JPS609897A - Manufacture of alumite substrate with high corrosion resistance for magnetic disk - Google Patents
Manufacture of alumite substrate with high corrosion resistance for magnetic diskInfo
- Publication number
- JPS609897A JPS609897A JP11844183A JP11844183A JPS609897A JP S609897 A JPS609897 A JP S609897A JP 11844183 A JP11844183 A JP 11844183A JP 11844183 A JP11844183 A JP 11844183A JP S609897 A JPS609897 A JP S609897A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- alumite
- magnetic disk
- corrosion resistance
- sulfuric acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electrochemical Coating By Surface Reaction (AREA)
- Physical Vapour Deposition (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の技術分野〕
本発明は、磁気ディスク装置の磁気記録媒体として使用
される高耐蝕アルマイト磁気ディスク基板の製造方法に
関し、特に高記録密度磁気ディスク基板のように、陽極
酸化処理後封孔処理ができないアルマイト基板において
も、高耐蝕性、高耐熱性が得られるアルマイト基板の製
造方法に関する。Detailed Description of the Invention [Technical Field of the Invention] The present invention relates to a method for manufacturing a highly corrosion-resistant alumite magnetic disk substrate used as a magnetic recording medium of a magnetic disk device, and particularly to a method for manufacturing a highly corrosion-resistant alumite magnetic disk substrate, such as a high recording density magnetic disk substrate. The present invention relates to a method for manufacturing an alumite substrate that provides high corrosion resistance and high heat resistance even in an alumite substrate that cannot be sealed after anodizing treatment.
データ処理装置などに使用される磁気ディスク装置は、
近年急激な記録密度の向上、大容量化が進み、同時に磁
気ヘッドの浮上量も非常に小さくなってきており、その
ため磁気ディスク面の平滑化が一層要求される。そこで
この要求を満たすために、従来から第1図のような方法
でアルマイト処理が行なわれている。即ち、
(1,1陽極酸化溶液として硫酸を用い、アルミニウム
基板を陽極酸化して、3〜5+um程度のアルマイト隔
を形成する。Magnetic disk devices used in data processing equipment, etc.
In recent years, recording densities and capacities have rapidly increased, and at the same time, the flying height of magnetic heads has become extremely small, making it even more necessary to make magnetic disk surfaces smoother. In order to meet this requirement, alumite treatment has conventionally been carried out using the method shown in FIG. That is, (using sulfuric acid as a 1,1 anodizing solution, an aluminum substrate is anodized to form an alumite gap of about 3 to 5+ um).
(2)次いで水を供給しながら、ボリシングにより、陽
極酸化皮膜表面を鏡面化する。(2) Next, while supplying water, the surface of the anodic oxide film is mirror-finished by boring.
(31320℃程度でエージング(Corp) シて、
歪を除去すると共に、乾燥させる。(Aged at about 31320℃ (Corp))
Remove distortion and dry.
(4)その上にFeをスパツタリングし、α状のFez
O3を形成させる。(4) Sputtering Fe on top of it to form α-shaped Fez
Form O3.
(5)次に350℃に加熱された水素炉において還元処
理し、Fe3O4を得る。(5) Next, reduction treatment is performed in a hydrogen furnace heated to 350°C to obtain Fe3O4.
(6)これを350℃に加熱された大気炉において酸化
処理し、磁性膜であるγ状のFezO3を形成させる。(6) This is oxidized in an atmospheric furnace heated to 350° C. to form γ-shaped FezO3, which is a magnetic film.
こうして得られた硫酸アルマイトは、硬度が高く安定し
た性質を呈する。ところが上記のように、アルマイト基
板表面に磁性膜を形成するために、Feをスパッタリン
グしてα状のFezO*を形成させる際の酸化、還元工
程で350℃程度までアルマイト基板を高温加熱しなけ
ればならない。The sulfuric acid alumite thus obtained exhibits high hardness and stable properties. However, as mentioned above, in order to form a magnetic film on the surface of the alumite substrate, the alumite substrate must be heated to a high temperature of about 350°C during the oxidation and reduction steps when sputtering Fe to form α-shaped FezO*. It won't happen.
