JPS6146090A - Metal base metal-lined board - Google Patents

Metal base metal-lined board

Info

Publication number
JPS6146090A
JPS6146090A JP16812784A JP16812784A JPS6146090A JP S6146090 A JPS6146090 A JP S6146090A JP 16812784 A JP16812784 A JP 16812784A JP 16812784 A JP16812784 A JP 16812784A JP S6146090 A JPS6146090 A JP S6146090A
Authority
JP
Japan
Prior art keywords
metal
resin
insulating layer
nonwoven fabric
metal plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16812784A
Other languages
Japanese (ja)
Inventor
武司 加納
徹 樋口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP16812784A priority Critical patent/JPS6146090A/en
Publication of JPS6146090A publication Critical patent/JPS6146090A/en
Pending legal-status Critical Current

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  • Insulated Metal Substrates For Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 [技術分野] 本発明は耐熱性、耐湿性などに優れた金属ベース金属張
積層板に関するものである。
DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a metal-based metal-clad laminate having excellent heat resistance and moisture resistance.

[背景技術1 従来、金属板をベースとして金属ベース金属張MLJf
fl板を製造するにあたっては、第2図に示すように絶
縁/l!3としてガラス線布にaI脂が含浸されたプリ
プレグ5を使用し、このプリプレグ5を金属板2の表面
に複数枚積載した後、その表面に金属Tti4を重ねて
加熱・加圧成形して金属ベース金属張積層板を製造して
いるものであった。しかしながら、この製造法ではプリ
プレグ中のul脂含有量が低い場合には、金属板と接触
する0(脂量が少ないため密着力が低く、耐湿性、耐熱
性等に劣るという欠点を有しており、逆にプリプレグ中
の樹脂含有量が多い場合には、!1脂が表面にしみ出し
て成形時に滑ることがあり成形し難いものであった。ま
た、金属ベース金属張積層板の他の製造法として、第3
図に示すように絶縁層3として樹脂/156で形成する
方法もあるが、この方法にあっては強度が充分でないた
めに半田ごて等での半田付は時に絶縁層3を破壊する場
合があるという欠点があった。
[Background technology 1 Conventionally, metal-based metal-clad MLJf using a metal plate as a base
When manufacturing the fl board, the insulation/l! As 3, a prepreg 5 in which a glass wire cloth is impregnated with aI fat is used, and after stacking a plurality of prepregs 5 on the surface of the metal plate 2, a metal Tti 4 is overlapped on the surface and heated and press-formed to form a metal. The company was manufacturing base metal-clad laminates. However, this manufacturing method has the disadvantage that when the prepreg has a low ul fat content, it comes into contact with the metal plate (due to the small amount of fat, the adhesion is low, and the moisture resistance, heat resistance, etc. are poor). On the other hand, when the resin content in the prepreg is high, the !1 fat seeps out onto the surface and slips during molding, making it difficult to mold. As a manufacturing method, the third
As shown in the figure, there is a method of forming the insulating layer 3 with resin/156, but this method does not have sufficient strength, so soldering with a soldering iron etc. may sometimes destroy the insulating layer 3. There was a drawback.

[発明の目的] 本発明は上記の点に鑑みて成されたものであって、耐熱
性、耐湿性に優れた金属ベース金属張積層板を提供する
ことを目的とするものである。
[Object of the Invention] The present invention has been made in view of the above points, and an object of the present invention is to provide a metal-based metal-clad laminate having excellent heat resistance and moisture resistance.

[発明の開示] すなわち、本発明の金属ベース金属張積層板は、金属板
2の表面にガラス不織布に樹脂が含浸された絶縁層3を
介して金属W4を積層して成ることを特徴とするもので
、絶縁層3の凸材としてガラス不織布を用いることによ
り上記巨的を達成したものである。
[Disclosure of the Invention] That is, the metal-base metal-clad laminate of the present invention is characterized in that a metal W4 is laminated on the surface of a metal plate 2 via an insulating layer 3 made of glass nonwoven fabric impregnated with resin. This achievement was achieved by using a glass nonwoven fabric as the convex material of the insulating layer 3.

以下本発明の詳細な説明する。本発明に使用する絶縁f
r!i3としてはガラス不織布に樹脂を含浸させたり(
脂含浸〃ラス不織布を用いるものである。
The present invention will be explained in detail below. Insulation f used in the present invention
r! For i3, glass nonwoven fabric is impregnated with resin (
It uses oil-impregnated lath nonwoven fabric.

