JPS6149802B2 - - Google Patents
Info
- Publication number
- JPS6149802B2 JPS6149802B2 JP52147903A JP14790377A JPS6149802B2 JP S6149802 B2 JPS6149802 B2 JP S6149802B2 JP 52147903 A JP52147903 A JP 52147903A JP 14790377 A JP14790377 A JP 14790377A JP S6149802 B2 JPS6149802 B2 JP S6149802B2
- Authority
- JP
- Japan
- Prior art keywords
- resistor
- resistance
- film
- protective film
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000009966 trimming Methods 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 10
- 230000001681 protective effect Effects 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 5
- 238000005520 cutting process Methods 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 239000010408 film Substances 0.000 description 12
- 239000011253 protective coating Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005488 sandblasting Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
Landscapes
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Description
【発明の詳細な説明】
本発明は印刷方式により得られる抵抗体の製造
方法に関するもので、信頼性の高い抵抗体を提供
するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a resistor obtained by a printing method, and provides a highly reliable resistor.
一般にアルミナ、ホルステライトなどのセラミ
ツク基板上に印刷した厚膜抵抗体は、その抵抗値
を規定の範囲に調整するためにトリミングを行な
うが、それには抵抗体の印刷パターンを部分的に
アルミナ粉を噴出させて切削加工するサンドブラ
スト方法とレーザ照射によつて抵抗体の一部分を
除去するレーザトリミング方法がある。後者の場
合は抵抗調整の加工時間が大幅に短縮することが
できるほか、回路の小形化を要求される密度の高
い細かい抵抗パターンの調整ができる利点があ
る。そのために近年レーザトリミングがほとんど
使用されている。また抵抗体は通常ガラスなどの
保護被膜でオーバーコートされているが、オーバ
ーコートの焼付処理工程における抵抗値の変化が
あるため、通常オーバーコート後に前述の抵抗調
整が行なわれている。 Generally, thick-film resistors printed on ceramic substrates such as alumina and holsterite are trimmed to adjust their resistance to a specified range. There are two methods: a sandblasting method in which the resistor is cut by ejecting it, and a laser trimming method in which a portion of the resistor is removed by laser irradiation. In the latter case, the processing time for resistor adjustment can be significantly shortened, and there is also the advantage of being able to adjust fine, high-density resistor patterns that require miniaturization of circuits. For this purpose, laser trimming has been mostly used in recent years. Further, the resistor is usually overcoated with a protective film such as glass, but since the resistance value changes during the overcoat baking process, the above-mentioned resistance adjustment is usually performed after the overcoat.
しかし従来のサンドブラストまたはレーザトリ
ミングによる抵抗調整においては、第1図に示す
ようなアルミナ基板1の上に印刷焼成された抵抗
膜2とガラスのオーバーコート3において抵抗切
削断面2′が露出しており、この露出部の抵抗体
が完全にオーバーコートされていないために外気
にさらしたり、外装樹脂など外部と接触する材料
との化学的、機械的な影響を受け易い状態にあ
り、抵抗値の変化を生じたり、バラツキの原因に
なつている。そのため切削による露出部の寸法を
最少限に制限するようにしたり、選別するなど管
理上難しい点が多かつた。またレーザトリミング
において、レーザ照射を弱くして抵抗体の酸化を
主体とした材質の変化により抵抗値を調整するこ
とも試みられているが、抵抗調整時間が長くな
り、また温度係数その他の特性が変化する欠点が
ある。 However, in conventional resistance adjustment by sandblasting or laser trimming, the resistance cut cross section 2' is exposed in the resistance film 2 printed and fired on the alumina substrate 1 and the glass overcoat 3 as shown in FIG. Since the resistor in this exposed part is not completely overcoated, it is exposed to the outside air and is susceptible to chemical and mechanical effects from exterior resin and other materials that come into contact with the outside, resulting in changes in resistance. or cause variation. For this reason, there were many difficulties in management, such as limiting the dimensions of the exposed parts by cutting to a minimum and sorting them out. In addition, in laser trimming, attempts have been made to adjust the resistance value by weakening the laser irradiation and changing the material mainly by oxidizing the resistor, but this increases the resistance adjustment time and also reduces the temperature coefficient and other characteristics. There are drawbacks that change.
本発明は上述の欠点を除去するもので、抵抗体
を完全に保護被膜でオーバーコートした状態で、
保護被膜を除去せず、膜抵抗体を除去するように
レーザトリミングして抵抗調整することを特徴と
する抵抗体の製造方法である。 The present invention eliminates the above-mentioned drawbacks and provides a resistor with a completely overcoated protective coating.
This method of manufacturing a resistor is characterized in that resistance is adjusted by laser trimming to remove the film resistor without removing the protective film.
