JPS6448092U - - Google Patents
Info
- Publication number
- JPS6448092U JPS6448092U JP14362287U JP14362287U JPS6448092U JP S6448092 U JPS6448092 U JP S6448092U JP 14362287 U JP14362287 U JP 14362287U JP 14362287 U JP14362287 U JP 14362287U JP S6448092 U JPS6448092 U JP S6448092U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- circuit board
- printed circuit
- blocks
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 3
- 239000011810 insulating material Substances 0.000 claims description 3
Landscapes
- Mounting Components In General For Electric Apparatus (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案の一実施例における放熱装置の
斜視図、第２図はその絶縁材料による放熱板の固
定状態を示す断面図、第３図、第４図、第５図は
それぞれ従来例における放熱装置のプリント基板
への放熱板取付状態を示す平面図である。
１１……プリント基板、１２……第１の放熱板
、１３……第２の放熱板、１４……第３の放熱板
、１５……第１の放熱板ブロツク、１６……第２
の放熱板ブロツク、１７……絶縁材料、１８……
セパレータ、１９……弾性仮止片、２０……固定
片。
Fig. 1 is a perspective view of a heat dissipation device according to an embodiment of the present invention, Fig. 2 is a sectional view showing a state in which a heat dissipation plate is fixed by the insulating material, and Figs. 3, 4, and 5 are conventional examples, respectively. FIG. 3 is a plan view showing a state in which the heat sink of the heat sink is attached to the printed circuit board of the heat sink. DESCRIPTION OF SYMBOLS 11... Printed circuit board, 12... First heat sink, 13... Second heat sink, 14... Third heat sink, 15... First heat sink block, 16... Second heat sink
Heat sink block, 17... Insulating material, 18...
Separator, 19... Elastic temporary fixing piece, 20... Fixing piece.
Claims (1)
構成し、上記放熱板のブロツクが互いに近接する
部分で上記放熱板を絶縁材料で一定の間隔を設け
るように固定し、電気部品と上記放熱板を上記プ
リント基板上に取付けるように構成した放熱装置
。 A block is constructed with a heat sink for each circuit on a printed circuit board, and the heat sink is fixed with an insulating material at a certain distance between the blocks of the heat sink in the areas where the blocks of the heat sink are close to each other, and the electrical components and the heat sink are connected. A heat dissipation device configured to be mounted on the printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14362287U JPS6448092U (en) | 1987-09-18 | 1987-09-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14362287U JPS6448092U (en) | 1987-09-18 | 1987-09-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6448092U true JPS6448092U (en) | 1989-03-24 |
Family
ID=31410607
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14362287U Pending JPS6448092U (en) | 1987-09-18 | 1987-09-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6448092U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS617085B2 (en) * | 1981-01-29 | 1986-03-04 | Sekisui Jushi Kk |
-
1987
- 1987-09-18 JP JP14362287U patent/JPS6448092U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS617085B2 (en) * | 1981-01-29 | 1986-03-04 | Sekisui Jushi Kk |
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