JPS6077337A - Fluorescent character display tube - Google Patents
Fluorescent character display tubeInfo
- Publication number
- JPS6077337A JPS6077337A JP18542683A JP18542683A JPS6077337A JP S6077337 A JPS6077337 A JP S6077337A JP 18542683 A JP18542683 A JP 18542683A JP 18542683 A JP18542683 A JP 18542683A JP S6077337 A JPS6077337 A JP S6077337A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- insulating film
- substrate
- display tube
- fluorescent display
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 25
- 239000011230 binding agent Substances 0.000 claims abstract description 5
- 239000003086 colorant Substances 0.000 claims abstract description 5
- 239000011521 glass Substances 0.000 claims description 27
- 229910052783 alkali metal Inorganic materials 0.000 claims description 5
- 150000001340 alkali metals Chemical class 0.000 claims description 5
- 230000001681 protective effect Effects 0.000 abstract description 6
- 239000000919 ceramic Substances 0.000 abstract description 4
- 239000003822 epoxy resin Substances 0.000 abstract description 4
- 229920000647 polyepoxide Polymers 0.000 abstract description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract description 3
- 239000012535 impurity Substances 0.000 abstract description 3
- 239000000203 mixture Substances 0.000 abstract description 3
- 229910052782 aluminium Inorganic materials 0.000 abstract description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052751 metal Inorganic materials 0.000 abstract description 2
- 239000002184 metal Substances 0.000 abstract description 2
- 229910044991 metal oxide Inorganic materials 0.000 abstract description 2
- 150000004706 metal oxides Chemical class 0.000 abstract description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 2
- 239000004411 aluminium Substances 0.000 abstract 1
- 229910052681 coesite Inorganic materials 0.000 abstract 1
- 229910052906 cristobalite Inorganic materials 0.000 abstract 1
- 239000000377 silicon dioxide Substances 0.000 abstract 1
- 235000012239 silicon dioxide Nutrition 0.000 abstract 1
- 229910052682 stishovite Inorganic materials 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
- 229910052905 tridymite Inorganic materials 0.000 abstract 1
- 238000000576 coating method Methods 0.000 description 12
- 239000011248 coating agent Substances 0.000 description 10
- 230000007257 malfunction Effects 0.000 description 9
- 239000004065 semiconductor Substances 0.000 description 7
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910001415 sodium ion Inorganic materials 0.000 description 2
- 241000972773 Aulopiformes Species 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 235000019506 cigar Nutrition 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000006059 cover glass Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010828 elution Methods 0.000 description 1
- 230000004313 glare Effects 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 235000019515 salmon Nutrition 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J31/00—Cathode ray tubes; Electron beam tubes
- H01J31/08—Cathode ray tubes; Electron beam tubes having a screen on or from which an image or pattern is formed, picked up, converted, or stored
- H01J31/10—Image or pattern display tubes, i.e. having electrical input and optical output; Flying-spot tubes for scanning purposes
- H01J31/12—Image or pattern display tubes, i.e. having electrical input and optical output; Flying-spot tubes for scanning purposes with luminescent screen
- H01J31/15—Image or pattern display tubes, i.e. having electrical input and optical output; Flying-spot tubes for scanning purposes with luminescent screen with ray or beam selectively directed to luminescent anode segments
Landscapes
- Vessels, Lead-In Wires, Accessory Apparatuses For Cathode-Ray Tubes (AREA)
- Cathode-Ray Tubes And Fluorescent Screens For Display (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は蛍光表示管に関し、表示パイルと半導体素子か
ら成る駆動回路部とが同一ガラス基板上に一体形成され
た通称「チップ・オン・グラス（Ｃｈｉｐ ｏｎ Ｇｌ
ａｓｓ） Ｊ （以下ＣＯＧと称す）の構造を有する蛍
光表示管に関するもので、特に半導体素子の封止構造に
関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a fluorescent display tube, commonly called a "chip on glass", in which a display pile and a drive circuit section made of semiconductor elements are integrally formed on the same glass substrate.
The present invention relates to a fluorescent display tube having a structure of ASS) J (hereinafter referred to as COG), and particularly relates to a sealing structure of a semiconductor element.