樹脂としては限定するものでないが、例えばエポキシ樹
脂、ポリイミド樹脂等を用いることができ、また含浸す
る樹脂固形分とガラス不織布との重量比は0.7: 1
〜30:1の範囲に設定するのが好ましい、樹脂の固形
分量がガラス不織布1に対して0゜7未満の場合にはa
t脂が含浸し難く特性が出ないものであり、また樹脂の
固形分量がガラス不織布1に対して30を超える場合に
は成形時に信相の流れ出し量が多くなり成形し難くなる
ものである。
Although the resin is not limited, for example, epoxy resin, polyimide resin, etc. can be used, and the weight ratio of the solid content of the impregnated resin to the glass nonwoven fabric is 0.7:1.
It is preferable to set the solid content in the range of ~30:1, and if the solid content of the resin is less than 0.7 to 1 part of the glass nonwoven fabric, a
It is difficult to impregnate with T fat and the properties are not obtained. Also, if the solid content of the resin exceeds 30% of the glass nonwoven fabric, the amount of resin flowing out during molding increases, making molding difficult.

また、樹脂中に無機光Aft′M及びカップリング剤を
配合しておくのが好ましい。無我充填剤としては、水酸
化アルミニウム、炭酸カルシウム、アルミナ、窒化硅素
、窒化はう素、石英等を使用することができ、無我充填
剤の配合量は重量比で樹脂固形分1に対して0.2〜9
程度が好ましい、無我充填剤の配合量が0.2未満の場
合にはドリル加工性に劣るものであり、無機充填剤の配
合量が9を超える場合には樹脂が基材に含浸し難くなる
ものである。
Further, it is preferable to blend inorganic light Aft'M and a coupling agent into the resin. As the Mugo filler, aluminum hydroxide, calcium carbonate, alumina, silicon nitride, boron nitride, quartz, etc. can be used. Te0.2~9
If the amount of the inorganic filler is less than 0.2, the drill workability is poor, and if the amount of the inorganic filler is more than 9, it is difficult for the resin to impregnate the base material. It is what it is.

カップリング剤としては、シラン系カンプリング剤やチ
タネート系カップリング剤等を使用することができ、樹
脂固形分に対して0.01〜2.0重量%程度混入する
のが好ましい、このようにして作成した樹脂含浸ガラス
不織布の絶縁層3を第1図に示すように金属板2の表面
に積載し、その上に銅箔等の金属M4を重ねて加熱・加
圧成形し、金属ベース金属張積層板を得るのである。
As the coupling agent, a silane-based camping agent, a titanate-based coupling agent, etc. can be used, and it is preferable to mix it in an amount of about 0.01 to 2.0% by weight based on the solid content of the resin. The insulating layer 3 of the resin-impregnated glass nonwoven fabric prepared by the above method is placed on the surface of the metal plate 2 as shown in FIG. This results in a stretched laminate.

しかして、絶縁層3の基材としてガラス不織布を使用す
ることにより、絶M/I3中の樹脂含有量が少ない場合
であっても成形時に溶融した樹脂が金属板2表面に接触
して密着性を向上することができるものである。また、
絶縁層3内のりfBゴ含有量が多い場合にはガラス不織
布中にυを脂が含まれた状態となって絶縁/!13の表
面に樹脂がしみ出し難く、従って成形時に滑るというこ
とがないものである。また、基材としてガラス不織布を
使用しているために、従来のガラス繊布を基材に使用し
た場合に比してドリル加工性が優れているものであり、
しかも耐熱性、耐湿性、スルーホール部の耐熱ショック
性に優れているものである。なお、上記実施例では金属
板2の片面に絶縁/i53及び、金属i4を積層してい
るが、4を成板2の両面にそれらを積層しても良いのは
勿論である0、以下本発明を実施例及び従来例に基づい
て具体的に説明する。
Therefore, by using a glass nonwoven fabric as the base material of the insulating layer 3, even if the resin content in the absolute M/I 3 is small, the molten resin during molding will come into contact with the surface of the metal plate 2, resulting in good adhesion. This is something that can be improved. Also,
If the content of glue in the insulating layer 3 is high, the glass nonwoven fabric will contain υ fat, resulting in poor insulation/! The resin hardly oozes out onto the surface of the mold 13, so there is no possibility of slipping during molding. In addition, since glass non-woven fabric is used as the base material, drill workability is superior to that when conventional glass fiber fabric is used as the base material.
Moreover, it has excellent heat resistance, moisture resistance, and heat shock resistance of the through-hole portion. In the above embodiment, insulation/i53 and metal i4 are laminated on one side of the metal plate 2, but it goes without saying that they may be laminated on both sides of the laminated plate 2. The invention will be specifically explained based on embodiments and conventional examples.

及1匠 プラス不織布にエポキシ樹脂が含浸された樹脂含浸ガラ
ス不織布を絶縁層として金属板の表面に積載した後、銅
箔をその表面に重ねて加熱加圧成形し、金属ベース鋼張
積層板を得た。
1. A resin-impregnated glass non-woven fabric made of Takumi Plus non-woven fabric impregnated with epoxy resin is laminated on the surface of a metal plate as an insulating layer, and then copper foil is layered on the surface and heated and press-formed to form a metal-based steel-clad laminate. Obtained.

