JPS623580B2 - - Google Patents

Info

Publication number
JPS623580B2
JPS623580B2 JP61020693A JP2069386A JPS623580B2 JP S623580 B2 JPS623580 B2 JP S623580B2 JP 61020693 A JP61020693 A JP 61020693A JP 2069386 A JP2069386 A JP 2069386A JP S623580 B2 JPS623580 B2 JP S623580B2
Authority
JP
Japan
Prior art keywords
hole
copper foil
semiconductor element
insulating substrate
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP61020693A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61179560A (ja
Inventor
Toshiaki Uda
Kozo Matsuo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Risho Kogyo Co Ltd
Shindo Denshi Kogyo KK
Original Assignee
Risho Kogyo Co Ltd
Shindo Denshi Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Risho Kogyo Co Ltd, Shindo Denshi Kogyo KK filed Critical Risho Kogyo Co Ltd
Priority to JP61020693A priority Critical patent/JPS61179560A/ja
Publication of JPS61179560A publication Critical patent/JPS61179560A/ja
Publication of JPS623580B2 publication Critical patent/JPS623580B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/453—Leadframes comprising flexible metallic tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]

Landscapes

  • Wire Bonding (AREA)
  • Structure Of Printed Boards (AREA)
JP61020693A 1986-01-31 1986-01-31 半導体素子実装用複合印刷配線基板 Granted JPS61179560A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61020693A JPS61179560A (ja) 1986-01-31 1986-01-31 半導体素子実装用複合印刷配線基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61020693A JPS61179560A (ja) 1986-01-31 1986-01-31 半導体素子実装用複合印刷配線基板

Publications (2)

Publication Number Publication Date
JPS61179560A JPS61179560A (ja) 1986-08-12
JPS623580B2 true JPS623580B2 (2) 1987-01-26

Family

ID=12034232

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61020693A Granted JPS61179560A (ja) 1986-01-31 1986-01-31 半導体素子実装用複合印刷配線基板

Country Status (1)

Country Link
JP (1) JPS61179560A (2)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR930024126A (ko) * 1992-05-12 1993-12-22 아키라 기타하라 표면실장소자와 그의 반제품

Also Published As

Publication number Publication date
JPS61179560A (ja) 1986-08-12

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