JPS6130219Y2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an improvement in an inspection apparatus for semiconductor devices. formed on a silicon (Si) substrate
There are various types of semiconductor device testing devices that automatically test the electrical characteristics of semiconductor devices such as ICs and LSIs.Here, the conventional structure of the above-mentioned testing device will be explained with reference to FIG.

The figure schematically shows the main parts of a conventional measuring device, especially for MOS type semiconductor devices. A Si substrate 2 on which a semiconductor element is formed is mounted. A probe card 4 incorporating a plurality of probes 3 arranged in a predetermined pattern so as to be able to separately measure the test points of the semiconductor element is provided on this installation stand, and a substrate installation stand is installed on the probe card 4. moves and fits in, and the probe card is brought into contact with a predetermined location of the semiconductor element, while the lead wires 5 extending from the probe card are placed from the back side of the board installation stand and placed on the installation stand. The characteristics of the semiconductor device are tested while applying a substrate bias necessary for operation by contacting a predetermined location on the back side of the installed substrate and applying a voltage to the lead wire. However, when measuring a predetermined portion to be inspected of the semiconductor device, the predetermined portion to be inspected is aligned with the probe while rotating the substrate mounting table 1. For this reason, the lead wires extending from the probe card are formed in advance to be long enough to be placed on the printed board 6 so that there is no problem even when the board mounting table rotates.

However, when the lead wires are made long in this way, noise is picked up from the lead wires, which makes it impossible to accurately test the characteristics of the semiconductor device.

The present invention eliminates the above-mentioned drawbacks, shortens the length of the lead wire for applying voltage to the semiconductor device, picks up noise, etc. from the lead wire, and increases the temperature so that the test information of the semiconductor device measured does not fluctuate. The purpose of the present invention is to provide a reliable testing device for semiconductor devices.

A semiconductor device testing apparatus for achieving this purpose includes a rotatable installation stand on which a Si substrate on which a semiconductor element is formed, and a probe card having a probe for testing the electrical characteristics of a portion of the semiconductor element to be tested. A lead wire extending from the probe card is connected to the installation stand, and with a voltage applied to the lead wire, the probe is brought into contact with a portion to be inspected on the board to determine the characteristics of the semiconductor element with the board. In a semiconductor device testing device for testing a semiconductor device, a printed board is disposed around the periphery of the installation stand, and a lead wire having a contact terminal whose end comes into contact with the periphery of the installation stand is provided on the printed board. It is characterized by:

An embodiment of the present invention will be described in detail below with reference to the drawings.

FIG. 2 is a schematic diagram of the main parts of the semiconductor device inspection apparatus according to the present invention.

As shown in the figure, in the semiconductor device measuring device of the present invention, a printed circuit board 11 is provided around the periphery of a substrate mounting table 1, and the printed circuit board 11 extends from the probe card and extends from the back side of the Si substrate forming the semiconductor element. Wiring extending from the lead wire 5 for applying a voltage is branched at the relay point 12 to form lead wires 13A,
13B, 13C, and the lead wires 13A, 13
The tips of B and 13C are connected to a contact 14 made of a silver-plated thin elastic metal plate like a relay contact. The contact points are adapted to come into contact with the periphery of the substrate installation table 1 while rubbing against it when the substrate installation table 1 rotates. Here, in the figure, the lead wire 5 is branched into three directions at the relay point 12, and three contacts 14 are provided, but this means that even if one or two contacts wear out, the lead wire 5 can be redirected by other contacts. The wire 5 and the board mounting stand 1 are sufficiently connected.

As described above, according to the semiconductor device inspection device of the present invention, the length of the lead wire that extends from the probe card and contacts the board installation stand is shorter than that of the conventional device, and therefore the lead wire is shorter than the lead wire. There is also less noise picked up, resulting in the advantage that a highly reliable semiconductor device testing device with good testing accuracy can be obtained.

[Brief explanation of the drawing]

FIG. 1 is a schematic diagram of the main parts of a conventional semiconductor device testing apparatus, and FIG. 2 is a schematic diagram of the main parts of a testing apparatus according to the present invention. 1: Substrate installation stand, 2: Si substrate, 3: Probe,
4: Probe card, 5: Lead wire, 6, 11:
Printed circuit board, 12: Relay point, 13A, 13B,
13C: Lead wire, 14: Contact terminal.

Claims (1)

[Scope of utility model registration request] It consists of a rotatable installation stand on which a silicon (Si) substrate on which a semiconductor element is formed, and a probe card having a probe for testing the electrical characteristics of a portion to be tested of the semiconductor element, and a lead extending from the probe card. In a semiconductor device testing apparatus that tests the characteristics of a semiconductor element on a substrate by connecting a wire to the installation stand and bringing the probe into contact with a portion to be inspected on the substrate with a voltage applied to the lead wire, An inspection device for a semiconductor device, characterized in that a printed board is disposed around the periphery of the installation stand, and a lead wire having a contact terminal whose end comes into contact with the periphery of the installation stand is provided on the printed board. .