JPS61223199A - リードフレームのメツキ処理装置 - Google Patents

リードフレームのメツキ処理装置

Info

Publication number: JPS61223199A
Authority: JP; Japan
Prior art keywords: lead frame; plating; rollers; treatment; liquid
Prior art date: 1986-02-28
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

JP4299986A

Other languages

English (en)

Japanese (ja)

Other versions

JPH0122357B2 (fr

Inventor

Kenji Yamamoto

健治山本

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

EEJA Ltd

Original Assignee

Electroplating Engineers of Japan Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1986-02-28

Filing date

1986-02-28

Publication date

1986-10-03

1986-02-28 Application filed by Electroplating Engineers of Japan Ltd filed Critical Electroplating Engineers of Japan Ltd

1986-02-28 Priority to JP4299986A priority Critical patent/JPS61223199A/ja

1986-10-03 Publication of JPS61223199A publication Critical patent/JPS61223199A/ja

1989-04-26 Publication of JPH0122357B2 publication Critical patent/JPH0122357B2/ja

Status Granted legal-status Critical Current

Links

238000007747 plating Methods 0.000 title claims abstract description 35
238000011282 treatment Methods 0.000 title abstract description 14
238000012545 processing Methods 0.000 claims description 34
239000007788 liquid Substances 0.000 abstract description 6
230000003449 preventive effect Effects 0.000 abstract 1
238000000034 method Methods 0.000 description 17
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
238000002203 pretreatment Methods 0.000 description 3
238000005406 washing Methods 0.000 description 3
230000000694 effects Effects 0.000 description 2
230000002265 prevention Effects 0.000 description 2
239000002253 acid Substances 0.000 description 1
239000003513 alkali Substances 0.000 description 1
238000005238 degreasing Methods 0.000 description 1
239000000463 material Substances 0.000 description 1
238000011328 necessary treatment Methods 0.000 description 1
238000006386 neutralization reaction Methods 0.000 description 1
238000012805 post-processing Methods 0.000 description 1
230000032258 transport Effects 0.000 description 1

Landscapes

Electroplating Methods And Accessories (AREA)

JP4299986A 1986-02-28 1986-02-28 リードフレームのメツキ処理装置 Granted JPS61223199A (ja)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP4299986A JPS61223199A (ja)	1986-02-28	1986-02-28	リードフレームのメツキ処理装置

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP4299986A JPS61223199A (ja)	1986-02-28	1986-02-28	リードフレームのメツキ処理装置

Related Parent Applications (1)

Application Number	Title	Priority Date	Filing Date
JP56141649A Division JPS5845399A (ja)	1981-09-10	1981-09-10	メツキ装置

Publications (2)

Publication Number	Publication Date
JPS61223199A true JPS61223199A (ja)	1986-10-03
JPH0122357B2 JPH0122357B2 (fr)	1989-04-26

Family

ID=12651711

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP4299986A Granted JPS61223199A (ja)	1986-02-28	1986-02-28	リードフレームのメツキ処理装置

Country Status (1)

Country	Link
JP (1)	JPS61223199A (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH02159400A (ja) *	1988-12-07	1990-06-19	Chemcut Corp	金属シート基材から保護被覆を電気分解により除去する方法及び装置
EP3232568A4 (fr) *	2014-12-11	2018-08-08	Hitachi Metals, Ltd.	Procédé de fabrication d'un élément de couvercle à scellage hermétique, élément de couvercle à scellage hermétique, et procédé de fabrication d'un emballage de stockage de composants électroniques

Citations (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS5429063A (en) *	1977-08-08	1979-03-03	Tokyo Shibaura Electric Co	Electroplating apparatus for print wire substrate

1986
- 1986-02-28 JP JP4299986A patent/JPS61223199A/ja active Granted

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS5429063A (en) *	1977-08-08	1979-03-03	Tokyo Shibaura Electric Co	Electroplating apparatus for print wire substrate

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH02159400A (ja) *	1988-12-07	1990-06-19	Chemcut Corp	金属シート基材から保護被覆を電気分解により除去する方法及び装置
EP3232568A4 (fr) *	2014-12-11	2018-08-08	Hitachi Metals, Ltd.	Procédé de fabrication d'un élément de couvercle à scellage hermétique, élément de couvercle à scellage hermétique, et procédé de fabrication d'un emballage de stockage de composants électroniques
US10461001B2 (en)	2014-12-11	2019-10-29	Hitachi Metals, Ltd.	Method for manufacturing hermetic sealing lid member, and method for manufacturing electronic component housing package

Also Published As

Publication number	Publication date
JPH0122357B2 (fr)	1989-04-26

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