JPS61228701A - Manufacture of microwave integrated circuit - Google Patents
Manufacture of microwave integrated circuitInfo
- Publication number
- JPS61228701A JPS61228701A JP3786486A JP3786486A JPS61228701A JP S61228701 A JPS61228701 A JP S61228701A JP 3786486 A JP3786486 A JP 3786486A JP 3786486 A JP3786486 A JP 3786486A JP S61228701 A JPS61228701 A JP S61228701A
- Authority
- JP
- Japan
- Prior art keywords
- ground conductor
- strip line
- dielectric
- base
- microwave
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 10
- 239000004020 conductor Substances 0.000 claims abstract description 30
- 239000003989 dielectric material Substances 0.000 claims description 14
- 239000000758 substrate Substances 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 abstract description 3
- 239000000126 substance Substances 0.000 abstract 6
- 230000003247 decreasing effect Effects 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 229910000679 solder Inorganic materials 0.000 description 8
- 239000006071 cream Substances 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
- H01P3/085—Triplate lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Waveguides (AREA)
Abstract
Description
【発明の詳細な説明】
本発明はマイクロ波ストリップラインを有するマイクロ
波集積回路の製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing a microwave integrated circuit having a microwave stripline.
第１図は増幅トランジスタ（Ｔ Ｒ＞、ストリップライ
ン（Ｌ １） （Ｌ ２）、抵抗（Ｒ１）（Ｒ２）（Ｒ
３）、容量（Ｃ１）（Ｃ２）（Ｃ３）（Ｃ４）（Ｃ６）
からなるマイクロ波増幅回路を示しているが、この増幅
回路を厚膜技術によりマイクロ波集積回路で形成した場
合の構造の一部を第２図に示す。Figure 1 shows the amplification transistor (T R>, strip line (L 1) (L 2), resistor (R1) (R2) (R
3), Capacity (C1) (C2) (C3) (C4) (C6)
FIG. 2 shows a part of the structure of this amplifier circuit formed by a microwave integrated circuit using thick film technology.
第２図において、誘電体（Ｄ）の一方の面に接地導体（
ａｌ）が設けられ、他面に導体や部品が設けられている
。第２図においては第１図と同一の記号を付して示して
いるが、抵抗やコンデンサとしてはチップ部品を用いて
いる。尚、（ａ ２） （ａ ３）（Ｒ４）部品は部品
取り付は用の電極である。ストリップライン（Ｌｌ）の
寸法は良く知られているように接地導体（ａｌ）とスト
リップライン（Ｌｌ）４こ挾まれた誘電体（Ｄ）の誘電
率の平方根に逆比例する関係で決められる。In Figure 2, a ground conductor (
al) is provided, and conductors and parts are provided on the other side. Although the same symbols as in FIG. 1 are used in FIG. 2, chip components are used as the resistors and capacitors. Note that parts (a2), (a3), and (R4) are electrodes for mounting parts. As is well known, the dimensions of the strip line (Ll) are determined inversely proportional to the square root of the permittivity of the dielectric material (D) sandwiched between the ground conductor (al) and the strip line (Ll).
このような集積回路のマイクロ波ストリップラインは誘
電体基板の両面に導体を印刷又は蒸着して形成するか、
両面銅張積層板を印刷やエツチングして形成するかして
いるが、斯る従来例は、いずれも誘電体（Ｄ）が基板と
なっていて回路を機械的にも保持する。従って誘電体と
して機械的に脆い材料が使用できず、その面からの制約
を受ける。そのため、誘電率の大きな材料を使用できな
いことが多く、ストリップライン（従ってマイクロ波集
積回路）のｉＪＸ型化ができないという欠点を有する。Microwave strip lines of such integrated circuits are formed by printing or vapor depositing conductors on both sides of a dielectric substrate, or by forming conductors on both sides of a dielectric substrate.
A double-sided copper-clad laminate is formed by printing or etching, but in all such conventional examples, the dielectric (D) serves as a substrate and also mechanically holds the circuit. Therefore, mechanically fragile materials cannot be used as the dielectric, and there are restrictions from this point of view. Therefore, it is often impossible to use a material with a large dielectric constant, and there is a drawback that it is impossible to convert the strip line (therefore, the microwave integrated circuit) into an iJX type.