このアルマイト基板を製造するために陽極酸化溶液とし
て、硫酸、リン酸あるいは蓚酸などの酸を使用すると、
陽極酸化皮膜生成時に形成された通電微細孔に腐蝕性の
高い酸が残留し、前記の酸化、還元工程における加熱に
より、陽極酸化皮膜が腐蝕され、更に磁性膜であるγ状
のFezO3皮膜をも腐蝕破壊するという問題がある。When an acid such as sulfuric acid, phosphoric acid or oxalic acid is used as an anodizing solution to manufacture this alumite substrate,
A highly corrosive acid remains in the current-carrying micropores formed during the formation of the anodic oxide film, and the heating in the oxidation and reduction steps corrodes the anodic oxide film, and furthermore, the γ-shaped FezO film, which is a magnetic film, is also damaged. There is a problem of corrosion and destruction.
またアルミニウム層とアルマイト層との間に、アルマイ
トの生成過程で発生するバリア層と称するアルミニウム
とアルマイトとの中間的性質を有する薄い膜ができる。Further, between the aluminum layer and the alumite layer, a thin film having intermediate properties between aluminum and alumite is formed, which is called a barrier layer and is generated during the alumite production process.
ところが酸化、還元工程で加熱されると、残存した酸が
反応して硫化アルミニウムが生成され、これがポリソシ
ュ工程で浸入した水と作用して水酸化アルミニウムとな
り、硫化水素を遊離して腐蝕歪を来たし、加速度的に硫
化アルミニウムが加水分解する。その結果アルミニウム
層とアルマイト層を結合しているバリア層が剥離したり
、クラックが発生し易い。However, when heated during the oxidation and reduction processes, the remaining acid reacts to produce aluminum sulfide, which interacts with the water that entered during the polysosh process to form aluminum hydroxide, liberating hydrogen sulfide and causing corrosion distortion. , aluminum sulfide is hydrolyzed at an accelerated rate. As a result, the barrier layer that connects the aluminum layer and the alumite layer is likely to peel or crack.
一方陽極酸化後、封孔処理などで通電微細孔に残留した
酸を洗浄、閉塞し、アルマイト基板の耐蝕性を向上させ
ることも考えられるが、前記酸化、還元工程中における
高温加熱の際に、陽極酸化皮膜層にクランクが発生し、
磁気記録媒体におけるビットエラーの原因となるので、
これを行なうこともできない。On the other hand, it is also possible to improve the corrosion resistance of the alumite substrate by washing and sealing the acid remaining in the energized micropores after anodization, but during high-temperature heating during the oxidation and reduction steps, Crank occurs in the anodic oxide film layer,
Because it causes bit errors in magnetic recording media,
Nor can you do this.
即ち第2図に示すようにアルミニウム基板1を陽極酸化
すると、通電孔2が形成されるが、これを100℃の水
中などで封孔処理すると、第3図に示すように、通電孔
2がT−八1203 ・HzOよりなるベーマイ1−5
により閉塞される。このように封孔処理されたアルマイ
ト基板は、アルミニウム基板1と陽極酸化皮膜3との熱
線膨張係数の差が約5倍も異なるため、前記酸化、還元
工程の加熱処理において、第4図に示す如くわん曲し、
クラック6が生ずるものと考えられる。ところが封孔処
理を行なわなければ、第2図に示したように通電孔2が
そのまま存在しており、第5図に示す如くアルミニウム
基板1と陽極酸化皮l*3との熱線膨張係数の差による
変形(収縮応力)が生じても、通電孔2に吸収され、ク
ラックが生じないものと考えられる。以上の理由により
、磁気ディスク基板用のアルマイト基板は封孔処理を行
なうことができない。That is, as shown in FIG. 2, when the aluminum substrate 1 is anodized, the conductive holes 2 are formed, but when this is sealed in water at 100°C, the conductive holes 2 are formed as shown in FIG. T-81203 Boehmai 1-5 consisting of HzO
is occluded by In the alumite substrate sealed in this way, the difference in linear thermal expansion coefficient between the aluminum substrate 1 and the anodic oxide film 3 is about five times different, so in the heat treatment of the oxidation and reduction steps, the difference shown in FIG. bend like a bell,
It is thought that crack 6 is generated. However, if the sealing treatment is not performed, the current-carrying hole 2 will remain as shown in FIG. 2, and the difference in thermal linear expansion coefficient between the aluminum substrate 1 and the anodized skin l*3 will increase as shown in FIG. It is considered that even if deformation (shrinkage stress) occurs, it is absorbed by the current-carrying holes 2 and no cracks occur. For the above reasons, alumite substrates for magnetic disk substrates cannot be sealed.