従来のＣＯＧ構造會有する蛍光表示管として第１図およ
び第２図に、要部切欠き平面図および八−Ａ部切断断面
図を示すような構造のものが提供されている。すなわち
、この従来例について説明すると、図において、１は駆
動回路形成板’に？ねた陽極基板で、ガラスからなる基
板ＩＡの上面に積層被着された複数の配線被膜２、絶縁
被膜３、セグメント電極４、けい光体層５等を備えたも
のであり、かつこのけい光体層５を有する複数のセグメ
ント電極４によって数字等のパターンを表示する陽極表
示部６を構成し、この陽極表示部６を複数けた並設させ
て複数けたの数字等を選択的に表示できるようになって
いる。As a conventional fluorescent display tube having a COG structure, a structure as shown in FIGS. 1 and 2 is a cutaway plan view of the main part and a cross-sectional view taken along the line 8-A. That is, to explain this conventional example, in the figure, 1 is the drive circuit forming board'? This is a solid anode substrate, which is provided with a plurality of wiring coatings 2, insulating coatings 3, segment electrodes 4, phosphor layers 5, etc. laminated on the upper surface of a substrate IA made of glass, and this fluorescent material is A plurality of segment electrodes 4 having a body layer 5 constitute an anode display section 6 for displaying patterns such as numbers, and a plurality of anode display sections 6 are arranged in parallel so that multi-digit numbers and the like can be selectively displayed. It has become.
配線被膜２は、絶縁被膜３に設けた接続孔７全通して隣
接するセグメント電極４を電気的に接続し、さらに、外
部駆動回路接続電極として基板ＩＢ上迄、延長配線され
ている。また、各陽極表示部６に対向させてメソシュ状
の制御電極１１および陰極１２が配設され配肪被Ｊ臭２
により基板ＩＢ上迄、延長配線されている。陽極表示部
６、制御電極１１．陰極１２等を備えた陽極基板ＩＡの
上に、少なくとも上面窓部は透明なガラスなどからなる
上面板１３が配設され、その周縁部において低融点フリ
ットカラスのような封着拐２２によって気密に封着され
て、外囲器が形成されている。The wiring film 2 electrically connects the adjacent segment electrodes 4 through the entire connection hole 7 provided in the insulating film 3, and is further extended to the substrate IB as an external drive circuit connection electrode. Further, a mesoche-shaped control electrode 11 and a cathode 12 are arranged to face each anode display section 6.
The wiring is extended to the top of the board IB. Anode display section 6, control electrode 11. On the anode substrate IA having the cathode 12, etc., there is disposed an upper plate 13, at least the upper window portion of which is made of transparent glass or the like, and the periphery of the upper plate 13 is made airtight by a sealant 22 such as a low-melting frit glass. It is sealed to form an envelope.
次に基板ＩＢ上に形成される駆動回路１４について説明
する。この従来例については、水晶制御クロック用ＣＭ
Ｏ８ＬＳ１１５を１チツプ、基板ＩＢ上に実装している
。ＣＭＯ８Ｌｓｘチップ１５は導電性あるいは絶縁性接
着剤１６により基板ＩＢ上にダイボンディングされる。Next, the drive circuit 14 formed on the substrate IB will be explained. Regarding this conventional example, the crystal control clock CM
One O8LS115 chip is mounted on the board IB. The CMO8Lsx chip 15 is die-bonded onto the substrate IB using a conductive or insulating adhesive 16.
続いてチップ１５上の電極と配線被膜２により形成され
たパッド部１７間を接続するワイヤーボンディングを行
なう。これには金線１８を用い例えばサーモン二ツク法
で接続される。更にこれらの上から保護キャップ１９と
して金属製あるいはセラミック製中空パッケージにより
覆い、かつ固定する為に接着剤２０を用い、気密封止構
造の駆動回路１４が出来あがる。Subsequently, wire bonding is performed to connect the electrodes on the chip 15 and the pad portions 17 formed by the wiring film 2. This is connected using a gold wire 18, for example, by the Salmon two-way method. Further, a metal or ceramic hollow package is placed over these as a protective cap 19, and an adhesive 20 is used to fix the package, thereby completing the drive circuit 14 having an airtight sealing structure.