え1乱L 〃ラス織布にエポキシ樹脂が含浸されたプリプレグを絶
縁層として金属板の表面に積載した後、銅箔をその表面
に重ねて加熱加圧成形し、4を属ベース銅張積層板を得
た。
E1Ran L〃A prepreg made of lath woven cloth impregnated with epoxy resin is laminated on the surface of a metal plate as an insulating layer, and then copper foil is layered on the surface and heated and pressure molded to form 4. Got the board.

弧迷」[ζ エポキシ樹脂を絶縁層として金属板の表裏面に塗布し、
次いで金属張をその表面に重ねて加熱加圧成形し、金属
ベース銅張積層板を得た。
``Akumei'' [ζ Epoxy resin is applied as an insulating layer to the front and back surfaces of the metal plate,
Next, metal cladding was layered on the surface and molded under heat and pressure to obtain a metal-based copper clad laminate.

次に、上記で得られた金属ミース銅張積層板の耐熱性、
耐湿性及び耐熱ショック性を試験した。
Next, the heat resistance of the metal Mies copper clad laminate obtained above,
Moisture resistance and heat shock resistance were tested.

耐熱性試験は260℃牛田処半田の@箔剥離等の異常を
目視にて観察することにより行い、耐湿性試験は60℃
・90%の雰囲気中に1000時間放置し、目視にて異
常をa*することにより行った。スルーホール部の耐熱
ショック性試験は、260°Cの油中に10秒間浸漬し
た後、直ぐ室温の水中に10秒間浸漬し、続いて室温の
トリクレン中に10秒間浸漬する行程を1サイクルとし
、異常が発生するサイクル数で表した。その結果を表1
に示す0表1の結果より、実施例の積層板においては耐
熱性、耐湿性及び耐熱ショック性が向上したことが確認
された。
The heat resistance test was conducted at 260℃ by visually observing abnormalities such as peeling of the solder @ foil at 260℃, and the moisture resistance test was conducted at 60℃.
・This test was performed by leaving the sample in a 90% atmosphere for 1000 hours and visually checking for abnormalities. In the heat shock resistance test of the through-hole part, one cycle consists of immersing it in oil at 260°C for 10 seconds, immediately immersing it in water at room temperature for 10 seconds, and then immersing it in Trichlorine at room temperature for 10 seconds. It is expressed as the number of cycles in which the abnormality occurs. Table 1 shows the results.
From the results shown in Table 1, it was confirmed that the laminates of Examples had improved heat resistance, moisture resistance, and heat shock resistance.

表1 [発明の効果] 上記のように本発明は、金属板の表面にガラス不織布に
樹脂が含fj:された絶縁層を介して金属箔を積層した
ので、絶縁層中の樹脂の含有量が少ない場合でも樹脂を
金属板の表面に充分接触させることができて密着力を上
げることができ、耐熱性、耐温性、耐熱ショック性を向
上することがでさるものである。また樹脂の含有量が多
い場合でも成形時の滑りを無くして成形をし易くするこ
とができるものである。
Table 1 [Effects of the Invention] As described above, in the present invention, a metal foil is laminated on the surface of a metal plate via an insulating layer in which a glass nonwoven fabric contains resin, so that the resin content in the insulating layer is Even when the amount of resin is small, the resin can be brought into sufficient contact with the surface of the metal plate to increase adhesion, and the heat resistance, temperature resistance, and heat shock resistance can be improved. Furthermore, even when the resin content is high, slippage during molding can be eliminated and molding can be facilitated.

【図面の簡単な説明】[Brief explanation of drawings]

11図は本発明一実施例の概略断面図、第2図は従来例
の概略断面図、第3図は他の従来例の概略断面図である
。 2は金属板、3は絶縁層、4は金属箔である。
11 is a schematic sectional view of one embodiment of the present invention, FIG. 2 is a schematic sectional view of a conventional example, and FIG. 3 is a schematic sectional view of another conventional example. 2 is a metal plate, 3 is an insulating layer, and 4 is a metal foil.

Claims (1)

【特許請求の範囲】[Claims] (1)金属板の表面にガラス不織布に樹脂が含浸された
絶縁層を介して金属箔を積層して成ることを特徴とする
金属ベース金属張積層板。
(1) A metal-based metal-clad laminate comprising a metal foil laminated on the surface of a metal plate through an insulating layer of glass nonwoven fabric impregnated with resin.
JP16812784A 1984-08-11 1984-08-11 Metal base metal-lined board Pending JPS6146090A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16812784A JPS6146090A (en) 1984-08-11 1984-08-11 Metal base metal-lined board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16812784A JPS6146090A (en) 1984-08-11 1984-08-11 Metal base metal-lined board

Publications (1)

Publication Number Publication Date
JPS6146090A true JPS6146090A (en) 1986-03-06

Family

ID=15862339

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16812784A Pending JPS6146090A (en) 1984-08-11 1984-08-11 Metal base metal-lined board

Country Status (1)

Country Link
JP (1) JPS6146090A (en)

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