以下、図面により説明すると、第2図はレーザ
トリミングした抵抗体のLカツト切削溝の平面図
を示し、第3図は本発明による同切削溝断面を拡
大した図面を示す。セラミツク基板1の上に印刷
された抵抗体2にガラスなどの保護被膜3がオー
バーコートされ、これをレーザトリミングによつ
て第3図に示すように切削することにより抵抗体
2の切削部2′が外部に露出しないようにしたも
のである。4は電極である。切削の状況を説明す
ると、レーザのパワーを徐々に増加していくと、
最初抵抗体2に影響し始め、次いで保護被膜3を
溶かし、抵抗体2を切削して第3図の状態にな
る。この場合保護被膜3は蒸発せず抵抗体2を被
覆している。さらにパワーを上げると保護被膜3
を蒸発せしめて第1図のごとくなる。この保護被
膜は溶解して固化し、しかも保護被膜3が完全に
抵抗体2をオーバーコートした状態を完成するこ
とができる。 Hereinafter, explanation will be given with reference to the drawings. FIG. 2 shows a plan view of an L-cut cut groove of a resistor that has been laser trimmed, and FIG. 3 shows an enlarged cross-section of the cut groove according to the present invention. The resistor 2 printed on the ceramic substrate 1 is overcoated with a protective film 3 made of glass or the like, and this is cut by laser trimming as shown in FIG. 3 to form the cut portion 2' of the resistor 2. This prevents it from being exposed to the outside. 4 is an electrode. To explain the cutting situation, as the laser power is gradually increased,
It first begins to affect the resistor 2, then melts the protective coating 3 and cuts the resistor 2, resulting in the state shown in FIG. In this case, the protective film 3 does not evaporate and covers the resistor 2. If you further increase the power, the protective coating 3
After evaporating, the result is as shown in Figure 1. This protective film is melted and solidified, and a state in which the protective film 3 completely overcoats the resistor 2 can be completed.
本発明はこの第3図の状態になるようレーザト
リミングを行つたもので、本発明一実施例の抵抗
体(曲線a)と従来の抵抗体(曲線b)との10k
Ω、125mWの70℃における耐湿負荷寿命特性の
比較曲線を第4図に示す。本発明の抵抗体は従来
に比し安定した信頼性の高い抵抗体を得ることが
できる。 The present invention performs laser trimming to obtain the state shown in FIG.
Figure 4 shows a comparison curve of humidity load life characteristics at 70°C with Ω and 125mW. The resistor of the present invention can provide a resistor that is more stable and reliable than conventional resistors.
なお、抵抗体が印刷法によつて形成された厚膜
抵抗体について説明したが、蒸着法による薄膜抵
抗体やその他保護皮膜を有する膜に対しても有効
である。 Although the description has been given of a thick film resistor formed by a printing method, the present invention is also effective for thin film resistors formed by a vapor deposition method and other films having a protective film.
以上のように本発明による抵抗体はレーザトリ
ミングした状態が観察できるので、レーザトリミ
ング条件の設定や抵抗調整後の良否の判定を実体
顕微鏡などを使つて容易にすることができるの
で、管理もし易く上述の信頼度の高い抵抗体を得
ることができるなどの特徴があり、工業的ならび
に実用的価値の大なるものである。 As described above, since the laser trimmed state of the resistor according to the present invention can be observed, it is easy to set the laser trimming conditions and judge the quality after resistance adjustment using a stereomicroscope, which makes management easier. It has the feature that it is possible to obtain a highly reliable resistor as described above, and is of great industrial and practical value.
第1図は従来の印刷した抵抗体をトリミングし
た切削溝の断面図、第2図および第3図は本発明
の実施例を示し、第2図は印刷した抵抗体の上面
図、第3図はレーザトリミングによる同切削溝の
断面図、第4図は本発明品と従来品を比較した抵
抗体の耐湿負荷寿命試験特性図である。
1:基板、2:印刷抵抗体、2′:抵抗体の露
出部、3:保護被膜、a:本発明の抵抗体、b:
従来の抵抗体。
FIG. 1 is a sectional view of a cutting groove obtained by trimming a conventional printed resistor, FIGS. 2 and 3 show an embodiment of the present invention, FIG. 2 is a top view of the printed resistor, and FIG. 4 is a cross-sectional view of the groove cut by laser trimming, and FIG. 4 is a characteristic diagram of a humidity resistance load life test of a resistor comparing a product of the present invention and a conventional product. DESCRIPTION OF SYMBOLS 1: Substrate, 2: Printed resistor, 2': Exposed part of resistor, 3: Protective coating, a: Resistor of the present invention, b:
Conventional resistor.
Claims (1)
上に保護皮膜を形成した後、レーザトリミングし
て抵抗調整する抵抗体の製造方法において、トリ
ミング部分の該保護皮膜を溶解させて抵抗体を切
削し、該切削部を被覆するよう固化させることを
特徴とする抵抗体の製造方法。1 In a method for manufacturing a resistor in which a film resistor is formed on an insulating substrate, a protective film is formed on the film resistor, and the resistance is adjusted by laser trimming, the protective film in the trimmed portion is melted to form a resistor. 1. A method for manufacturing a resistor, which comprises cutting the body and solidifying the body to cover the cut portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14790377A JPS5479457A (en) | 1977-12-08 | 1977-12-08 | Resistance body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14790377A JPS5479457A (en) | 1977-12-08 | 1977-12-08 | Resistance body |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5479457A JPS5479457A (en) | 1979-06-25 |
| JPS6149802B2 true JPS6149802B2 (en) | 1986-10-31 |
Family
ID=15440731
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14790377A Granted JPS5479457A (en) | 1977-12-08 | 1977-12-08 | Resistance body |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5479457A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5965409A (en) * | 1982-10-06 | 1984-04-13 | 松下電器産業株式会社 | Method of producing multilayer thick film resistor |
| JPS62266892A (en) * | 1986-05-15 | 1987-11-19 | イビデン株式会社 | Method of cutting circuit conductor |
| JPH0648714B2 (en) * | 1989-06-09 | 1994-06-22 | 進工業株式会社 | Trimmable tip low drag |
| JPH0618121B2 (en) * | 1991-07-12 | 1994-03-09 | ローム株式会社 | Chip resistor |
-
1977
- 1977-12-08 JP JP14790377A patent/JPS5479457A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5479457A (en) | 1979-06-25 |
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