JPS6146744U - Heat dissipation mechanism for integrated circuit devices - Google Patents
Heat dissipation mechanism for integrated circuit devicesInfo
- Publication number
- JPS6146744U JPS6146744U JP13239184U JP13239184U JPS6146744U JP S6146744 U JPS6146744 U JP S6146744U JP 13239184 U JP13239184 U JP 13239184U JP 13239184 U JP13239184 U JP 13239184U JP S6146744 U JPS6146744 U JP S6146744U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- heat dissipation
- circuit device
- dissipation mechanism
- circuit devices
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本考案の一実施例に従って構成された集積回路
装置の放熱機構の概念的な斜視構成図、第２図は第１図
の放熱機構に用いた放熱板の展開溝成図であり、第３図
は集積回路装置と共に上記放熱板をプリント回路基板に
実装した状態を示す説明図、第４図及び第５図は集積回
路装置に対する従来の放熱手段を各々概念的に示す説明
図である。
１・・・・・・放熱板、２・・・・・・平坦部、３・・
・・・・フィン状部、４・・・・・・起立部、５・・・
・・・絶縁体、６・・・・・・集積回路装置、７・・・
・・・プリント回路基板。FIG. 1 is a conceptual perspective configuration diagram of a heat dissipation mechanism of an integrated circuit device constructed according to an embodiment of the present invention, and FIG. 2 is a developed groove diagram of a heat dissipation plate used in the heat dissipation mechanism of FIG. , FIG. 3 is an explanatory diagram showing the state in which the heat dissipation plate is mounted on a printed circuit board together with an integrated circuit device, and FIGS. 4 and 5 are explanatory diagrams each conceptually showing conventional heat dissipation means for the integrated circuit device. be. 1... Heat sink, 2... Flat part, 3...
・・・Fin-shaped part, 4... Standing part, 5...
...Insulator, 6...Integrated circuit device, 7...
...Printed circuit board.
Claims (3)
面から上面に接触包囲するように配装した熱伝導性の良
好な放熱板を備えるように構成したことを特徴とする集
積回路装置の放熱機構。(1) Heat dissipation of an integrated circuit device, characterized in that it is configured to include a heat dissipation plate with good thermal conductivity arranged so as to contact and surround the integrated circuit device from the bottom surface to the top surface of the integrated circuit device mounted on a printed circuit board. mechanism.
分にフィン状の起立部を有する実用新案登録請求の範囲
第１項に記載の集積回路装置の放熱機構。(2) The heat dissipation mechanism for an integrated circuit device according to claim 1, wherein the heat dissipation plate has a fin-shaped upright portion on the upper surface +g of the integrated circuit device.
前記プリント回路基板側に絶縁体を配設するようにした
実用新案登録請求の範囲第（１）項又は第（２）項に記
載の集積回路装置の放熱機構。(3) Utility model registration according to claim (1) or (2), in which an insulator is provided on the printed circuit board side of the heat sink portion located on the bottom surface of the integrated circuit device. heat dissipation mechanism for integrated circuit devices.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13239184U JPS6146744U (en) | 1984-08-31 | 1984-08-31 | Heat dissipation mechanism for integrated circuit devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13239184U JPS6146744U (en) | 1984-08-31 | 1984-08-31 | Heat dissipation mechanism for integrated circuit devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6146744U true JPS6146744U (en) | 1986-03-28 |
Family
ID=30690957
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13239184U Pending JPS6146744U (en) | 1984-08-31 | 1984-08-31 | Heat dissipation mechanism for integrated circuit devices |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6146744U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012028575A (en) * | 2010-07-23 | 2012-02-09 | Mitsubishi Electric Corp | Electronic apparatus |
-
1984
- 1984-08-31 JP JP13239184U patent/JPS6146744U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012028575A (en) * | 2010-07-23 | 2012-02-09 | Mitsubishi Electric Corp | Electronic apparatus |
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