また、誘電体による基板は極端に大きく形成できないか
ら製造工程においてエンドレスに近い形で連続送りする
（後で分割する）ことが不可能であり、製造上の能率が
悪い。Further, since a dielectric substrate cannot be made extremely large, it is impossible to continuously feed the substrate in an almost endless manner during the manufacturing process (divide it later), resulting in poor manufacturing efficiency.
本発明はこれらの欠点を払拭するように工夫した新規且
つ有効なマイクロ波集積回路の製造方法を提案するもの
である。The present invention proposes a novel and effective method for manufacturing microwave integrated circuits devised to eliminate these drawbacks.
以下図面に示した実施例に従って詳述する。A detailed description will be given below according to the embodiments shown in the drawings.
本発明では第３図に示すように金属板等の板状の接地導
体（１）を基板として、その上に誘電体（２）（３）を
設け、更にその上に設けられた導体（８）（９）とでス
トリップラインを形成したことを特徴としている。この
ように本発明では誘電体を基板とせずに、接地導体を基
板としていることによりストリップラインは基板の両面
に形成することができ、従って第３図は接地導体（１）
の両面（Ａ）（Ｂ）にマイクロ波集積回路を形成した場
合を示している。第３図において、（１０）（１１）は
半田レジスト、（１２）は接着剤、（１３）（１４）は
チップ部品、（１５）（１６）はチップ部品の電極、（
１７）は半田、（１８）はクリーム半田若しくは導電性
接着剤、〈１９）は両面の回路の接地をとるための導体
である。In the present invention, as shown in FIG. 3, a plate-shaped ground conductor (1) such as a metal plate is used as a substrate, dielectrics (2) and (3) are provided thereon, and a conductor (8 ) and (9) to form a strip line. In this way, in the present invention, the strip line can be formed on both sides of the substrate by using the ground conductor as the substrate instead of using the dielectric as the substrate. Therefore, FIG. 3 shows the ground conductor (1).
This shows the case where microwave integrated circuits are formed on both sides (A) and (B). In Figure 3, (10) and (11) are solder resists, (12) are adhesives, (13) and (14) are chip components, (15) and (16) are electrodes of chip components, and (
17) is solder, (18) is cream solder or conductive adhesive, and <19) is a conductor for grounding the circuits on both sides.
次に、第３図のようなマイクロ波集積回路を作成する手
順を第４図を参照して説明する。Next, the procedure for creating a microwave integrated circuit as shown in FIG. 3 will be explained with reference to FIG. 4.
第４１５！Ｉｆの［１］において、金属板よりなる接地
導体（１）には（Ｈｌ）（Ｈｌ）で示す孔加工が施され
る。415th! In [1] of If, holes shown as (Hl) (Hl) are formed in the ground conductor (1) made of a metal plate.
孔（Ｈｌ〉は接地導体（１）の上下に形成される回路を
互いに接続するために、また孔（Ｈｌ）はそれぞれの回
路の接地をとる〔従って接地導体（１）に接続する〕た
めに設けられたものである。The hole (Hl) is used to connect the circuits formed above and below the ground conductor (1) to each other, and the hole (Hl) is used to ground each circuit [therefore, connect it to the ground conductor (1)]. It has been established.
［１［］において、接地導体（１）にペースト状の誘電
体（２）を塗布又は印刷する。このとき孔（Ｈｌ）〈Ｈ
ｌ）にはペースト状誘電体（２）がタレ込んで（２ａ）
（２ｂ）の如くなる。In [1[], a paste-like dielectric material (2) is applied or printed on the ground conductor (1). At this time, the hole (Hl)
Paste dielectric material (2) drips into (2a)
(2b).
［１［］において、（６）の如きスキージを矢印方向に
所定の押圧力を接地導体（１〉に加えつつ移動させる。At [1], a squeegee like (6) is moved in the direction of the arrow while applying a predetermined pressing force to the ground conductor (1>).
［ＩＶ］において、［１［［］の結果、孔（）（１）（
Ｈｌ）には誘電体（２）が完全に詰った状態になる。In [IV], as a result of [1 [[], hole () (1) (
Hl) is completely filled with dielectric material (2).
［Ｖ］において、前記誘電体（２ａ）（ｚｂ）を指触乾
燥させた後、誘電体（２）を所定箇所に必要な厚みで塗
布又は印刷する。In [V], after the dielectrics (2a) and (zb) are dry to the touch, the dielectrics (2) are applied or printed at predetermined locations to a required thickness.