本発明の目的は、封孔処理を適用できない磁気ディスク
用のアルマイト基板において、封孔処理をしなくてもア
ルマイト基板の耐蝕性を向上させ、磁性膜層への腐蝕拡
散を防止すると共に、アルマイト層を剥離させ易いバリ
ヤ層を増強することにある。The purpose of the present invention is to improve the corrosion resistance of the alumite substrate for magnetic disks to which sealing cannot be applied, to prevent corrosion from spreading to the magnetic film layer, and to improve the corrosion resistance of the alumite substrate without sealing. The objective is to strengthen the barrier layer, which is easy to peel off.
5−
この技術的課題を解決するために講じた本発明による技
術的手段は、磁気ディスク用アルミニウム基板を、硫酸
系の陽極酸化溶液により陽極酸化する工程と、陽極酸化
された膜を鏡面加工する工+ −3−を
程と、これらの工程より後に、0■、BO3、C00I
+の各陰イオンの一部または総てを含むpH2〜12の
腐蝕性のない水溶液を用いて、直流もしくは交流電解電
圧で再度陽極酸化処理する工程を含む方法を採っている
。5- The technical measures taken by the present invention to solve this technical problem include the step of anodizing an aluminum substrate for a magnetic disk with a sulfuric acid-based anodizing solution, and mirror-finishing the anodized film. Step + -3- and after these steps, 0■, BO3, C00I
A method is employed that includes a step of performing anodization treatment again at a direct current or alternating current electrolytic voltage using a non-corrosive aqueous solution with a pH of 2 to 12 containing some or all of the positive anions.
次に本発明による高耐蝕アルマイト磁気ディスク基板の
製造方法が実際上どのように具体化されるかを実施例で
説明する。本発明の場合も、第1図で示したように硫酸
を用いてアルミニウム基板を陽極酸化した後、水を供給
しながらポリッシュして鏡面化し、その上にFeをスパ
ッタし、次いで酸化、還元処理することは、従来と同じ
である。Next, examples will be used to explain how the method of manufacturing a highly corrosion-resistant alumite magnetic disk substrate according to the present invention is actually implemented. In the case of the present invention, as shown in Fig. 1, an aluminum substrate is anodized using sulfuric acid, then polished while supplying water to give a mirror finish, and Fe is sputtered thereon, followed by oxidation and reduction treatment. What you do is the same as before.
本発明では、これらの工程の後に、再度陽極酸化処理を
行なう。この1度めの陽極酸化処理を第2アルマイト処
理と呼ぶ。この第2アルマイト処=6=
理は、腐蝕性のない浴組成で行なう。即ち、(イ)浴組
成
−3−1
■含有陰イオン:011、BO3、C0OH■pH1〜
12
■上記■■の水溶液
(ロ)電解条件
■電解電圧(電流):直流もしくは交流■陰極: pb
、カーボン
陽極ニアルミニウム基板
上記の条件を満たす腐蝕性のない浴組成としては、酢酸
水溶液(pH2,8) 、ホウ酸、クエン酸、水酸化ナ
トリウムなどが挙げられる。In the present invention, after these steps, anodization treatment is performed again. This first anodic oxidation treatment is called a second alumite treatment. This second alumite treatment is carried out using a non-corrosive bath composition. That is, (a) Bath composition-3-1 ■ Anions contained: 011, BO3, C0OH ■ pH 1 ~
12 ■Aqueous solution (b) of the above ■■ Electrolysis conditions ■Electrolysis voltage (current): DC or AC ■Cathode: pb
, carbon anode Nialuminum substrate Non-corrosive bath compositions that satisfy the above conditions include aqueous acetic acid (pH 2,8), boric acid, citric acid, sodium hydroxide, and the like.
