JPS614969A - Probe device - Google Patents

Abstract

PURPOSE:To polish a probe stylus effectively by allowing the probe stylus to abut on an abrasive part at different positions and thus preventing dust such as scraps of aluminum produced from the probe stylus from sticking on the probe stylus again. CONSTITUTION:A wafer stage 9 is moved in the X and Y directions during a test of a wafer 6 to position an IC chip mounted on the wafer 6 under the probe stylus 2 successively, and then a Z stage 8 is moved up and down to bring the probe stylus 2 into electric contact with the bonding pad of the IC chip. If the probe stylus needs to be polished during the test of the wafer, the wafer stage 9 is moved in the X and Y directions to position the abrasive plate 3 under the probe stylus 2, and the Z stage 8 is moved up and down at this position to allow the abrasive plate 3 to abut on the probe stylus 2 several times. In this case, the wafer stage 9 is moved finely in the X and Y directions every time the abrasive plate 3 to make a shift of the abutting position of the probe stylus 2 to the abrasive plate 3.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a probe device, and particularly to a probe device having a probe needle polishing function.

[Prior art]

Generally, in a semiconductor device manufacturing process, an IC tester and probe device (hereinafter referred to as a wafer properr) is used as a device to test the characteristics of an IC chip in a wafer state before cutting into individual chips. The actual test is performed using an IC tester, and a wafer properr makes electrical contact between the IC tester and the IC chips on the wafer. Here, the probe needle of the wafer blobber is
In order to make reliable electrical contact with the IC chip,
It is necessary to polish every several thousand to tens of thousands of contacts.

Conventionally, this type of equipment places a polishing plate such as a ceramic plate on the wafer chuck in place of the wafer to be tested, and polishes the probe needle by hitting the same spot on the polishing plate multiple times with the probe needle. I was doing one line. For this reason, sea urchins attached to the probe needle that occur during polishing
The disadvantage was that aluminum debris from the bonding pad would adhere to the probe needle again.

In order to prevent this drawback, some conventional wafer probers blow air onto the probe needle during polishing. An even bigger drawback was that aluminum scraps were scattered throughout the area.

[Purpose of the invention]

The present invention eliminates the drawbacks of the conventional example described above, and provides a probe device that prevents dust such as aluminum shavings generated from the probe needle from adhering to the probe needle again and effectively polishes the probe needle. The purpose is to provide

〔Example〕

The present invention will be described in detail below with reference to the drawings. FIG. 1 is a schematic diagram of an embodiment of the present invention, in which probe needles 2 are attached to a probe card 1 corresponding to the placement positions of bonding pads of chips of a wafer to be tested. Further, the probe card 1 is attached to the main body of the probe 8 (not shown).

Arranged below the probe needle 2 are a polishing plate 3 for polishing the probe needle 2 and a polishing plate stand 4 on which the polishing plate 3 is mounted. It is connected to the Z stage which will be described later.

The Z stage 8 supports the wafer chuck 7 movably in the Z direction.
A wafer 6 to be tested is held on the wafer chuck 7 by a vacuum chuck or the like. The wafer stage 9 supports the Z stage 8 so as to be movable in the X and Y directions.

The operation of the configuration of the above embodiment will be explained below.

During normal testing of the wafer 6, the wafer stage 9 is
By moving in the Y direction, the IC chips on the sea urchin 6 are sequentially positioned under the probe needle 2, and then the Z stage 8
moves up and down (Z direction), probe needle 2 and IC
Makes electrical contact to the chip's bonding pads.

During the above wafer test, if it becomes necessary to polish the probe needle, which is the purpose of the present invention, the wafer stage 9
By moving the polishing plate 3 in the XY direction, the polishing plate 3 is positioned below the probe needle 2, and at this position, the Z stage 8
3, 4, and 5) to abut the polishing plate 3 against the probe needle 2 multiple times.

By the way, in the conventional wafer blower, the Z stage 8 was simply moved up and down without moving the wafer stage 9. However, in the present invention, the Z stage 8 is moved up and down every time one abutment is completed. Each time the stage 9 is moved in the XY direction or in one direction by a small amount of force 1, the probe needle 2 has not yet made the abutment with the next abutment. It uses the area of The abutting position of the probe at2 on the polishing plate 3 may be changed once or every time a plurality of polishings are performed (depending on the degree of dust adhesion resistance of the polishing plate 3).

It should be noted that the above-mentioned polishing parts (3, 4, 5) can be attached and detached, and after polishing, this can be attached to the Uenosu stage part (7, 8, 9).
), and the polishing part may be configured so that it can be cleaned forcefully by air blowing, etc.
,X.

Furthermore, in the above embodiment, the polishing section (3, 4, 5) was configured to be connected to the wafer stage section (6, 7, 9), but instead, the polishing plate was It may also be placed on an axle and moved in the X and Y directions each time it abuts.

〔Effect of the invention〕

As explained above, by only slightly changing the operation of the present invention when polishing the prober,
It is possible to prevent the drawback that dust such as aluminum scraps generated from the probe needle adheres to the probe needle again, and therefore the probe needle can be effectively polished.

[Brief explanation of the drawing]

FIG. 1 is a schematic sectional view of a wafer/prober according to an embodiment of the present invention. 1 is a probe card, 2 is a probe needle, 3 is a polishing plate, 4
5 is a polishing table, 5 is a support part, 6 is a sea urchin/\, 7 is a wafer chuck, 8 is a Z stage, and 9 is a wafer stage.

Claims (1)

[Claims] A probe device having means for polishing a probe needle by abutting the probe needle against different locations of a polishing section.