［ＶＩ］において、前記所定箇所に施された誘電体（２
〉を指触乾燥した後、接地導体（１）の（１３＞面に誘
電体（３）を同様に塗布又は印刷し、指触乾燥する。In [VI], the dielectric material (2
> is dry to the touch, then the dielectric (3) is similarly coated or printed on the (13> side of the ground conductor (1) and dried to the touch.
［■］において、プレスなどの方法により孔（Ｈｌ）（
Ｈｌ）部分に孔加工を施す。そのとき、孔（Ｈｌ）の壁
面には充分誘電体が存在するように配慮する。他方の孔
（Ｈｌ）については元の太き許になす。即ち、（Ｈｌ）
内の誘電体を全て除去する。In [■], holes (Hl) (
Hole processing is performed on the Hl) part. At this time, care must be taken to ensure that sufficient dielectric material exists on the wall surface of the hole (Hl). The other hole (Hl) is left to its original thickness. That is, (Hl)
Remove all dielectric material inside.
断る状態で、誘電体（２）（３）の焼成を行なう。次い
で全体を触媒液中に浸漬し、更に無電解メッキにて薄く
金属（例えば銅〉を付着せしめる。（図示せず）。In this state, the dielectrics (2) and (3) are fired. Next, the whole is immersed in a catalyst solution, and a thin layer of metal (for example, copper) is applied by electroless plating (not shown).
「■］において、ストリップライン及び接続電極を作成
する箇所及び（Ａ）（Ｂ）面の回路を接続する孔（Ｈｌ
）、接地孔（Ｈｌ）等を除く部分にメツキレシスト（４
）（５）を印刷等により施す。In "■", the locations where strip lines and connection electrodes are created and the holes (Hl) that connect the circuits on sides (A) and (B)
), Metsuki Resist (4
) (5) is applied by printing, etc.
［ＩＸ］において、電解メッキを行ない所定の厚さの金
属（例えば！＞（８）（９＞を設ける。このとき、接地
導体（１）が露出しているところには更に接地用金属（
１９）が付くことになる。次いでメツキレシスト（４）
（５）を剥離し、その後、軽くエツチングして不要な無
電解メッキ部分を除去する。In [IX], electroplating is performed to provide a metal (for example!>(8)(9>) of a predetermined thickness. At this time, a grounding metal (for example!
19) will be added. Next is Metsuki Resyst (4)
(5) is peeled off and then lightly etched to remove unnecessary electroless plated parts.
［ｘ］において、半田レジスト（１０）（１１）を（Ａ
）（Ｂ）両面に図示の如く設ける。In [x], solder resists (10) and (11) are (A
) (B) Provided on both sides as shown.
［Ｘ＋］において、電極間に接着剤（１２）を印刷若し
くはディスペンサで塗布する。この接着剤は熱硬化性の
ものを用いるものとする。At [X+], adhesive (12) is applied between the electrodes by printing or using a dispenser. This adhesive is thermosetting.
［Ｘｎ］において、チップ抵抗、チップロンデンサ、マ
イクロトランジスタ、ミニモールド半導体等のチップ部
品（１３）を接着剤（１２））：に装着し、加熱して該
接着剤（１２）を硬化させ、上記チップ部品（１３）を
仮止めする。In [Xn], a chip component (13) such as a chip resistor, a chip capacitor, a microtransistor, a mini-mold semiconductor, etc. is attached to an adhesive (12)), and the adhesive (12) is cured by heating; The chip component (13) is temporarily fixed.
［ＸＩ］において、接地導体（１）を反転させ電極にク
リーム半田若しくは導電性接着剤（１８）を印刷或はデ
ィスペンサにて塗布する。In [XI], the ground conductor (1) is reversed and cream solder or conductive adhesive (18) is applied to the electrode by printing or using a dispenser.
［Ｘ１１１］において、チップ部品（１４）を装着し、
その電極（１６）とクリーム半田若しくは導電性接着剤
（１８）とが重なるようにして加熱溶融させ、次いで６
一
（Ｂ）面を溶融半田槽に浸漬して、ブップ部品（１３）
の電極（１５〉と接地導体（１）上の電極（９）との電
気的に充分な結合を半田（１７）により行なう。At [X111], the chip component (14) is installed,
The electrode (16) and cream solder or conductive adhesive (18) are heated and melted so as to overlap, and then 6
Dip the first (B) side into the molten solder bath and make the bup part (13).
