JPS61112338A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS61112338A
JPS61112338A JP59233206A JP23320684A JPS61112338A JP S61112338 A JPS61112338 A JP S61112338A JP 59233206 A JP59233206 A JP 59233206A JP 23320684 A JP23320684 A JP 23320684A JP S61112338 A JPS61112338 A JP S61112338A
Authority
JP
Japan
Prior art keywords
semiconductor
circuit
type
circuits
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59233206A
Other languages
English (en)
Japanese (ja)
Other versions
JPH053138B2 (2
Inventor
Shoichi Azuhata
正一 小豆畑
Jun Morishita
順 森下
Takayuki Okinaga
隆幸 沖永
Nobuaki Hirano
平野　信明
Toru Suzuki
徹 鈴木
Kazuyoshi Sato
和善 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Microcomputer System Ltd
Hitachi Ltd
Original Assignee
Hitachi Ltd
Hitachi Microcomputer Engineering Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Microcomputer Engineering Ltd filed Critical Hitachi Ltd
Priority to JP59233206A priority Critical patent/JPS61112338A/ja
Publication of JPS61112338A publication Critical patent/JPS61112338A/ja
Publication of JPH053138B2 publication Critical patent/JPH053138B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/722—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between stacked chips

Landscapes

  • Wire Bonding (AREA)
JP59233206A 1984-11-07 1984-11-07 半導体装置 Granted JPS61112338A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59233206A JPS61112338A (ja) 1984-11-07 1984-11-07 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59233206A JPS61112338A (ja) 1984-11-07 1984-11-07 半導体装置

Publications (2)

Publication Number Publication Date
JPS61112338A true JPS61112338A (ja) 1986-05-30
JPH053138B2 JPH053138B2 (2) 1993-01-14

Family

ID=16951413

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59233206A Granted JPS61112338A (ja) 1984-11-07 1984-11-07 半導体装置

Country Status (1)

Country Link
JP (1) JPS61112338A (2)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5923091A (en) * 1997-02-21 1999-07-13 Mitsubishi Denki Kabushiki Kaisha Bonded semiconductor integrated circuit device
JP5600939B2 (ja) * 2007-07-27 2014-10-08 株式会社ニコン 積層型半導体装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59117251A (ja) * 1982-12-24 1984-07-06 Hitachi Micro Comput Eng Ltd 半導体装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59117251A (ja) * 1982-12-24 1984-07-06 Hitachi Micro Comput Eng Ltd 半導体装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5923091A (en) * 1997-02-21 1999-07-13 Mitsubishi Denki Kabushiki Kaisha Bonded semiconductor integrated circuit device
JP5600939B2 (ja) * 2007-07-27 2014-10-08 株式会社ニコン 積層型半導体装置
KR101477323B1 (ko) * 2007-07-27 2014-12-29 가부시키가이샤 니콘 적층형 반도체 장치

Also Published As

Publication number Publication date
JPH053138B2 (2) 1993-01-14

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