JPS64742A - Probing device - Google Patents

Probing device

Info

Publication number
JPS64742A
JPS64742A JP1815488A JP1815488A JPS64742A JP S64742 A JPS64742 A JP S64742A JP 1815488 A JP1815488 A JP 1815488A JP 1815488 A JP1815488 A JP 1815488A JP S64742 A JPS64742 A JP S64742A
Authority
JP
Japan
Prior art keywords
probing
air
nozzles
needle
probing needle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1815488A
Other languages
Japanese (ja)
Other versions
JP2632894B2 (en
JPH01742A (en
Inventor
Wataru Karasawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP63018154A priority Critical patent/JP2632894B2/en
Publication of JPS64742A publication Critical patent/JPS64742A/en
Publication of JPH01742A publication Critical patent/JPH01742A/en
Application granted granted Critical
Publication of JP2632894B2 publication Critical patent/JP2632894B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)

Abstract

PURPOSE: To enable accurate probing measurement, and to improve the operating efficiency of a probing device by also spraying air against a probing needle when air is sprayed onto a semiconductor wafer, dust is removed and the wafer is tested.
CONSTITUTION: Nozzles 10 are set up around a polishing base 11 polishing a probing needle 8 abutted to a measuring stage 6 in numbers such as two. The nozzles 10 are connected to an air intake section 13 through a tube 12, and control the outflow of air. The measuring stage 6 is moved, and the nozzles 10 are mounted just under the probing needle 8. The polishing base 11 is moved up, air is flowed into the nozzles 10 through the tube 12 from the air intake section 13, and air is ejected toward the probing needle 8. Accordingly, when the probing needle is brought into contact with an electrode pad and a wafer is tested, air is also sprayed against the probing needle, thus allowing accurate probing measurement, then improving the operating efficiency of a probing device.
COPYRIGHT: (C)1989,JPO&Japio
JP63018154A 1987-03-24 1988-01-28 Probe device Expired - Lifetime JP2632894B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63018154A JP2632894B2 (en) 1987-03-24 1988-01-28 Probe device

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP6787287 1987-03-24
JP62-67872 1987-03-24
JP63018154A JP2632894B2 (en) 1987-03-24 1988-01-28 Probe device

Publications (3)

Publication Number Publication Date
JPS64742A true JPS64742A (en) 1989-01-05
JPH01742A JPH01742A (en) 1989-01-05
JP2632894B2 JP2632894B2 (en) 1997-07-23

Family

ID=26354794

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63018154A Expired - Lifetime JP2632894B2 (en) 1987-03-24 1988-01-28 Probe device

Country Status (1)

Country Link
JP (1) JP2632894B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5010296A (en) * 1989-12-13 1991-04-23 Mitsubishi Denki Kabushiki Kaisha Wafer prober
US5220279A (en) * 1991-06-12 1993-06-15 Tokyo Electron Yamanashi Limited Probe apparatus
US5453881A (en) * 1991-07-22 1995-09-26 Sharp Kabushiki Kaisha Objective lens holding device
JP2018105725A (en) * 2016-12-27 2018-07-05 三菱電機株式会社 Evaluation apparatus and evaluation method

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54163882U (en) * 1978-05-09 1979-11-16
JPS5612744A (en) * 1979-07-12 1981-02-07 Yoshie Hasegawa Wafer prober
JPS614969A (en) * 1984-06-19 1986-01-10 Canon Inc Probe device
JPS6155338U (en) * 1984-09-14 1986-04-14
JPS61208051A (en) * 1985-03-12 1986-09-16 Nec Corp Reduced projecting and exposing device
JPS6214727U (en) * 1985-07-10 1987-01-29

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54163882U (en) * 1978-05-09 1979-11-16
JPS5612744A (en) * 1979-07-12 1981-02-07 Yoshie Hasegawa Wafer prober
JPS614969A (en) * 1984-06-19 1986-01-10 Canon Inc Probe device
JPS6155338U (en) * 1984-09-14 1986-04-14
JPS61208051A (en) * 1985-03-12 1986-09-16 Nec Corp Reduced projecting and exposing device
JPS6214727U (en) * 1985-07-10 1987-01-29

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5010296A (en) * 1989-12-13 1991-04-23 Mitsubishi Denki Kabushiki Kaisha Wafer prober
US5220279A (en) * 1991-06-12 1993-06-15 Tokyo Electron Yamanashi Limited Probe apparatus
US5453881A (en) * 1991-07-22 1995-09-26 Sharp Kabushiki Kaisha Objective lens holding device
JP2018105725A (en) * 2016-12-27 2018-07-05 三菱電機株式会社 Evaluation apparatus and evaluation method
US10436833B2 (en) 2016-12-27 2019-10-08 Mitsubishi Electric Corporation Evaluation apparatus and evaluation method

Also Published As

Publication number Publication date
JP2632894B2 (en) 1997-07-23

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