JPS6149460U - - Google Patents

Info

Publication number
JPS6149460U
JPS6149460U JP1984134998U JP13499884U JPS6149460U JP S6149460 U JPS6149460 U JP S6149460U JP 1984134998 U JP1984134998 U JP 1984134998U JP 13499884 U JP13499884 U JP 13499884U JP S6149460 U JPS6149460 U JP S6149460U
Authority
JP
Japan
Prior art keywords
pellet
lead
pellet mount
tip
mount part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984134998U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984134998U priority Critical patent/JPS6149460U/ja
Publication of JPS6149460U publication Critical patent/JPS6149460U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例を示すリードフレー
ムの平面図で、第２図はそのＡ−Ａ線切断断面図
、第３図は本考案の他の実施例の平面図で、第４
図はそのＢ−Ｂ線切断断面図、第５図は本考案に
含まれる凹部を２段に形成した実施例の断面図、
第６図は本考案に含まれる凹部に受動素子とペレ
ツトを搭載した実施例の断面図、第７図はリード
フレームにかしめられて組合わせられた従来の放
熱板の平面図で、第８図はそのかしめ部の側面図
、第９図は第７図におけるリード部の側面図であ
る。 ３…リード部、６…隙間、７…ペレツトマウン
ト部、７′…凹部、８…絶縁層。

Claims (1)

    【実用新案登録請求の範囲】
  1. ペレツトマウント部が設けられ、かつ、リード
    部先端がペレツトマウント部真上に隙間を介し重
    なつて配設されたリードフレームにおいて、該ペ
    レツトマウント部のペレツト搭載面に所定深さの
    凹部を形成すると共に、上記リード部先端真下の
    ペレツトマウント部表面に絶縁層を設けたことを
    特徴とするリードフレーム。
JP1984134998U 1984-09-05 1984-09-05 Pending JPS6149460U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984134998U JPS6149460U (ja) 1984-09-05 1984-09-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984134998U JPS6149460U (ja) 1984-09-05 1984-09-05

Publications (1)

Publication Number Publication Date
JPS6149460U true JPS6149460U (ja) 1986-04-03

Family

ID=30693500

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984134998U Pending JPS6149460U (ja) 1984-09-05 1984-09-05

Country Status (1)

Country Link
JP (1) JPS6149460U (ja)

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