これがＣＯＧ構造の基本構成である。この様に製作され
たＣＯＧ構造を有する表示管においてはインターフェイ
ス信号用外部電極端子２１に水晶振動子（図示せず）等
全取付は直流電源に接続することによりスタディツク駆
動の時計表示を行うことが出来る。This is the basic configuration of the COG structure. In the display tube having the COG structure manufactured in this way, a crystal oscillator (not shown) etc. are all attached to the external electrode terminal 21 for interface signals, and a clock driven by the clock is displayed by connecting it to a DC power supply. I can do it.
しかしながら、この様なＣＯＧ構造を有する従来の蛍光
表示管においては動作中に駆動回路部１４の誤動作が時
々発生した。この誤動作を生ずる原因は次の二点である
ことが調査の結果明らかとなった。その一つはカラス基
板ＩＢの裏面から入射する外部光３０によるＩＣ誤動作
、もう一つはガラス基板ＩＢから溶出するアルカリ金属
成分が影響するＩＣ誤動作である。いずれもガラス基板
１ “Ｂがからんだ問題点であった。前者は動作初期か
ら生じ、ここでは保護キャップ１９としてアルミナ質か
ら成るセラミックを用いて気密封止しているが、光の反
射に対して特別な処理がなされていない為、光に対する
反射係数はかなり大きく、その為キャップ内に透過した
外部光３０はキャップの内壁で反射をくり返したのち半
導体チップ１５の表面に到達する。光による漏電流が問
題となる０ＭＯ８ＬＳＩチップ１５では、この外部光３
０によって電気的特性が変化する為、時々誤動作を生じ
ていたものである。もう一つの誤動作発生原因であるガ
ラス基板からのアルカリ金属溶出の影響は長時間動作後
に生じた。周知のように半導体素子１５は表面にパッシ
ベーション層は形成されているものの完全な保護膜とは
いえず、もしナトリウムイオンや塩素イオンあるいは水
等が吸着すると、その影響を受けて腐食作用を促進し半
導体デノ（イス特性の誤動作へと進む場合がある。従来
、ソーダガラス質から成るガラス基板ＩＢ上にＩＣチッ
プ１５を直接ダイボンディングしていた為に、ソーダガ
ラス内に約２０Ｍ量チ含まれるナトリウム（Ｎａ２０）
、カリウム（ＫｚＯ）等のアルカリ金属成分が、特に高
温φ高湿の使用条件下でイオン化しそのモビリティ−を
増加させＩＣ表表面波散し、表面のアルミニウム膜と化
学反応を起し腐食作用を促進して電気的特性の誤動作へ
と進んだものと考えられる。However, in conventional fluorescent display tubes having such a COG structure, malfunctions of the driving circuit section 14 sometimes occur during operation. As a result of the investigation, it became clear that the causes of this malfunction are the following two points. One is IC malfunction due to external light 30 incident from the back surface of glass substrate IB, and the other is IC malfunction affected by alkali metal components eluted from glass substrate IB. In both cases, the problem was related to the glass substrate 1"B.The former occurred from the beginning of operation, and here the protective cap 19 is made of ceramic made of alumina for airtight sealing. Since no special treatment has been applied to the cap, the reflection coefficient for light is quite large, so the external light 30 that passes through the cap reaches the surface of the semiconductor chip 15 after being reflected repeatedly on the inner wall of the cap. In the 0MO8LSI chip 15 where leakage current is a problem, this external light 3
Since the electrical characteristics change depending on the value of 0, malfunctions sometimes occurred. The effect of alkali metal elution from the glass substrate, which is another cause of malfunction, occurred after long-term operation. As is well known, although a passivation layer is formed on the surface of the semiconductor element 15, it is not a complete protective film, and if sodium ions, chloride ions, water, etc. are adsorbed, the semiconductor element 15 will be affected by it and will accelerate corrosion. This may lead to malfunction of the semiconductor device characteristics. Conventionally, since the IC chip 15 was directly die-bonded onto the glass substrate IB made of soda glass, approximately 20 M of nitride was contained in the soda glass. Sodium (Na20)
Alkali metal components such as potassium (KzO) ionize especially under high temperature and high humidity usage conditions, increase their mobility, scatter on the IC surface, cause a chemical reaction with the aluminum film on the surface, and cause corrosion. This is thought to have accelerated the problem and led to malfunction of the electrical characteristics.
