JPS614261A - Integrated circuit device - Google Patents

Integrated circuit device

Info

Publication number
JPS614261A
JPS614261A JP59126107A JP12610784A JPS614261A JP S614261 A JPS614261 A JP S614261A JP 59126107 A JP59126107 A JP 59126107A JP 12610784 A JP12610784 A JP 12610784A JP S614261 A JPS614261 A JP S614261A
Authority
JP
Japan
Prior art keywords
lead terminal
mold
integrated circuit
terminal
bending
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP59126107A
Other languages
Japanese (ja)
Inventor
Mamoru Sato
護 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP59126107A priority Critical patent/JPS614261A/en
Publication of JPS614261A publication Critical patent/JPS614261A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H10W70/427—Bent parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To prevent the bending and the like of an outer lead terminal, by bending the lead terminal of an integrated circuit in the inside of a mold, and taking out the terminal from the lower part of the mold. CONSTITUTION:A pellet 9, which is mounted on a lead frame 10, is connected to an outer lead terminal 7 by a metal wire 8 such as a gold wire. Bending machining of the outer lead terminal 7 is performed in the inside of a mold 6. The lead terminal is taken out of the lower part of the mold 6. The lead terminal 7, which is taken out in this way, is extremely strong against deformation such as bending. The positioning accuracy of the lead terminal is improved in comparison with a conventional lead-terminal taking out method.

Description

【発明の詳細な説明】 （産業上の利用分野） 本発明は集積回路装置のリード端子取り出し方式の改良
に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to an improvement in a lead terminal extraction method for an integrated circuit device.

（従来技術） 従来の集積回路装置のリード端子取り出し方式はモール
ド中央部ニジ取り出し、プリント基板等に取り付ける為
、リード端子部に曲げ加工を加えている。(Prior Art) The conventional method for taking out lead terminals of integrated circuit devices involves taking out the lead terminals from the center of the mold, and bending the lead terminals in order to attach them to a printed circuit board or the like.

例えば第２図においてリードフレーム５に取シ付けられ
た集積回路のペレット４（以下、ペレットと呼ぶ）は金
線等の金属線３により外部リード１．端子２と゛接続さ
れ、モールド部ｌの中央部より外部リード端子２として
外部へ引き出されている。For example, in FIG. 2, an integrated circuit pellet 4 (hereinafter referred to as pellet) attached to a lead frame 5 is connected to an external lead 1 by a metal wire 3 such as a gold wire. It is connected to the terminal 2 and drawn out from the center of the molded part 1 as an external lead terminal 2.

外部リード端子２はプリント基板等に接続する為曲げ加
工をほどこしである。The external lead terminal 2 is bent in order to be connected to a printed circuit board or the like.

（発明が解決しようとする問題点） 従来の外部リード取シ出し方式では、取シ扱いによって
は外部リード端子の曲り等を生じ、プリント基板等に実
装する際、リードを修正しなければならないという欠点
があった。(Problems to be Solved by the Invention) In the conventional external lead extraction method, the external lead terminals may be bent depending on the handling, and the leads must be corrected when mounted on a printed circuit board, etc. There were drawbacks.

本発明の目的はこれらの欠点を改良し取り扱いによって
外部リード端子の曲シ等を生じない集積回路装置を提供
することにある。SUMMARY OF THE INVENTION An object of the present invention is to improve these drawbacks and provide an integrated circuit device that does not cause bending of external lead terminals due to handling.

゛　　（問題点を解決するための手段）本発明は集積回
路のリード端子會モールド内部で曲げかつモールド下部
より引き出すことを特徴とする。(Means for solving the problem) The present invention is characterized in that the lead terminals of an integrated circuit are bent inside the mold and pulled out from the bottom of the mold.

本発明によれば外部リード端子の取り扱いＫよる曲りな
どは生ぜず、かつプリント基板等に接続する時に外部リ
ード端子の位置を精度よく出すことができる。According to the present invention, bending due to handling of the external lead terminal does not occur, and the position of the external lead terminal can be accurately determined when connecting to a printed circuit board or the like.

