JPS61131908A - Chip type crystal resonator - Google Patents

Abstract

PURPOSE:To improve the quality and mounting performance by containing a crystal chip into a package and prolonging an external lead terminal to the outside of the package. CONSTITUTION:The crystal chip 13 is fixed to one of external lead terminals 14 folded in advance with solder and the frequency of the crystal chip 13 is adjusted minutely in this state. Then the package 11 formed with a step 11a is mounted to the inner wall from the upper part of the crystal chip 13 fitted to the terminal 14 and the step 14a and both ends of the crystal chip 13 are fixed by an adhesives. A recessed part 11b for leading the terminals 14 is formed to the upper face of the wall of the package 11 and the terminals 14 are led toward the package 11 via the recessed part 11b. Then the crystal chip 13 supported in the package 11 is turned over, a cover 12 is fitted from the upper side, the terminals 14 are folded along the peripheral of the package 11 and prolonged up to the bottom face of the package 11. Thus, the crystal resonator with high quality and excellent mounting performance is obtained in this way.

Description

[Detailed description of the invention] [Industrial application field] The present invention relates to a chip type crystal resonator.

[Prior art]

In recent years, with the increasing density of electronic devices, many electronic components are required to be smaller and of higher quality.

Further, in order to reduce the cost of the above-mentioned devices, automated systems have been introduced for mounting electronic components on boards, and therefore electronic components are desired to have a simple shape that is easy to install.

However, in the conventional crystal resonator, the lead-out part of the electrode 2 formed on the crystal blank 1 is supported by four mounting pins provided on the base 3, and the outside is covered with a case 5 and attached to the base 3. It is designed to be covered, bonded and sealed. When a crystal resonator configured in this manner is assembled into a circuit board, in order to reduce its height, the lead terminals 6 must be bent by 90 degrees and the case 5 must be placed horizontally when mounted on the circuit board, resulting in poor vibration resistance. It had many drawbacks in terms of quality and ease of installation, such as deterioration and the difference in the mounting pitch dimensions of the lead terminals.

[Problem that the invention seeks to solve]

The present invention has been made in view of the above-mentioned drawbacks, and an object of the present invention is to provide a chip-type crystal resonator that is of high quality and has excellent mountability on a circuit board.

[Means for solving problems]

In order to achieve the above-mentioned object, the present invention supports a chip-type vibrator by supporting a crystal piece with a step formed on the inner wall of the casing, and extending lead terminals connected to lead electrodes of the crystal piece outside the casing. It is in the point of composition.

[Effect].

Since the present invention is configured as described above, the crystal piece is supported by the stepped portion inside the housing and has good vibration resistance, and the electrical connection with the circuit board is achieved through the lead terminal extending outside the housing. By extending the lead terminal along the outer periphery of the casing, precision can be achieved in the connection position with the board.

Furthermore, since the crystal piece container is a casing, it is easy to attach and can be easily introduced into an automated system.

〔Example〕

Embodiments of the present invention will be described below based on the drawings.

FIG. 1 is a sectional view of a chip-type crystal resonator of the present invention. Reference numeral 11 denotes a casing made of an electrically insulating material such as ceramic or resin, and 12 is also the same (a lid made of an electrically insulating material). The lower surfaces of both ends of the rectangular thickness-sliding crystal piece 13 are placed on the stepped portion 11a.At this time, the crystal piece 13 has excitation electrodes (not shown) formed on its main surface in advance, and Extracting electrodes (not shown) are formed so as to be extended to the upper surface side of both ends of the crystal piece 13 in the figure. Reference numeral 14 is a conductive material such as copper (Cu), Kovar (Fe-Ni-Co), etc. Outer K made of metal
This is the IJ-upper terminal, and one end of the external lead terminal 14 is conductively connected to the crystal piece 13 within the casing 11.

The external lead terminal 14 and the crystal piece 13 are connected as described above by connecting both ends of the crystal piece 13 to the surface of the lead electrode and the end of the external lead terminal 14 using a bonding agent such as solder or conductive adhesive. It is fixed in place. One end of the external lead terminal 14 is connected to the crystal piece 13 as described above, and the other end is connected to the casing 11.
It extends to the outside through a recess 11b formed on the upper surface, is bent along the outer wall of the casing 11, and extends to the bottom surface of the casing 11. (See FIG. 3) Therefore, soldering when mounting on a circuit board is easy. Note that the lid body 12
The housing 11 is fixed by adhesion using a heat-resistant adhesive or resin sealing.

Next, the manufacturing process I of the chip type crystal resonator of the present invention will be explained.

FIG. 4(a) to 4) are diagrams showing each process in an example in which the present invention is implemented with a rectangular vibrator number ζ.

A crystal piece 13 is fixed to one end of a pre-bent external lead terminal 14 with solder or conductive adhesive. (
FIG. 4(a)) In this state, the frequency of the crystal blank 13 can be finely adjusted. Next, attach the housing 11 with the inner wall multi-stepped portion 11a from the side of the crystal piece 13 fixed to the external lead terminal 14, and glue the stepped portion 11a and both ends of the crystal piece with adhesive such as silicone rubber. Fix it. The wall surface of the housing 11 has a recess 11 for leading out the external lead terminal 14.
b is formed, and the external lead terminal 14 is inserted into the recess 11.
1) Extends out of the housing 11 via (Fig. 4(b))
Next, the crystal piece 13 supported within the housing 11 is turned upside down, and the lid 12 is attached from above. The lid 12 is attached by, for example, using a heat-resistant resin for the lid 12, placing the lid 12 on the casing 11 in an atmosphere of N2 gas, etc., and bonding and fixing the two by using heat-resistant adhesive. .

(FIG. 4(C)) Finally, the external lead terminal 14 is bent along the outer periphery Iζ of the housing 11 and extended to the bottom surface of the housing 11 to form a chip-type crystal resonator. (FIG. 4(1)) The external lead terminal 14 extending to the bottom of the casing is placed on a predetermined conductive portion with the circuit board, so that it is treated as a chip component.

In the above embodiment, the crystal piece is sandwiched between the step part of the case and the external lead terminal, but the crystal piece is placed after the external lead terminal is placed on the step part of the case. Good too.

Further, a recess for leading out the external lead terminal may be provided on the lid side.

〔Effect of the invention〕

As described above, the present invention configures a chip-type crystal resonator by storing a crystal piece inside the housing and extending the external lead terminals to the outside of the housing, making it possible to obtain a high-quality crystal resonator with excellent wearability. can.

Furthermore, since the frequency can be adjusted in the process of fixing the crystal piece to the external lead terminal, the adjustment is easy and the process is not complicated, which improves the yield. Furthermore, since the mounting pitch on the board is determined by the dimensions of the casing, it is easy to use in an automated system.

[Brief explanation of drawings]

FIG. 1 is a sectional view showing a chip type crystal resonator of the present invention. FIG. 2 is a perspective view showing a conventional crystal resonator. FIG. 3 is a side view of the chip-type crystal resonator shown in FIG. 1. FIG. 4 (al to (, l) are diagrams showing the manufacturing process of the chip type resonator of the present invention. 1.13...Crystal piece 11...--Housing 12...・・・・・・Lid body

Claims (1)

[Claims] In a chip-type crystal resonator consisting of an insulating housing, a crystal piece housed in the housing, and a lid, a stepped portion is formed on the inner wall of the housing, and the stepped portion supports both ends of the crystal piece. A chip type crystal resonator, characterized in that external lead terminals connected to both ends of the crystal piece extend to the outer periphery of the casing.