JPS6119188A - 半導体レ−ザのチツプ製造方法 - Google Patents

半導体レ−ザのチツプ製造方法

Info

Publication number: JPS6119188A
Authority: JP; Japan
Prior art keywords: wafer; coating; cleavage; chip; film
Prior art date: 1984-07-05
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

JP59140127A

Other languages

English (en)

Japanese (ja)

Other versions

JPS647515B2 (th

Inventor

Haruo Tanaka

田中　治夫

Hayamizu Fukada

深田　速水

Masahito Mushigami

雅人虫上

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Rohm Co Ltd

Original Assignee

Rohm Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1984-07-05

Filing date

1984-07-05

Publication date

1986-01-28

1984-07-05 Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd

1984-07-05 Priority to JP59140127A priority Critical patent/JPS6119188A/ja

1986-01-28 Publication of JPS6119188A publication Critical patent/JPS6119188A/ja

1989-02-09 Publication of JPS647515B2 publication Critical patent/JPS647515B2/ja

Status Granted legal-status Critical Current

Links

239000004065 semiconductor Substances 0.000 title claims description 10
238000004519 manufacturing process Methods 0.000 title claims description 8
238000003776 cleavage reaction Methods 0.000 claims abstract description 35
230000007017 scission Effects 0.000 claims abstract description 35
238000000576 coating method Methods 0.000 claims abstract description 27
239000011248 coating agent Substances 0.000 claims abstract description 26
239000000853 adhesive Substances 0.000 claims abstract description 18
230000001070 adhesive effect Effects 0.000 claims abstract description 18
239000010410 layer Substances 0.000 claims abstract description 18
239000003513 alkali Substances 0.000 claims abstract description 4
239000002356 single layer Substances 0.000 claims abstract description 4
238000000034 method Methods 0.000 claims description 30
239000003963 antioxidant agent Substances 0.000 claims description 20
230000003078 antioxidant effect Effects 0.000 claims description 20
239000007888 film coating Substances 0.000 claims description 9
238000009501 film coating Methods 0.000 claims description 9
238000000926 separation method Methods 0.000 claims description 7
230000001681 protective effect Effects 0.000 claims description 4
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
238000005520 cutting process Methods 0.000 claims description 2
238000001035 drying Methods 0.000 claims description 2
238000005406 washing Methods 0.000 claims description 2
230000003064 anti-oxidating effect Effects 0.000 abstract description 8
239000011888 foil Substances 0.000 abstract description 6
BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 abstract description 2
239000002390 adhesive tape Substances 0.000 abstract description 2
229910052581 Si3N4 Inorganic materials 0.000 abstract 3
239000011295 pitch Substances 0.000 abstract 3
208000032544 Cicatrix Diseases 0.000 abstract 2
231100000241 scar Toxicity 0.000 abstract 2
230000037387 scars Effects 0.000 abstract 2
239000002585 base Substances 0.000 abstract 1
238000002955 isolation Methods 0.000 abstract 1
239000007788 liquid Substances 0.000 abstract 1
230000008018 melting Effects 0.000 abstract 1
238000002844 melting Methods 0.000 abstract 1
XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
229910052782 aluminium Inorganic materials 0.000 description 5
HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
229910003460 diamond Inorganic materials 0.000 description 3
239000010432 diamond Substances 0.000 description 3
241000257465 Echinoidea Species 0.000 description 2
PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
229910052593 corundum Inorganic materials 0.000 description 2
230000000694 effects Effects 0.000 description 2
239000000463 material Substances 0.000 description 2
230000003647 oxidation Effects 0.000 description 2
238000007254 oxidation reaction Methods 0.000 description 2
229910001845 yogo sapphire Inorganic materials 0.000 description 2
229910005091 Si3N Inorganic materials 0.000 description 1
230000002411 adverse Effects 0.000 description 1
239000012670 alkaline solution Substances 0.000 description 1
238000007796 conventional method Methods 0.000 description 1
238000005336 cracking Methods 0.000 description 1
239000012071 phase Substances 0.000 description 1
229920003023 plastic Polymers 0.000 description 1
239000004033 plastic Substances 0.000 description 1
238000003825 pressing Methods 0.000 description 1
239000011253 protective coating Substances 0.000 description 1
239000002994 raw material Substances 0.000 description 1
230000000630 rising effect Effects 0.000 description 1
238000004544 sputter deposition Methods 0.000 description 1
230000001629 suppression Effects 0.000 description 1
238000001947 vapour-phase growth Methods 0.000 description 1

Landscapes

Dicing (AREA)
Semiconductor Lasers (AREA)

JP59140127A 1984-07-05 1984-07-05 半導体レ−ザのチツプ製造方法 Granted JPS6119188A (ja)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP59140127A JPS6119188A (ja)	1984-07-05	1984-07-05	半導体レ−ザのチツプ製造方法

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP59140127A JPS6119188A (ja)	1984-07-05	1984-07-05	半導体レ−ザのチツプ製造方法

Publications (2)

Publication Number	Publication Date
JPS6119188A true JPS6119188A (ja)	1986-01-28
JPS647515B2 JPS647515B2 (th)	1989-02-09

Family

ID=15261524

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP59140127A Granted JPS6119188A (ja)	1984-07-05	1984-07-05	半導体レ−ザのチツプ製造方法

Country Status (1)

Country	Link
JP (1)	JPS6119188A (th)

1984
- 1984-07-05 JP JP59140127A patent/JPS6119188A/ja active Granted

Also Published As

Publication number	Publication date
JPS647515B2 (th)	1989-02-09

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