（実施例） 次に、本発明の一実施例を第１図によって説明する。同
図において、リードフレーム１０に載置されたペレット
９は金線等の金属ＩＪ８により外部リード端子７と接続
されている。外部リード端子７はモールド６内部におい
て曲げ加工がされておシかつモールド６の下部より外部
に引き出されている。このようにして外部に取シ出され
たリード端子７は極めて曲げ等の変形に強く、従来のリ
ード端子取り出し方式にくらベリード端子の位置精度が
向上するという利点をもっている。(Example) Next, an example of the present invention will be described with reference to FIG. In the figure, a pellet 9 placed on a lead frame 10 is connected to an external lead terminal 7 by a metal IJ8 such as a gold wire. The external lead terminals 7 are bent inside the mold 6 and are drawn out from the bottom of the mold 6. The lead terminal 7 taken out to the outside in this way is extremely resistant to deformation such as bending, and has the advantage that the positioning accuracy of the buried lead terminal is improved compared to the conventional lead terminal extraction method.

（発明の効果） 本発明によりブリント基板等へ実装する際リード曲シ等
の問題を解決し実装方式の大巾な歩留向上が期待できる
。(Effects of the Invention) The present invention can solve problems such as lead bending when mounting on a printed circuit board or the like, and can be expected to significantly improve the yield of the mounting method.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本発明の一実施例による集積回路装置の断面図
、第２図は従来の集積回路装置の断面図である。 １・・・・・・モールド部、２・・・・・・外部リード
端子、３・・・・・・金線等の金属線、４・・・・・・
集積回路ペレット、５・・・・・・リードフレーム、６
・旧・・モールｈ”部、　　７・・・・・・外部リード
端子、８・・・・・・金線等の金属線、９・・・・・・
集積回路ペレット、１０・・・・・・リードフレーム。FIG. 1 is a sectional view of an integrated circuit device according to an embodiment of the present invention, and FIG. 2 is a sectional view of a conventional integrated circuit device. 1...Mold part, 2...External lead terminal, 3...Metal wire such as gold wire, 4...
Integrated circuit pellet, 5...Lead frame, 6
・Old...Mall h" part, 7...External lead terminal, 8...Metal wire such as gold wire, 9...
Integrated circuit pellet, 10...lead frame.

Claims (1)

【特許請求の範囲】[Claims] 集積回路装置のリード端子をモールド内部で曲げかつモ
ールド下部より引き出すことを特徴とする集積回路装置
。An integrated circuit device characterized in that lead terminals of the integrated circuit device are bent inside the mold and pulled out from the bottom of the mold.
JP59126107A 1984-06-19 1984-06-19 Integrated circuit device Pending JPS614261A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59126107A JPS614261A (en) 1984-06-19 1984-06-19 Integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59126107A JPS614261A (en) 1984-06-19 1984-06-19 Integrated circuit device

Publications (1)

Publication Number Publication Date
JPS614261A true JPS614261A (en) 1986-01-10

Family

ID=14926791

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59126107A Pending JPS614261A (en) 1984-06-19 1984-06-19 Integrated circuit device

Country Status (1)

Country Link
JP (1) JPS614261A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0623954A1 (en) * 1993-05-07 1994-11-09 AT&T Corp. Molded plastic packaging of electronic devices
US5508557A (en) * 1992-10-09 1996-04-16 Rohm Co., Ltd. Surface mounting type diode

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5508557A (en) * 1992-10-09 1996-04-16 Rohm Co., Ltd. Surface mounting type diode
US5625223A (en) * 1992-10-09 1997-04-29 Rohm Co., Ltd. Surface mounting type diode
EP0623954A1 (en) * 1993-05-07 1994-11-09 AT&T Corp. Molded plastic packaging of electronic devices
US5548087A (en) * 1993-05-07 1996-08-20 At&T Corp. Molded plastic packaging of electronic devices

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