このように腐蝕性のない浴組成でアルマイト処理すると
、10秒程度の極めて短い時間だけ電流が流れ、以後電
流は流れなくなる。即ちバリア層は、導電体であるアル
ミニウムと絶縁性のアルマイトとの中間的性質を有して
いて、導電性を呈するが、このバリア層が第2アルマイ
ト処理で酸化して絶縁体となるため、電流が流れな(な
る。しかもバリア層は、第2図〜第5図において符号7
で示すように、通電孔の底部のみにできる極めて薄い層
であり、かつ腐蝕性はない浴組成を使用するので、それ
以上酸化は進行せず、第2アルマイト処理は10秒程度
の短い時間に完了する。When alumite is treated with such a non-corrosive bath composition, a current flows for a very short period of about 10 seconds, and then no current flows. In other words, the barrier layer has properties intermediate between aluminum, which is a conductor, and alumite, which is an insulator, and exhibits conductivity, but since this barrier layer is oxidized in the second alumite treatment and becomes an insulator, No current flows (no current flows.Moreover, the barrier layer is marked 7 in FIGS. 2 to 5.
As shown in Figure 2, the extremely thin layer is formed only at the bottom of the current-carrying hole, and since a non-corrosive bath composition is used, oxidation does not proceed any further, and the second alumite treatment is completed in a short time of about 10 seconds. Complete.
このようにバリア層7を酸化してアルマイト化するが、
腐蝕性のない浴組成を使用するため、酸化はそれ以上進
行せず、バリア層が増強され、かつ耐腐蝕性が向上する
。In this way, the barrier layer 7 is oxidized and turned into alumite,
Since a non-corrosive bath composition is used, oxidation does not proceed further, the barrier layer is strengthened and corrosion resistance is improved.
また陽極反応により瞬間的に発生するガス(酸素)圧で
、通電孔内が清掃され、残存していた腐蝕性の硫酸が浴
組成中に押し出される。アルミニウム基板が陽極になっ
ている関係上、011イオンの集中によって中和が行な
われる。Furthermore, the gas (oxygen) pressure instantaneously generated by the anode reaction cleans the inside of the current-carrying hole, and the remaining corrosive sulfuric acid is pushed out into the bath composition. Since the aluminum substrate serves as an anode, neutralization is performed by concentration of 011 ions.
また陽極のアルミニウム基板に発生する酸素ガス圧と陰
イオンの吸着によって給水が阻止され、腐蝕歪および加
水分解が未然に防止できる。In addition, the oxygen gas pressure generated on the aluminum substrate of the anode and the adsorption of anions prevent water from being supplied, thereby preventing corrosive distortion and hydrolysis.
次に実際に行なった第2アルマイト処理の実施例を説明
する。Next, an example of the second alumite treatment that was actually performed will be described.
(11浴組成として、酢酸水溶液(pl+ 2.8)を
使用し、100(V)の交流電解で5分間処理した。(11 As the bath composition, an acetic acid aqueous solution (pl+ 2.8) was used, and it was treated with AC electrolysis at 100 (V) for 5 minutes.
(2)浴組成として、ホウ酸とクエン酸の混合液(pl
+4〜5)を使用し、60(V)の直流電解処理を5分
間行なった。(2) As a bath composition, a mixed solution of boric acid and citric acid (pl
+4 to 5), and 60 (V) direct current electrolytic treatment was performed for 5 minutes.
(3)浴組成として、ホウ酸とクエン酸および水酸化ナ
トリウムの混合液(pl+9〜1’O)を使用し、40
(V)の直流電解処理を5分間行なった。(3) As the bath composition, a mixture of boric acid, citric acid, and sodium hydroxide (pl+9 to 1'O) was used, and 40
(V) DC electrolytic treatment was performed for 5 minutes.
