JPS61197498U - - Google Patents
Info
- Publication number
- JPS61197498U JPS61197498U JP7933785U JP7933785U JPS61197498U JP S61197498 U JPS61197498 U JP S61197498U JP 7933785 U JP7933785 U JP 7933785U JP 7933785 U JP7933785 U JP 7933785U JP S61197498 U JPS61197498 U JP S61197498U
- Authority
- JP
- Japan
- Prior art keywords
- silicon
- group
- jig
- sintering
- filling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 2
- 239000011148 porous material Substances 0.000 claims description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 2
- 229910052710 silicon Inorganic materials 0.000 claims 2
- 239000010703 silicon Substances 0.000 claims 2
- 238000005245 sintering Methods 0.000 claims 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 1
Landscapes
- Ceramic Products (AREA)
- Furnace Charging Or Discharging (AREA)
Description
第１図は本考案に係る半導体物品用治具の素材
の拡大構造図、第２図は本考案に係る半導体物品
用治具の原型の斜視図、第３図は多孔質ＳｉＣ焼
結体の拡大構造図である。 １…ＳｉＣバー、２…気孔部、３…Ｐ型或いは
Ｎ型金属Ｓｉ充填部、４…半導体物品用治具の原
型。
の拡大構造図、第２図は本考案に係る半導体物品
用治具の原型の斜視図、第３図は多孔質ＳｉＣ焼
結体の拡大構造図である。 １…ＳｉＣバー、２…気孔部、３…Ｐ型或いは
Ｎ型金属Ｓｉ充填部、４…半導体物品用治具の原
型。
Claims (1)
- 珪素と炭素粉、あるいは炭化珪素粉を焼結させ
、焼結時に発生した気孔部を族又は族を含む
溶融シリコン中に浸して充填した素材からなるこ
とを特徴とする半導体物品用治具。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7933785U JPH0648860Y2 (ja) | 1985-05-29 | 1985-05-29 | 半導体ウエハ用治具 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7933785U JPH0648860Y2 (ja) | 1985-05-29 | 1985-05-29 | 半導体ウエハ用治具 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61197498U true JPS61197498U (ja) | 1986-12-09 |
| JPH0648860Y2 JPH0648860Y2 (ja) | 1994-12-12 |
Family
ID=30624156
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7933785U Expired - Lifetime JPH0648860Y2 (ja) | 1985-05-29 | 1985-05-29 | 半導体ウエハ用治具 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0648860Y2 (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02114441U (ja) * | 1989-02-28 | 1990-09-13 |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8377016B2 (en) | 2007-01-10 | 2013-02-19 | Wake Forest University Health Sciences | Apparatus and method for wound treatment employing periodic sub-atmospheric pressure |
| EP2205189B1 (en) | 2007-10-10 | 2017-12-06 | Wake Forest University Health Sciences | Devices for treating spinal cord tissue |
| KR100867961B1 (ko) * | 2007-12-14 | 2008-11-10 | 주식회사 월덱스 | 알파형 에스아이씨- 베타형 에스아이씨 결합형 반응소결에스아이씨 소재와 제조 방법 및 그 소재를 이용한 이체형플라즈마 챔버 캐소드 |
| CA2730362C (en) | 2008-07-18 | 2018-07-10 | Wake Forest University Health Sciences | Apparatus and method for cardiac tissue modulation by topical application of vacuum to minimize cell death and damage |
-
1985
- 1985-05-29 JP JP7933785U patent/JPH0648860Y2/ja not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02114441U (ja) * | 1989-02-28 | 1990-09-13 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0648860Y2 (ja) | 1994-12-12 |
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