JPS6142858U - 厚膜回路装置 - Google Patents

厚膜回路装置

Info

Publication number
JPS6142858U
JPS6142858U JP1984128395U JP12839584U JPS6142858U JP S6142858 U JPS6142858 U JP S6142858U JP 1984128395 U JP1984128395 U JP 1984128395U JP 12839584 U JP12839584 U JP 12839584U JP S6142858 U JPS6142858 U JP S6142858U
Authority
JP
Japan
Prior art keywords
circuit device
thick film
film circuit
alumina substrate
electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984128395U
Other languages
English (en)
Inventor
真市 近田
崇 長坂
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Priority to JP1984128395U priority Critical patent/JPS6142858U/ja
Publication of JPS6142858U publication Critical patent/JPS6142858U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】 第１・図は本考案の一実施例を示す部分平面図、第２図
及び第３図は本考案の説明に用いる部分断面図である。 １・・・アルミナ基板、２Ａ〜２Ｅ・・・導体、３Ａ〜
３Ｇ・・・電極、４・・・絶縁被膜、４Ａ〜４Ｃ・・・
延長被，膜、４ｄ：・・中間被膜。

Claims (1)

    【実用新案登録請求の範囲】
  1. アルミナ基板上に複数の電極が形成され、これらの電極
    のうちで近接した異なる電極間のアルミナ基板上に所定
    形状のガラス膜が被着された厚膜回路装置。
JP1984128395U 1984-08-23 1984-08-23 厚膜回路装置 Pending JPS6142858U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984128395U JPS6142858U (ja) 1984-08-23 1984-08-23 厚膜回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984128395U JPS6142858U (ja) 1984-08-23 1984-08-23 厚膜回路装置

Publications (1)

Publication Number Publication Date
JPS6142858U true JPS6142858U (ja) 1986-03-19

Family

ID=30687023

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984128395U Pending JPS6142858U (ja) 1984-08-23 1984-08-23 厚膜回路装置

Country Status (1)

Country Link
JP (1) JPS6142858U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0425143A (ja) * 1990-05-21 1992-01-28 Matsushita Electric Ind Co Ltd 回路基板及び半導体装置
KR101143530B1 (ko) 2010-08-09 2012-05-09 삼성전기주식회사 인쇄회로기판 및 인쇄회로기판 제조방법

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0425143A (ja) * 1990-05-21 1992-01-28 Matsushita Electric Ind Co Ltd 回路基板及び半導体装置
KR101143530B1 (ko) 2010-08-09 2012-05-09 삼성전기주식회사 인쇄회로기판 및 인쇄회로기판 제조방법

Similar Documents

Publication Publication Date Title
JPS5889926U (ja) 貫通コンデンサ
JPS6033411U (ja) 集合抵抗体
JPS5839030U (ja) コンデンサ素子
JPS6037236U (ja) 厚膜コンデンサ
JPS5956704U (ja) チツプ抵抗
JPS58148903U (ja) チツプ抵抗体
JPS5921740U (ja) 温度検出器
JPS59187048U (ja) 温度ヒユ−ズ
JPS6133081U (ja) 電極基板
JPS60192401U (ja) チツプ抵抗器
JPS58160431U (ja) スイツチの電極パタ−ン
JPS58109201U (ja) チツプ抵抗器
JPS60137404U (ja) 集合抵抗器
JPS6049670U (ja) 湿式多層基板
JPS58150829U (ja) 貫通形コンデンサ
JPS59101427U (ja) 厚膜コンデンサ
JPS59127203U (ja) チツプ固定抵抗器
JPS59173301U (ja) チツプ型抵抗器
JPS6115754U (ja) 集積回路容器
JPS6339998U (ja)
JPS59169031U (ja) 厚膜コンデンサ
JPS619802U (ja) 小型抵抗器
JPS5854127U (ja) 表面波装置
JPS61199043U (ja)
JPS60156747U (ja) 半導体装置