JPS61163696A - 多層回路基板 - Google Patents

多層回路基板

Info

Publication number
JPS61163696A
JPS61163696A JP375985A JP375985A JPS61163696A JP S61163696 A JPS61163696 A JP S61163696A JP 375985 A JP375985 A JP 375985A JP 375985 A JP375985 A JP 375985A JP S61163696 A JPS61163696 A JP S61163696A
Authority
JP
Japan
Prior art keywords
weight
circuit board
multilayer circuit
crystallized glass
glass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP375985A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0416039B2 (fr
Inventor
白水　久晴
森川　朝男
助川　恒之
和夫 近藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Niterra Co Ltd
Original Assignee
NGK Spark Plug Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Spark Plug Co Ltd filed Critical NGK Spark Plug Co Ltd
Priority to JP375985A priority Critical patent/JPS61163696A/ja
Publication of JPS61163696A publication Critical patent/JPS61163696A/ja
Priority to US07/320,796 priority patent/US4943470A/en
Publication of JPH0416039B2 publication Critical patent/JPH0416039B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H05K3/4676—Single layer compositions

Landscapes

  • Glass Compositions (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP375985A 1985-01-11 1985-01-11 多層回路基板 Granted JPS61163696A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP375985A JPS61163696A (ja) 1985-01-11 1985-01-11 多層回路基板
US07/320,796 US4943470A (en) 1985-01-11 1989-03-09 Ceramic substrate for electrical devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP375985A JPS61163696A (ja) 1985-01-11 1985-01-11 多層回路基板

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP5000109A Division JPH0732312B2 (ja) 1993-01-04 1993-01-04 多層回路基板

Publications (2)

Publication Number Publication Date
JPS61163696A true JPS61163696A (ja) 1986-07-24
JPH0416039B2 JPH0416039B2 (fr) 1992-03-19

Family

ID=11566101

Family Applications (1)

Application Number Title Priority Date Filing Date
JP375985A Granted JPS61163696A (ja) 1985-01-11 1985-01-11 多層回路基板

Country Status (1)

Country Link
JP (1) JPS61163696A (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63147395A (ja) * 1986-12-10 1988-06-20 日本特殊陶業株式会社 高密度配線多層基板の製造法
JPS63265493A (ja) * 1987-04-23 1988-11-01 Fujitsu Ltd 多層セラミツク基板
WO2024253132A1 (fr) * 2023-06-07 2024-12-12 日本板硝子株式会社 Composition de verre, fibre de verre et charge de verre
WO2026042821A1 (fr) * 2024-08-21 2026-02-26 日本電気硝子株式会社 Substrat en verre, substrat en verre de support, stratifié, procédé de fabrication de stratifié et procédé de fabrication de boîtier de semi-conducteur

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS599992A (ja) * 1982-07-08 1984-01-19 株式会社日立製作所 多層配線基板の製造方法
JPS61111598A (ja) * 1984-10-13 1986-05-29 富士通株式会社 ガラスセラミツクス多層基板の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS599992A (ja) * 1982-07-08 1984-01-19 株式会社日立製作所 多層配線基板の製造方法
JPS61111598A (ja) * 1984-10-13 1986-05-29 富士通株式会社 ガラスセラミツクス多層基板の製造方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63147395A (ja) * 1986-12-10 1988-06-20 日本特殊陶業株式会社 高密度配線多層基板の製造法
JPS63265493A (ja) * 1987-04-23 1988-11-01 Fujitsu Ltd 多層セラミツク基板
WO2024253132A1 (fr) * 2023-06-07 2024-12-12 日本板硝子株式会社 Composition de verre, fibre de verre et charge de verre
JP7659709B1 (ja) * 2023-06-07 2025-04-09 日本板硝子株式会社 ガラス組成物、ガラス繊維、及びガラスフィラー
WO2026042821A1 (fr) * 2024-08-21 2026-02-26 日本電気硝子株式会社 Substrat en verre, substrat en verre de support, stratifié, procédé de fabrication de stratifié et procédé de fabrication de boîtier de semi-conducteur

Also Published As

Publication number Publication date
JPH0416039B2 (fr) 1992-03-19

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