JPS6232548U - - Google Patents

Info

Publication number
JPS6232548U
JPS6232548U JP1985124969U JP12496985U JPS6232548U JP S6232548 U JPS6232548 U JP S6232548U JP 1985124969 U JP1985124969 U JP 1985124969U JP 12496985 U JP12496985 U JP 12496985U JP S6232548 U JPS6232548 U JP S6232548U
Authority
JP
Japan
Prior art keywords
semiconductor
lead
semiconductor device
resin
element mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985124969U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985124969U priority Critical patent/JPS6232548U/ja
Publication of JPS6232548U publication Critical patent/JPS6232548U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】
第１図は本考案の第１の実施例を示す半導体装
置の概略縦断面図、第２図は従来の半導体装置の
概略縦断面図、第３図は従来の他の半導体装置の
一部を示す概略縦断面図、第４図は本考案の第２
の実施例を示す半導体装置の概略縦断面図、第５
図は本考案の第３の実施例を示す半導体装置の概
略底面図である。 １１……素子搭載部、１２……リード（内部リ
ード）、１２ａ……リードの露出部分、１３……
半導体素子、１５……樹脂部、１６……金属突起
。

Claims (1)

  1. 【実用新案登録請求の範囲】 １ 半導体素子と固着した素子搭載部と、この素
    子搭載部の周囲に配設され前記半導体素子に接続
    されたリードとが、樹脂部で封止された半導体装
    置において、 前記リードを、その裏面の一部の露出部分を残
    してその全体を前記樹脂部内に埋設し、かつその
    露出部分に、下方向に突出する金属突起を形成し
    たことを特徴とする半導体装置。 ２ 前記リードを折曲形成し、前記素子搭載部の
    下側の樹脂部を他の部分のそれと比較して肉厚に
    形成したことを特徴とする実用新案登録請求の範
    囲第１項記載の半導体装置。 ３ 前記金属突起を前記樹脂部の底面に千鳥状に
    配置したことを特徴にする実用新案登録請求の範
    囲第１項記載の半導体装置。
JP1985124969U 1985-08-14 1985-08-14 Pending JPS6232548U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985124969U JPS6232548U (ja) 1985-08-14 1985-08-14

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985124969U JPS6232548U (ja) 1985-08-14 1985-08-14

Publications (1)

Publication Number Publication Date
JPS6232548U true JPS6232548U (ja) 1987-02-26

Family

ID=31017455

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985124969U Pending JPS6232548U (ja) 1985-08-14 1985-08-14

Country Status (1)

Country Link
JP (1) JPS6232548U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0180473U (ja) * 1987-11-20 1989-05-30

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0180473U (ja) * 1987-11-20 1989-05-30

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