その結果、上記のいずれの場合も、耐熱性、耐蝕性の上
で何等問題は発生しなかった。なおpHが12を越える
とアルマイトが溶解する。As a result, no problems occurred in terms of heat resistance and corrosion resistance in any of the above cases. Note that when the pH exceeds 12, alumite dissolves.
[発明の効果〕
以上のように本発明のアルマイト処理方法によれば、磁
気ディスク用アルミニウム基板を、硫酸で陽極酸化し、
且つアルマイト層をポリッシュし−づ −1
て鏡面仕上げした後、Oll、BO3、Coo)lの各
陰イオンの一部または総てを含むpl(2〜12の腐蝕
性のない水溶液を用いて、直流もしくは交流電解電圧で
アルマイト処理を行なう方法を採っている。そのため、
バリア層が酸化して増強されると共に、酸化時の発生ガ
ス圧で腐蝕性の硫酸が通電孔から追い出されるので、通
電孔内の腐蝕が進むことはな9−
い。また発生ガスによってアルマイトの加水も防止され
ると共に、腐蝕性のない浴組成を使用するので、腐蝕が
確実に防止される。しかも処理方法は極めて簡単で、且
つ短時間で処理できる。[Effects of the Invention] As described above, according to the alumite treatment method of the present invention, an aluminum substrate for a magnetic disk is anodized with sulfuric acid,
After polishing the alumite layer to a mirror finish, the alumite layer is polished using a non-corrosive aqueous solution of PL (2 to 12) containing some or all of the anions of Oll, BO3, Coo). We use a method of alumite treatment using direct current or alternating current electrolytic voltage.
The barrier layer is oxidized and strengthened, and the corrosive sulfuric acid is expelled from the current-carrying holes by the gas pressure generated during oxidation, so that corrosion within the current-carrying holes does not progress. Furthermore, the generated gas prevents the alumite from being hydrated, and since a non-corrosive bath composition is used, corrosion is reliably prevented. Moreover, the processing method is extremely simple and can be processed in a short time.
第1図はアルマイト磁気ディスク基板の製造方法を示す
工程図、第2図は陽極酸化後のアルマイト基板を示す断
面図、第3図は従来の方法により封孔処理されたアルマ
イト基板を示す断面図、第4図は第3図のアルマイト基
板に加熱処理工程でクランクが発生した状態を示す断面
図、第5図は封孔処理を行なわないアルマイト基板を加
熱した状態を示す断面図である。
図において1はアルミニウム基板、2は通電微細孔、3
は陽極酸化皮膜、4は残留酸、6はクラック、7はバリ
ア層をそれぞれ示す。
特許出願人 富士通株式会社
代理人 弁理士 青 柳 稔
10−Fig. 1 is a process diagram showing a method for manufacturing an alumite magnetic disk substrate, Fig. 2 is a sectional view showing an alumite substrate after anodization, and Fig. 3 is a sectional view showing an alumite substrate sealed by a conventional method. , FIG. 4 is a sectional view showing a state in which a crank has occurred in the alumite substrate of FIG. 3 during the heat treatment process, and FIG. 5 is a sectional view showing a state in which the alumite substrate without sealing treatment is heated. In the figure, 1 is an aluminum substrate, 2 is a current-carrying microhole, and 3 is an aluminum substrate.
