JPS6142857B2 - - Google Patents

Info

Publication number
JPS6142857B2
JPS6142857B2 JP53019288A JP1928878A JPS6142857B2 JP S6142857 B2 JPS6142857 B2 JP S6142857B2 JP 53019288 A JP53019288 A JP 53019288A JP 1928878 A JP1928878 A JP 1928878A JP S6142857 B2 JPS6142857 B2 JP S6142857B2
Authority
JP
Japan
Prior art keywords
die
base ribbon
bonding
guide pin
heater block
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP53019288A
Other languages
English (en)
Japanese (ja)
Other versions
JPS54111767A (en
Inventor
Manabu Bonshihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP1928878A priority Critical patent/JPS54111767A/ja
Publication of JPS54111767A publication Critical patent/JPS54111767A/ja
Publication of JPS6142857B2 publication Critical patent/JPS6142857B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Die Bonding (AREA)
JP1928878A 1978-02-21 1978-02-21 Manufacture for semiconductor device Granted JPS54111767A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1928878A JPS54111767A (en) 1978-02-21 1978-02-21 Manufacture for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1928878A JPS54111767A (en) 1978-02-21 1978-02-21 Manufacture for semiconductor device

Publications (2)

Publication Number Publication Date
JPS54111767A JPS54111767A (en) 1979-09-01
JPS6142857B2 true JPS6142857B2 (mo) 1986-09-24

Family

ID=11995248

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1928878A Granted JPS54111767A (en) 1978-02-21 1978-02-21 Manufacture for semiconductor device

Country Status (1)

Country Link
JP (1) JPS54111767A (mo)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5842617B2 (ja) * 1975-04-02 1983-09-21 株式会社日立製作所 ハンドウタイソウチノセイゾウソウチ
JPS5550997Y2 (mo) * 1975-07-10 1980-11-27
JPS5355966A (en) * 1976-10-30 1978-05-20 Shinkawa Seisakusho Kk Mechanism for catching lead frames

Also Published As

Publication number Publication date
JPS54111767A (en) 1979-09-01

Similar Documents

Publication Publication Date Title
JP3205235B2 (ja) リードフレーム、樹脂封止型半導体装置、その製造方法及び該製造方法で用いる半導体装置製造用金型
US5172851A (en) Method of forming a bump electrode and manufacturing a resin-encapsulated semiconductor device
US4801997A (en) High packing density lead frame and integrated circuit
JP2806328B2 (ja) 樹脂封止型半導体装置およびその製造方法
JP3049515B2 (ja) ワイヤボンデイング方法
US20250239567A1 (en) Methods of forming wire interconnect structures and related wire bonding tools
US20080067643A1 (en) Semiconductor device and method of manufacturing the same
KR100393935B1 (ko) 리드 프레임 및 이를 이용한 수지 봉지형 반도체 장치
JPS6142857B2 (mo)
JPH08148623A (ja) 半導体装置
JPH065645A (ja) 半導体素子の樹脂成形方法
JPH06151703A (ja) 半導体装置及びその成形方法
JPS61135145A (ja) リ−ドフレ−ム
JPH0653399A (ja) 樹脂封止型半導体装置
JP2621814B2 (ja) 樹脂封止型半導体装置
KR970007598B1 (ko) 와이어 본딩방법
JP2002050646A (ja) 半導体装置の製造方法
JPS5957439A (ja) 半導体装置
JPH0276240A (ja) ワイヤーボンディング装置
JPS63276234A (ja) ワイヤ−ボンディング方法
JPH0590320A (ja) ボール式ワイヤーボンデイング方法
JP2522557B2 (ja) 樹脂封止型半導体素子用リ―ドのフォ―ミング方法
JPH02202046A (ja) リードフレームおよびこれを用いた半導体装置の製造方法
JPH088285A (ja) 半導体装置
JPH05226534A (ja) 樹脂封止型半導体装置の製造方法