JPS61179560A - 半導体素子実装用複合印刷配線基板 - Google Patents

半導体素子実装用複合印刷配線基板

Info

Publication number
JPS61179560A
JPS61179560A JP61020693A JP2069386A JPS61179560A JP S61179560 A JPS61179560 A JP S61179560A JP 61020693 A JP61020693 A JP 61020693A JP 2069386 A JP2069386 A JP 2069386A JP S61179560 A JPS61179560 A JP S61179560A
Authority
JP
Japan
Prior art keywords
hole
copper foil
semiconductor element
insulating substrate
lead wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61020693A
Other languages
English (en)
Japanese (ja)
Other versions
JPS623580B2 (2
Inventor
Toshiaki Uda
宇田　頴了
Kozo Matsuo
松尾　耕三
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RISHIYOU KOGYO KK
Risho Kogyo Co Ltd
Shindo Denshi Kogyo KK
Original Assignee
RISHIYOU KOGYO KK
Risho Kogyo Co Ltd
Shindo Denshi Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RISHIYOU KOGYO KK, Risho Kogyo Co Ltd, Shindo Denshi Kogyo KK filed Critical RISHIYOU KOGYO KK
Priority to JP61020693A priority Critical patent/JPS61179560A/ja
Publication of JPS61179560A publication Critical patent/JPS61179560A/ja
Publication of JPS623580B2 publication Critical patent/JPS623580B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/453—Leadframes comprising flexible metallic tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]

Landscapes

  • Structure Of Printed Boards (AREA)
  • Wire Bonding (AREA)
JP61020693A 1986-01-31 1986-01-31 半導体素子実装用複合印刷配線基板 Granted JPS61179560A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61020693A JPS61179560A (ja) 1986-01-31 1986-01-31 半導体素子実装用複合印刷配線基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61020693A JPS61179560A (ja) 1986-01-31 1986-01-31 半導体素子実装用複合印刷配線基板

Publications (2)

Publication Number Publication Date
JPS61179560A true JPS61179560A (ja) 1986-08-12
JPS623580B2 JPS623580B2 (2) 1987-01-26

Family

ID=12034232

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61020693A Granted JPS61179560A (ja) 1986-01-31 1986-01-31 半導体素子実装用複合印刷配線基板

Country Status (1)

Country Link
JP (1) JPS61179560A (2)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0569949A3 (en) * 1992-05-12 1994-06-15 Akira Kitahara Surface mount components and semifinished products thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0569949A3 (en) * 1992-05-12 1994-06-15 Akira Kitahara Surface mount components and semifinished products thereof
US5440452A (en) * 1992-05-12 1995-08-08 Akira Kitahara Surface mount components and semifinished products thereof
US5568363A (en) * 1992-05-12 1996-10-22 Kitahara; Akira Surface mount components and semifinished products thereof

Also Published As

Publication number Publication date
JPS623580B2 (2) 1987-01-26

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