JPS6146740U - 半導体素子用容器 - Google Patents

半導体素子用容器

Info

Publication number
JPS6146740U
JPS6146740U JP1984131608U JP13160884U JPS6146740U JP S6146740 U JPS6146740 U JP S6146740U JP 1984131608 U JP1984131608 U JP 1984131608U JP 13160884 U JP13160884 U JP 13160884U JP S6146740 U JPS6146740 U JP S6146740U
Authority
JP
Japan
Prior art keywords
container
semiconductor devices
ceramic
seal ring
metallized layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984131608U
Other languages
English (en)
Inventor
高志 木下
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1984131608U priority Critical patent/JPS6146740U/ja
Publication of JPS6146740U publication Critical patent/JPS6146740U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Ceramic Products (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
′ 第１図、第２図はそれぞれ本考案に基づくセラミッ
クケースの実施例を示す部分詳細断面図、第３図は従来
構造のセラミックケースの断面図。 第４図はその部分詳細断面図である。 １・・・・・・セラミック基体、２・・・・・・外部リ
ード、３・・・・・・シールリング、４・・・・・・半
導体素子、５・・・・・・キャップ、６・・・・・・タ
ングステンメタライズ層、７・・・・・・Ｎｉメッキ層
、８・・・・・・Ａｇ−Ｃｕロウ材、９・・・・・・タ
ングステンメタライズ層とセラミック基体との界面、１
０・・・・・・凹凸形状。

Claims (1)

    【実用新案登録請求の範囲】
  1. セラミック基板上にシールリングを有する半導体素子用
    容器において、シールリング取付用メタライズ層が設け
    られたセラミック面が、他のセラミック面よりも粗面で
    あることを特徴とする半導体素子用容器。
JP1984131608U 1984-08-30 1984-08-30 半導体素子用容器 Pending JPS6146740U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984131608U JPS6146740U (ja) 1984-08-30 1984-08-30 半導体素子用容器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984131608U JPS6146740U (ja) 1984-08-30 1984-08-30 半導体素子用容器

Publications (1)

Publication Number Publication Date
JPS6146740U true JPS6146740U (ja) 1986-03-28

Family

ID=30690186

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984131608U Pending JPS6146740U (ja) 1984-08-30 1984-08-30 半導体素子用容器

Country Status (1)

Country Link
JP (1) JPS6146740U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03224251A (ja) * 1989-12-19 1991-10-03 Fujitsu Ltd 半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03224251A (ja) * 1989-12-19 1991-10-03 Fujitsu Ltd 半導体装置

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