JPS61196561U - - Google Patents

Info

Publication number
JPS61196561U
JPS61196561U JP1985075874U JP7587485U JPS61196561U JP S61196561 U JPS61196561 U JP S61196561U JP 1985075874 U JP1985075874 U JP 1985075874U JP 7587485 U JP7587485 U JP 7587485U JP S61196561 U JPS61196561 U JP S61196561U
Authority
JP
Japan
Prior art keywords
bond part
base
wire bond
probe
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985075874U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985075874U priority Critical patent/JPS61196561U/ja
Publication of JPS61196561U publication Critical patent/JPS61196561U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案実施例の発光素子の斜視図、第
２図は従来の発光素子の平面図である。 １…（化合物半導体の）基台、１′…表面、２
…ｐｎ接合、３…電極、４…ワイヤボンド部、５
…プローブ部、６…裏面電極。

Claims (1)

    【実用新案登録請求の範囲】
  1. 表面に略平行なＰＮ接合を有する化合物半導体
    の基台と、その基台の表面に設けられ、円形又は
    角形のワイヤボンド部と、ワイヤボンド部の輪郭
    の１０％未満の領域に連接され、ワイヤボンド部
    に比べ充分小さい面積のプローブ部とを有した電
    極とを具備した事を特徴とする発光素子。
JP1985075874U 1985-05-22 1985-05-22 Pending JPS61196561U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985075874U JPS61196561U (ja) 1985-05-22 1985-05-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985075874U JPS61196561U (ja) 1985-05-22 1985-05-22

Publications (1)

Publication Number Publication Date
JPS61196561U true JPS61196561U (ja) 1986-12-08

Family

ID=30617500

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985075874U Pending JPS61196561U (ja) 1985-05-22 1985-05-22

Country Status (1)

Country Link
JP (1) JPS61196561U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998034285A1 (fr) * 1997-01-31 1998-08-06 Matsushita Electronics Corporation Element electroluminescent, dispositif electroluminescent a semiconducteur, et leur procede de production

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998034285A1 (fr) * 1997-01-31 1998-08-06 Matsushita Electronics Corporation Element electroluminescent, dispositif electroluminescent a semiconducteur, et leur procede de production

Similar Documents

Publication Publication Date Title
JPS61196561U (ja)
JPS62162860U (ja)
JPS6260053U (ja)
JPS6364035U (ja)
JPS6166947U (ja)
JPS61140553U (ja)
JPS6258059U (ja)
JPS61157350U (ja)
JPS61157349U (ja)
JPH031536U (ja)
JPS6382950U (ja)
JPS6226056U (ja)
JPS62182565U (ja)
JPS6296857U (ja)
JPS62162863U (ja)
JPS6324851U (ja)
JPS6294640U (ja)
JPS61162062U (ja)
JPS6282734U (ja)
JPS62124867U (ja)
JPS61144659U (ja)
JPH01113367U (ja)
JPS6239959U (ja)
JPH01112053U (ja)
JPS62147345U (ja)