従って、従来のＣＯＧ構造？有する璽光表示管に於いて
は半導体素子１５をダイボンディングするガラス基板Ｉ
Ｂ上に何らかの処理を施し外部光及びイオン性不純物か
らＩＣチップを保護することが信頼性を高める必要条件
となる。Therefore, the conventional COG structure? In the optical display tube having a glass substrate I to which the semiconductor element 15 is die-bonded,
A necessary condition for increasing reliability is to perform some kind of treatment on B to protect the IC chip from external light and ionic impurities.
本発明は、前述したような従来の問題点全解消したＣＯ
Ｇ構造を有する蛍光表示管を提供せんとするものである
。その主旨とする処は、ＩＣチップをダンボンディング
するソーダガラス表面にあらかじめアルカリ金属成分を
含まない非透光性絶縁ガラスペーストを塗布し、この↓
にボンティングパッドを設けてＩＣチップが直接ソーダ
ガラスと接しない様にしたこと全特徴としている。The present invention solves all of the conventional problems as described above.
The present invention aims to provide a fluorescent display tube having a G structure. The main idea is that a non-transparent insulating glass paste that does not contain alkali metal components is applied in advance to the soda glass surface on which the IC chip will be bonded.
The main feature is that a bonding pad is provided at the top to prevent the IC chip from coming into direct contact with the soda glass.
本発明に於ては、ＩＣｌ３を実装するカラス基板」１３
上にｐｂｏ−Ｂ２０３−ＺｎＯ−８ｉＯ２がら成る成分
を少なくとも２種類以上含みかつ着色剤と有機バインダ
ーから成る絶縁ガラスペーストを塗布し焼成、形成した
ことを特徴としている。In the present invention, a glass substrate on which ICl3 is mounted"13
It is characterized in that an insulating glass paste containing at least two types of components consisting of pbo-B203-ZnO-8iO2, a coloring agent and an organic binder is applied thereon, and then fired and formed.
以下に本発明を実施例により詳細に説明する。The present invention will be explained in detail below using examples.
第３図は本発明の実施例による切断断面図でわる。FIG. 3 is a cutaway sectional view according to an embodiment of the invention.
図において第１図および第２図と同じ部材については同
じ符号を用いてあり、これらの基本的役割は従来法と何
ら変りはない。ｌは駆動回路形成板を兼ねたガラス基板
で、ＩＡ上には蛍光表示パネルを、ＩＢ上にはＩＣチッ
プを実装する構造を有している。基板ＩＡ上の陽極表示
部６′ｆｒ、形成する配線被膜２が基板ＩＢ上のＩＣチ
ップ近傍迄延長配線されでおり、絶縁被膜５０に設けた
接続孔７０全通して所定のポンディングパッド６０と電
気的に接続されている。即ち本実施例に於てはポンディ
ングパッド６０は従来のようにソーダガラス基板ＩＢ上
ではなく、絶縁被膜５０上に形成されていることになる
。この絶縁被膜５０が本発明による絶縁ガラスペースト
で、本実施例においては５ｉ０２１７％、Ｂ２’０３１
３ ％、Ｐｂ０７０＊Ｏ成分ヲ含み、かつ金属酸化物の
混合物からなる着色剤と有機バインダーから成る組成か
ら形成場れている。In the figures, the same members as in FIGS. 1 and 2 are denoted by the same reference numerals, and their basic roles are no different from those in the conventional method. 1 is a glass substrate which also serves as a drive circuit forming board, and has a structure in which a fluorescent display panel is mounted on IA and an IC chip is mounted on IB. The anode display section 6'fr on the substrate IA and the wiring coating 2 to be formed are extended to the vicinity of the IC chip on the substrate IB, and are connected to predetermined bonding pads 60 through the entire connection hole 70 provided in the insulating coating 50. electrically connected. That is, in this embodiment, the bonding pad 60 is formed not on the soda glass substrate IB as in the conventional case, but on the insulating coating 50. This insulating coating 50 is an insulating glass paste according to the present invention, and in this embodiment, 5i0217%, B2'031
3%, Pb070*O component, and a composition consisting of a colorant consisting of a mixture of metal oxides and an organic binder.
