JPS6112676Y2 - - Google Patents
Info
- Publication number
- JPS6112676Y2 JPS6112676Y2 JP1980035568U JP3556880U JPS6112676Y2 JP S6112676 Y2 JPS6112676 Y2 JP S6112676Y2 JP 1980035568 U JP1980035568 U JP 1980035568U JP 3556880 U JP3556880 U JP 3556880U JP S6112676 Y2 JPS6112676 Y2 JP S6112676Y2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- resin
- frame
- resin molding
- nozzle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980035568U JPS6112676Y2 (fr) | 1980-03-17 | 1980-03-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980035568U JPS6112676Y2 (fr) | 1980-03-17 | 1980-03-17 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56137451U JPS56137451U (fr) | 1981-10-17 |
| JPS6112676Y2 true JPS6112676Y2 (fr) | 1986-04-19 |
Family
ID=29631195
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1980035568U Expired JPS6112676Y2 (fr) | 1980-03-17 | 1980-03-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6112676Y2 (fr) |
-
1980
- 1980-03-17 JP JP1980035568U patent/JPS6112676Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS56137451U (fr) | 1981-10-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7837908B2 (en) | Mold cleaning sheet and method of producing semiconductor devices using the same | |
| JPH0515445U (ja) | 複合半導体装置 | |
| JP2581113B2 (ja) | 半導体装置のモールド方法および装置 | |
| JPH0324341Y2 (fr) | ||
| JPH0222255Y2 (fr) | ||
| JPH10135252A (ja) | 半導体装置の製造方法 | |
| JP2514818B2 (ja) | 集積回路基板の樹脂封止方法 | |
| JPH03280554A (ja) | 半導体装置の製造方法 | |
| JPH04332156A (ja) | 半導体装置 | |
| JPS607484Y2 (ja) | 電子部品の樹脂モ−ルド装置 | |
| JPS5918675Y2 (ja) | 半導体装置のモ−ルド装置 | |
| JPH0510360Y2 (fr) | ||
| JPH03167810A (ja) | 注型金型装置 | |
| JP3061114U (ja) | 半導体装置のモ―ルド樹脂 | |
| JPS638130Y2 (fr) | ||
| JPH0812877B2 (ja) | 樹脂封止型半導体装置の製造方法 | |
| JPS55159932A (en) | Preparation of wooden top board | |
| JP3499269B2 (ja) | カバーフレームと樹脂封止方法 | |
| JPS629720Y2 (fr) | ||
| JPH0513484A (ja) | 半導体装置の製造方法 | |
| JPS6130280Y2 (fr) | ||
| JP2001156089A (ja) | 樹脂成形用モールド金型装置並びにダイシングマーク用突部を有する基板 | |
| JPH04179242A (ja) | 半導体素子の封止方法 | |
| JPS556840A (en) | Optical semiconductor device and resin sealing method of the same | |
| JPH10178137A (ja) | 樹脂モールド型半導体装置の製造方法 |