4 indicates a residual acid, 6 indicates a crack, and 7 indicates a barrier layer. Patent applicant Fujitsu Ltd. agent Patent attorney Minoru Aoyagi 10-
Claims (1)
溶液により陽極酸化する工程と、陽極酸化された膜を鏡
面加工する工程と、これらの工程−3−1 より後に、011、B(h 、CQOIIの各陰イオン
の一部または総てを含むpH2〜12の腐蝕性のない水
溶液を用いて、直流もしくは交流電解電圧で再度陽極酸
化処理する工程を含むことを特徴とする高耐蝕アルマイ
ト磁気ディスク基板の製造方法。[Claims] A step of anodizing an aluminum substrate for a magnetic disk with a sulfuric acid-based anodizing solution, a step of mirror-finishing the anodized film, and after these steps-3-1, 011, B(h), a high-temperature oxidation process characterized by comprising a step of re-anodizing at a DC or AC electrolytic voltage using a non-corrosive aqueous solution with a pH of 2 to 12 containing some or all of the anions of CQOII. A method for manufacturing a corrosion-resistant alumite magnetic disk substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11844183A JPS609897A (en) | 1983-06-30 | 1983-06-30 | Manufacture of alumite substrate with high corrosion resistance for magnetic disk |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11844183A JPS609897A (en) | 1983-06-30 | 1983-06-30 | Manufacture of alumite substrate with high corrosion resistance for magnetic disk |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS609897A true JPS609897A (en) | 1985-01-18 |
Family
ID=14736713
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11844183A Pending JPS609897A (en) | 1983-06-30 | 1983-06-30 | Manufacture of alumite substrate with high corrosion resistance for magnetic disk |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS609897A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02270130A (en) * | 1989-04-10 | 1990-11-05 | Sony Corp | Substrate for hard disk and production thereof |
| JPH03122201A (en) * | 1989-10-06 | 1991-05-24 | Sumitomo Light Metal Ind Ltd | Aluminum cmosite powder green compact and manufacture thereof |
-
1983
- 1983-06-30 JP JP11844183A patent/JPS609897A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02270130A (en) * | 1989-04-10 | 1990-11-05 | Sony Corp | Substrate for hard disk and production thereof |
| JPH03122201A (en) * | 1989-10-06 | 1991-05-24 | Sumitomo Light Metal Ind Ltd | Aluminum cmosite powder green compact and manufacture thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102953108B (en) | One automatically controls Hard Anodic Oxidation Process | |
| US4548682A (en) | Process of producing magnetic recording media | |
| JPS6146560B2 (en) | ||
| KR20030039998A (en) | Method for surface treatment of metal base | |
| US4631112A (en) | Surface-treated aluminum alloy substrates for magnetic disks | |
| JPH06192887A (en) | Protective covering for metal part for use at high temperature | |
| US4019970A (en) | Process for making titanium-supported lead electrode | |
| CN87102467A (en) | The pore sealing method of aluminium and alloy anodized film thereof | |
| US4420378A (en) | Method for forming decorative colored streak patterns on the surface of an aluminum shaped article | |
| US4741812A (en) | Method for etching electrode foil aluminum electrolytic capacitors | |
| JPH0245908A (en) | Method for manufacturing electrode foil for aluminum electrolytic capacitors | |
| JP2569422B2 (en) | Aluminum oxide laminated structure film and method for producing the same | |
| JPS59185799A (en) | Electrolytic coloring process for anode oxide coating | |
| JPH02240292A (en) | Anodic oxidation of aluminum material with superior corrosion resistance | |
| JPS5989795A (en) | Manufacture of aluminum foil for electrolytic capacitor | |
| CN115491666A (en) | A Conductive Oxidation Process of Magnesium Alloy in High Salt Spray Test | |
| John et al. | Studies on anodizing of aluminium in alkaline electrolyte using alternating current | |
| JPS605897A (en) | Manufacture of alumite substrate with high corrosion resistance | |
| JP2763136B2 (en) | Method for forming etching nuclei on aluminum foil for electrolytic capacitor electrode | |
| CN120330838A (en) | A surface treatment method for anodizing of aluminum alloy parts | |
| JPS5919991B2 (en) | Two-stage pickling method for pure silicon steel materials | |
| JPH01133218A (en) | Production of aluminum substrate for magnetic disk | |
| KR890004229B1 (en) | Manufactured method of magnetic recording media | |
| KR890001604B1 (en) | Method for manufacturing aluminum ignition foil for electrolytic capacitor anode | |
| JPH01173419A (en) | Perpendicular magnetic recording medium |