JPS647515B2 - - Google Patents
Info
- Publication number
- JPS647515B2 JPS647515B2 JP14012784A JP14012784A JPS647515B2 JP S647515 B2 JPS647515 B2 JP S647515B2 JP 14012784 A JP14012784 A JP 14012784A JP 14012784 A JP14012784 A JP 14012784A JP S647515 B2 JPS647515 B2 JP S647515B2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- coating
- cleavage
- film
- antioxidant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000003776 cleavage reaction Methods 0.000 claims description 38
- 230000007017 scission Effects 0.000 claims description 38
- 238000000576 coating method Methods 0.000 claims description 25
- 239000011248 coating agent Substances 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 24
- 239000000853 adhesive Substances 0.000 claims description 18
- 230000001070 adhesive effect Effects 0.000 claims description 18
- 239000010410 layer Substances 0.000 claims description 15
- 239000003963 antioxidant agent Substances 0.000 claims description 13
- 230000003078 antioxidant effect Effects 0.000 claims description 13
- 239000007888 film coating Substances 0.000 claims description 9
- 238000009501 film coating Methods 0.000 claims description 9
- 239000004065 semiconductor Substances 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 238000000926 separation method Methods 0.000 claims description 6
- 239000003513 alkali Substances 0.000 claims description 3
- 239000002356 single layer Substances 0.000 claims description 3
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 2
- 238000005520 cutting process Methods 0.000 claims description 2
- 238000003825 pressing Methods 0.000 claims description 2
- 239000011253 protective coating Substances 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 claims 10
- 230000003064 anti-oxidating effect Effects 0.000 description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- 239000011888 foil Substances 0.000 description 5
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 229910003460 diamond Inorganic materials 0.000 description 3
- 239000010432 diamond Substances 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
- 238000001947 vapour-phase growth Methods 0.000 description 1
Landscapes
- Dicing (AREA)
- Semiconductor Lasers (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59140127A JPS6119188A (ja) | 1984-07-05 | 1984-07-05 | 半導体レ−ザのチツプ製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59140127A JPS6119188A (ja) | 1984-07-05 | 1984-07-05 | 半導体レ−ザのチツプ製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6119188A JPS6119188A (ja) | 1986-01-28 |
| JPS647515B2 true JPS647515B2 (th) | 1989-02-09 |
Family
ID=15261524
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59140127A Granted JPS6119188A (ja) | 1984-07-05 | 1984-07-05 | 半導体レ−ザのチツプ製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6119188A (th) |
-
1984
- 1984-07-05 JP JP59140127A patent/JPS6119188A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6119188A (ja) | 1986-01-28 |
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