JPS6095944A - プラグインパツケ−ジとその製造方法 - Google Patents

プラグインパツケ−ジとその製造方法

Info

Publication number
JPS6095944A
JPS6095944A JP58204262A JP20426283A JPS6095944A JP S6095944 A JPS6095944 A JP S6095944A JP 58204262 A JP58204262 A JP 58204262A JP 20426283 A JP20426283 A JP 20426283A JP S6095944 A JPS6095944 A JP S6095944A
Authority
JP
Japan
Prior art keywords
plug
substrate
package
board
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58204262A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0582060B2 (2
Inventor
Katsumi Mabuchi
勝美 馬淵
Osamu Fujikawa
治 藤川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to JP58204262A priority Critical patent/JPS6095944A/ja
Publication of JPS6095944A publication Critical patent/JPS6095944A/ja
Publication of JPH0582060B2 publication Critical patent/JPH0582060B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/095—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers of vias therein
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/306—Assembling printed circuits with electric components, e.g. with resistors with lead-in-hole components
    • H05K3/308—Adaptations of leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating processes for reflow soldering

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP58204262A 1983-10-31 1983-10-31 プラグインパツケ−ジとその製造方法 Granted JPS6095944A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58204262A JPS6095944A (ja) 1983-10-31 1983-10-31 プラグインパツケ−ジとその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58204262A JPS6095944A (ja) 1983-10-31 1983-10-31 プラグインパツケ−ジとその製造方法

Publications (2)

Publication Number Publication Date
JPS6095944A true JPS6095944A (ja) 1985-05-29
JPH0582060B2 JPH0582060B2 (2) 1993-11-17

Family

ID=16487546

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58204262A Granted JPS6095944A (ja) 1983-10-31 1983-10-31 プラグインパツケ−ジとその製造方法

Country Status (1)

Country Link
JP (1) JPS6095944A (2)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62257754A (ja) * 1986-04-30 1987-11-10 Ibiden Co Ltd 半導体搭載用基板
JPS62257755A (ja) * 1986-04-30 1987-11-10 Ibiden Co Ltd 半導体搭載用基板
JPS62283651A (ja) * 1986-05-31 1987-12-09 Ibiden Co Ltd 半導体搭載基板用の導体ピン及びその製造方法

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4875566U (2) * 1971-12-20 1973-09-19
JPS4923624A (2) * 1972-06-22 1974-03-02
JPS5088556A (2) * 1973-12-11 1975-07-16
JPS5489273U (2) * 1977-12-08 1979-06-23
JPS5517472U (2) * 1978-07-20 1980-02-04
JPS55103751A (en) * 1979-01-31 1980-08-08 Nec Corp Semiconductor device
JPS5612361A (en) * 1979-07-12 1981-02-06 Mitsui Toatsu Chem Inc Isopropylamine derivative and its preparation
JPS5784750U (2) * 1980-11-14 1982-05-25
JPS57162454A (en) * 1981-03-31 1982-10-06 Hitachi Ltd Equipment of terminal of hybrid module
JPS5810848A (ja) * 1981-07-14 1983-01-21 Toshiba Corp 混成集積回路用リ−ドピン
JPS5810840A (ja) * 1981-07-10 1983-01-21 Fujitsu Ltd 半導体装置
JPS58159355A (ja) * 1982-03-17 1983-09-21 Nec Corp 半導体装置の製造方法

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4875566U (2) * 1971-12-20 1973-09-19
JPS4923624A (2) * 1972-06-22 1974-03-02
JPS5088556A (2) * 1973-12-11 1975-07-16
JPS5489273U (2) * 1977-12-08 1979-06-23
JPS5517472U (2) * 1978-07-20 1980-02-04
JPS55103751A (en) * 1979-01-31 1980-08-08 Nec Corp Semiconductor device
JPS5612361A (en) * 1979-07-12 1981-02-06 Mitsui Toatsu Chem Inc Isopropylamine derivative and its preparation
JPS5784750U (2) * 1980-11-14 1982-05-25
JPS57162454A (en) * 1981-03-31 1982-10-06 Hitachi Ltd Equipment of terminal of hybrid module
JPS5810840A (ja) * 1981-07-10 1983-01-21 Fujitsu Ltd 半導体装置
JPS5810848A (ja) * 1981-07-14 1983-01-21 Toshiba Corp 混成集積回路用リ−ドピン
JPS58159355A (ja) * 1982-03-17 1983-09-21 Nec Corp 半導体装置の製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62257754A (ja) * 1986-04-30 1987-11-10 Ibiden Co Ltd 半導体搭載用基板
JPS62257755A (ja) * 1986-04-30 1987-11-10 Ibiden Co Ltd 半導体搭載用基板
JPS62283651A (ja) * 1986-05-31 1987-12-09 Ibiden Co Ltd 半導体搭載基板用の導体ピン及びその製造方法

Also Published As

Publication number Publication date
JPH0582060B2 (2) 1993-11-17

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