このガラスペーストを６００’Ｏにで焼成してバインダ
ーをとげし黒色絶縁被膜５０となる。絖いてＣＭＯ８Ｌ
ＳＩテッゾ１５を絶縁性エポキシ樹脂１６により絶縁被
膜５０上にダイホンティングする。This glass paste is fired at 600'O to remove the binder and form a black insulating film 50. CMO8L
The SI Tezzo 15 is die-honed onto the insulating coating 50 using an insulating epoxy resin 16.
エポキシ樹脂１６の硬化は１５０’０−５分で完了しＩ
Ｃチップが固定される。続いてテップ１５上のＡ、ｌ電
極とパッド部６０間を電気的に接続するワイヤーポンデ
ィングを行なう。ここでは金線１８を用いサーモノニノ
ク法で接続した。更にこれら上から保護キャップ１９と
してアルミナ質から成るセラミックキャップを設け、駆
動回ｊ）８．１４が出来あがる。この様に製作された本
発明の蛍光表示管においてはガラス基板内から浴出進入
してくるＮａ＋、に＋等のイオン性不純物が絶縁カラス
被膜５゜によって阻止されＩＣ素子の特性劣化を防止す
る効果が確認された。更に絶縁カラス被膜５（ｌＵ層色
剤により非坊光性となっておシガラ２基板ＩＢの裏面か
らの外部光がキャップ１９内に入射することはなく、外
部光によるＩＣ誤動作を生ずることがまったくない秀れ
た特徴を有するＣＯＧ蛍光表示管が得られる様になった
。The curing of the epoxy resin 16 was completed in 150'0-5 minutes.
The C chip is fixed. Subsequently, wire bonding is performed to electrically connect the A and L electrodes on the step 15 and the pad portion 60. Here, a gold wire 18 was used and connection was made by the Samononinok method. Furthermore, a ceramic cap made of alumina is provided as a protective cap 19 over these, and the drive circuit j) 8.14 is completed. In the fluorescent display tube of the present invention manufactured in this manner, ionic impurities such as Na+ and Ni+ entering and exiting the bath from within the glass substrate are blocked by the insulating glass coating 5°, thereby preventing characteristic deterioration of the IC element. The effect was confirmed. In addition, the insulating glass coating 5 (IL layer) has a non-glare property due to the colorant, so that external light from the back side of the cigar 2 board IB will not enter into the cap 19, and IC malfunctions due to external light will never occur. Now, a COG fluorescent display tube with excellent characteristics has become available.
尚本実施例ではセグメントタイプの蛍光表示管について
ＬＩＣ素子を１テツプ笑製する場合についてのみ述べて
いるが、ドツトタイプの蛍光表示管で複数チップを実装
する場合に於いても有効であることは明らかである。Although this embodiment describes only the case where LIC elements are manufactured in one step in a segment-type fluorescent display tube, it is clear that the method is also effective when mounting multiple chips in a dot-type fluorescent display tube. It is.
第１図および第２図は従来のＣＯＧ構造を有する蛍光表
示管の一例を示す要部切欠き平面図およびＡ、 −Ａ部
切断断面図、第３図は本発明にょるＣＯＧ構造構造金石
蛍光表示管の一実施例を示す断面図である。
ｌ・・・・・・ソーダガラス基板、２・・・・・・配線
被膜、３・・・・・・絶縁被膜、４・・・・・・セグメ
ント電極、５・旧・・蛍光体層、６・・・・・・陽極表
示部、７・・・・・・接続孔、工１・・・・・・制御電
極、１２・・・・・・陰極、１３・・団・カバーガラス
、１４・・・・・・駆動回路部、１５・・・・・・ＩＣ
チップ、１６・・・・・・エポキシ樹脂、１７・・・・
・・パッド部、１９・・・・・・中空保護キャップ、３
０・・・・・・外部光、５ｏ・・・・・・非透光性絶縁
被膜、６０・・・・・・ボンティングパッド部、７ｏ・
旧・・接続孔。
乙に・・。
代哩人 弁理士 内 原 四〇。
−−）
第１図
墾２区
第３図
１ ＋Ａ ７０ ７ＢFIGS. 1 and 2 are a cutaway plan view of essential parts and a cross-sectional view of sections A and -A showing an example of a conventional fluorescent display tube having a COG structure, and FIG. 3 is a gold stone fluorescent display having a COG structure according to the present invention. FIG. 2 is a sectional view showing one embodiment of a display tube. l... Soda glass substrate, 2... Wiring coating, 3... Insulating coating, 4... Segment electrode, 5... Old... Fluorescent layer, 6...Anode display section, 7...Connection hole, 1...Control electrode, 12...Cathode, 13...Group/cover glass, 14 ......Drive circuit section, 15...IC
Chip, 16...Epoxy resin, 17...
