といるための前記の種々のばらつきの調整は非常に困難
なものである。In particular, it is very difficult to adjust the various variations described above so that the circumference of the cavity of the cap 6 and the outer circumference of the substrate 1 substantially coincide with each other.
そこで本考案は、前述にばらつきが少々あっても樹脂材
の未充填が流れ出しが生じないような新規な構造を提供
することを目的とし、その特徴は、表面に半導体チップ
が搭載され裏面に垂直に外部端子が設けられた基板と、
該基板の外周に略一致する空洞を有するキャップとを備
えた、該キャップの該空洞内に該基板が挿入され、該空
洞内に充填された接着材により該空洞の入口周縁部と該
基板の裏面側周縁部とが略一致するように接着されてな
る半導体装置において、
前記基板お裏面側周縁部及び又は前記キャップの空洞の
入口周縁部に前記接着材のにげ部を有してなることにあ
る。Therefore, the purpose of this invention is to provide a new structure in which the unfilled resin material will not flow out even if there is a slight variation in the above.The feature is that the semiconductor chip is mounted on the front surface and the back surface is vertical. a board provided with external terminals;
the substrate is inserted into the cavity of the cap, and an adhesive filled in the cavity connects the entrance periphery of the cavity with the substrate. In a semiconductor device in which a peripheral edge of the back side of the substrate is bonded so as to substantially coincide with the peripheral edge of the back side of the substrate, a stub of the adhesive material is provided at the peripheral edge of the back side of the substrate and/or at the peripheral edge of the entrance of the cavity of the cap. It is in.
以下本考案の壱実施例を図面に従って詳述する。Hereinafter, a first embodiment of the present invention will be described in detail with reference to the drawings.
第２図は本考案の一実施例を示す部分断面図である。FIG. 2 is a partial sectional view showing an embodiment of the present invention.
ａは基板１の裏面側の周縁部に接着用樹脂材のにげ部１
０を設けた例である。a is a ridged part 1 of the adhesive resin material on the peripheral edge of the back side of the substrate 1;
This is an example in which 0 is set.
ｂはキャップ１の空洞の入口周縁部を外側にまげてにげ
部１１とした例である。b is an example in which the peripheral edge of the entrance of the cavity of the cap 1 is bent outward to form a ridged portion 11.
もちろんａ、ｂの両方を施こしてもよい。Of course, both a and b may be performed.
この様に基板１の裏面側の周縁部及び又はキャップ１の
空洞の入口周縁部にげ部１０゜１１を設けることにより
、前述した種々のばらつきが少々あっても接着用樹脂材
７の未充填や流れ出しは生じない。In this way, by providing the stubs 10° 11 at the peripheral edge of the back side of the substrate 1 and/or at the peripheral edge of the entrance of the cavity of the cap 1, even if there are slight variations in the various types described above, the adhesive resin material 7 can be prevented from being unfilled. No leakage occurs.
以上説明した様に本考案によれば接着用樹脂材７の未充
填が流れを防止することができ、製品の信頼性を向上す
ることができる。As explained above, according to the present invention, the unfilled adhesive resin material 7 can be prevented from flowing, and the reliability of the product can be improved.
第１図は従来の半導体装置の断面図、第２図ａ、ｂは本
考案の一実施例を示す部分断面図である。
図中、１・・・・・・基板、２・・・・・・半導体チッ
プ、３・・・・・・外部端子、６・・・キャップ、７・
・・・・・接着材、１０．１１・・・・・・にげ部。FIG. 1 is a sectional view of a conventional semiconductor device, and FIGS. 2a and 2b are partial sectional views showing an embodiment of the present invention. In the figure, 1...Substrate, 2...Semiconductor chip, 3...External terminal, 6...Cap, 7...
...Adhesive material, 10.11...Negative part.
Claims (1)
設けられた基板と、該基板の外周に略一致する空洞を有
するキャップとを備え、該キャップの該空洞内に該基板
が挿入され、該空洞内に充填された接着材により該空洞
の入口周縁部と該基板の裏面側周縁部とが略一致するよ
うに接着されてなる半導体装置において、 前記基板の裏面側周縁部及び前記キャップの空洞の入口
周縁部に前記接着材のにげ部を有してなることを特徴と
する半導体装置。[Claims for Utility Model Registration] A substrate having a semiconductor chip mounted on its front surface and external terminals provided vertically on its back surface, and a cap having a cavity that substantially coincides with the outer periphery of the substrate; In a semiconductor device, the substrate is inserted into the cavity and bonded with an adhesive filled in the cavity so that the peripheral edge of the entrance of the cavity and the peripheral edge of the back side of the substrate substantially coincide with each other, the back side of the substrate A semiconductor device characterized in that the semiconductor device has a stub of the adhesive on a side peripheral edge and an entrance peripheral edge of the cavity of the cap.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19029080U JPS607496Y2 (en) | 1980-12-29 | 1980-12-29 | semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19029080U JPS607496Y2 (en) | 1980-12-29 | 1980-12-29 | semiconductor equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57113449U JPS57113449U (en) | 1982-07-13 |
| JPS607496Y2 true JPS607496Y2 (en) | 1985-03-13 |
Family
ID=29994658
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19029080U Expired JPS607496Y2 (en) | 1980-12-29 | 1980-12-29 | semiconductor equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS607496Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5386910B2 (en) * | 2008-09-26 | 2014-01-15 | 株式会社デンソー | Electronic circuit equipment |
-
1980
- 1980-12-29 JP JP19029080U patent/JPS607496Y2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57113449U (en) | 1982-07-13 |
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