JPS6163846U - - Google Patents
Info
- Publication number
- JPS6163846U JPS6163846U JP14765484U JP14765484U JPS6163846U JP S6163846 U JPS6163846 U JP S6163846U JP 14765484 U JP14765484 U JP 14765484U JP 14765484 U JP14765484 U JP 14765484U JP S6163846 U JPS6163846 U JP S6163846U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- strip
- shaped conductor
- heat dissipation
- circuit device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案の一実施例に従つて構成された
集積回路装置の放熱機構の概念的な斜視構成図、
第２図は集積回路装置と共に上記放熱板をプリン
ト回路基板に実装した状態を示す説明図、第３図
及び第４図は集積回路装置に対する従来の放熱手
段を各々概念的に示す説明図である。
１：帯状導体、２：金属カバー、３：取付部、
４：絶縁体、５：プリント回路基板、６：集積回
路装置、７：グランド端子。
FIG. 1 is a conceptual perspective configuration diagram of a heat dissipation mechanism of an integrated circuit device constructed according to an embodiment of the present invention;
FIG. 2 is an explanatory diagram showing the state in which the heat sink is mounted on a printed circuit board together with an integrated circuit device, and FIGS. 3 and 4 are explanatory diagrams each conceptually showing conventional heat dissipation means for the integrated circuit device. . 1: Strip conductor, 2: Metal cover, 3: Mounting part,
4: Insulator, 5: Printed circuit board, 6: Integrated circuit device, 7: Ground terminal.
Claims (1)
回路装置の各底面に共通に接触配置した帯状導体
を有し、上記各集積回路装置の上面に接触すると
共にその側方を囲むような金属カバーを備え、上
記帯状導体の端部にグランド端子を設けるように
構成した集積回路装置の放熱構造。 (2) 前記帯状導体のプリント回路基板側に絶縁
体を配設するようにした実用新案登録請求の範囲
第(1)項に記載の集積回路装置の放熱機構。[Claims for Utility Model Registration] (1) It has a strip-shaped conductor that is commonly placed in contact with the bottom surface of each of the plurality of integrated circuit devices mounted on a printed circuit board, and that is in contact with the top surface of each of the integrated circuit devices. A heat dissipation structure for an integrated circuit device, comprising a metal cover that surrounds the sides, and a ground terminal provided at an end of the strip-shaped conductor. (2) The heat dissipation mechanism for an integrated circuit device according to claim (1), wherein an insulator is provided on the printed circuit board side of the strip-shaped conductor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14765484U JPS6163846U (en) | 1984-09-29 | 1984-09-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14765484U JPS6163846U (en) | 1984-09-29 | 1984-09-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6163846U true JPS6163846U (en) | 1986-04-30 |
Family
ID=30705881
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14765484U Pending JPS6163846U (en) | 1984-09-29 | 1984-09-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6163846U (en) |
-
1984
- 1984-09-29 JP JP14765484U patent/JPS6163846U/ja active Pending
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