A sufficient electrical connection between the electrode (15>) and the electrode (9) on the ground conductor (1) is made by solder (17).
以上により、第３図の如きマイクロ波集積回路を作成で
きる。尚、上記（■）（■）（■）の金属を無電解及び
電解メッキで形成する代りに蒸着等により形成すること
も可能である如く、第３図の回路作成について第４図の
方法に限定されないことは言うを待たない。Through the above steps, a microwave integrated circuit as shown in FIG. 3 can be created. It should be noted that the method shown in Fig. 4 can be used to create the circuit shown in Fig. 3, as it is also possible to form the metals (■), (■), and (■) above by vapor deposition, etc. instead of by electroless or electrolytic plating. Needless to say, there are no limitations.
本発明によればマイクロ波ストリップラインは従来の如
く誘電体を基板とせずに、接地導体を基板としているの
で、機械的強度は充分にとることができると共に、その
上に設ける誘電体として誘電率の大きな材料を用いるこ
とができ、従ってストリップ波ラインの寸法はかなりノ
ｊへさくすることが可能となり、回路全体の小型化が期
待できる。According to the present invention, the microwave strip line does not use a dielectric as a substrate as in the past, but uses a ground conductor as a substrate, so it can have sufficient mechanical strength, and the dielectric material provided on top of the ground conductor has a dielectric constant. Therefore, the size of the strip wave line can be considerably reduced, and the overall size of the circuit can be expected to be reduced.
しかも、接地導体の両面に回路を設けることができるの
で、一層ｌＪＳ型となる。また、接地導体は金属板で実
現でき、かなり長いものであっても強度が大きいので、
製造ラインにおいて、金属板を連続して送り、最終工程
で順次分割して取り出すという手法を用いることができ
、製造能率が飛躍的に向上するという効果もあり、本発
明は極めて有効である。Moreover, since circuits can be provided on both sides of the ground conductor, it becomes even more of an lJS type. In addition, the ground conductor can be realized with a metal plate, and even if it is quite long, it has great strength, so
The present invention is extremely effective since it is possible to use a method in which metal plates are continuously fed in a production line and then sequentially divided and taken out in the final process, which dramatically improves production efficiency.
第１図はマイクロ波増幅回路を示す図面であり、第２図
は従来のマイクロ波集積回路の一部の構造を示す斜視図
である。第３図は本発明を実施したマイクロ波集積回路
の断面図であり、第４図は本発明の一実施例における製
造方法について説明するための図面である。
（１）・・接地導体、（２）（３）・・・誘電体、（８
）（９）・・・導体。FIG. 1 is a drawing showing a microwave amplifier circuit, and FIG. 2 is a perspective view showing the structure of a part of a conventional microwave integrated circuit. FIG. 3 is a sectional view of a microwave integrated circuit embodying the present invention, and FIG. 4 is a drawing for explaining a manufacturing method in one embodiment of the present invention. (1)...Grounding conductor, (2)(3)...Dielectric, (8
)(9)...Conductor.
Claims (1)
成する第１の工程と、前記両面に形成された誘電体の上
にマイクロ波ストリップラインを形成する第２の工程と
からなるマイクロ波集積回路の製造方法。(1) A microprocessor consisting of a first step of forming a dielectric material on both surfaces of a plate-shaped ground conductor as a substrate, and a second step of forming a microwave strip line on the dielectric material formed on both surfaces. A method for manufacturing wave integrated circuits.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3786486A JPS61228701A (en) | 1986-02-21 | 1986-02-21 | Manufacture of microwave integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3786486A JPS61228701A (en) | 1986-02-21 | 1986-02-21 | Manufacture of microwave integrated circuit |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP55099144A Division JPS6014521B2 (en) | 1980-07-18 | 1980-07-18 | microwave integrated circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61228701A true JPS61228701A (en) | 1986-10-11 |
| JPS64843B2 JPS64843B2 (en) | 1989-01-09 |
Family
ID=12509404
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3786486A Granted JPS61228701A (en) | 1986-02-21 | 1986-02-21 | Manufacture of microwave integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61228701A (en) |
-
1986
- 1986-02-21 JP JP3786486A patent/JPS61228701A/en active Granted
Non-Patent Citations (1)
| Title |
|---|
| MICROWAVES=1979 * |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS64843B2 (en) | 1989-01-09 |
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