...Pad part, 19...Hollow protective cap, 3
0...External light, 5o...Non-transparent insulation coating, 60...Bonting pad portion, 7o...
Old connection hole. To you... Representative Patent Attorney Uchihara 40. --) Figure 1, Ward 2, Figure 3 1 +A 70 7B
Claims (2)
ップを固定し、表示用電極を形成する導電膜を前記チッ
プ近傍に延長して所定のボンティングパッドを形成し、
前記チップと前記表示用電極を電気的に接続してなる蛍
光表示管において、前記基板上にアルカリ金属成分を含
まない非透光性絶縁被膜を設け、その上に前記チップと
ポンディングパッドとを形成したことを特徴とする蛍光
表示管。(1) An integrated circuit chip is fixed on one glass substrate of a fluorescent display tube, and a conductive film forming a display electrode is extended to the vicinity of the chip to form a predetermined bonding pad,
In a fluorescent display tube in which the chip and the display electrode are electrically connected, a non-transparent insulating film containing no alkali metal component is provided on the substrate, and the chip and the bonding pad are placed on the non-transparent insulating film. A fluorescent display tube characterized in that:
ｎＯ，５ｉ０２から成る成分を少なく共２つ以上含み、
かつ着色剤及び有機バインダーから成る絶縁ペーストか
ら形成されたことを特徴とする特許請求の範囲第１項記
載の蛍光表示管。(2) The non-transparent insulating film is made of pbo, B2O3,Z
Contains at least two or more components consisting of nO, 5i02,
2. The fluorescent display tube according to claim 1, wherein the fluorescent display tube is formed from an insulating paste comprising a colorant and an organic binder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18542683A JPS6077337A (en) | 1983-10-04 | 1983-10-04 | Fluorescent character display tube |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18542683A JPS6077337A (en) | 1983-10-04 | 1983-10-04 | Fluorescent character display tube |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6077337A true JPS6077337A (en) | 1985-05-01 |
Family
ID=16170576
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18542683A Pending JPS6077337A (en) | 1983-10-04 | 1983-10-04 | Fluorescent character display tube |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6077337A (en) |
-
1983
- 1983-10-04 JP JP18542683A patent/JPS6077337A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4697123A (en) | Gas discharge panel | |
| GB1499524A (en) | Fluorescent display devices | |
| EP3641000B1 (en) | Encapsulation structure | |
| KR890004376B1 (en) | The production method of plane display cells | |
| JPH0140464B2 (en) | ||
| KR100334168B1 (en) | Flat display panel | |
| JPS59230238A (en) | Fluorescent character display tube | |
| JPH05325847A (en) | Chip-in-glass fluorescent character display panel | |
| JPH0318298B2 (en) | ||
| JPS6178036A (en) | Fluorescent display tube | |
| JPS59224036A (en) | Fluorescent character display tube | |
| JPS6178039A (en) | Fluorescent display tube | |
| JPS60163079A (en) | Fluorescent display panel | |
| JPH0620627A (en) | Fluorescent display tube | |
| JPS5871534A (en) | Gas electric-discharge panel | |
| JPH0414842Y2 (en) | ||
| EP0105408B1 (en) | Electroluminescent display | |
| JPS61140034A (en) | Fluorescent character display tube | |
| JPS61140033A (en) | Fluorescent character display tube | |
| KR920007086B1 (en) | Manufacturing method of plasma display panel | |
| JPH0227491Y2 (en) | ||
| JPH0547306A (en) | Display panel | |
| JP3060568B2 (en) | Fluorescent display panel | |
| JPS63202819A (en) | Manufacture of fluorescent character display panel | |
| JPS6155872A (en) | Soldering structure of multiterminal |