JPS6157534U - - Google Patents
Info
- Publication number
- JPS6157534U JPS6157534U JP1984142967U JP14296784U JPS6157534U JP S6157534 U JPS6157534 U JP S6157534U JP 1984142967 U JP1984142967 U JP 1984142967U JP 14296784 U JP14296784 U JP 14296784U JP S6157534 U JPS6157534 U JP S6157534U
- Authority
- JP
- Japan
- Prior art keywords
- bumps
- semiconductor device
- electrical connection
- flip
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W72/221—Structures or relative sizes
- H10W72/227—Multiple bumps having different sizes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
- H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図ａ，ｂは従来構造を示す平面図、側面図
、第２図は従来装置の実装構造図、第３図ａ，ｂ
は本考案の一実施例構造を示す平面図及び側面図
、第４図は本考案の実装構造図である。図におい
て１はシリコンチツプ、２はバンプ、３は基板、
４は放熱用金属部である。
Figure 1 a, b is a plan view and side view showing the conventional structure, Figure 2 is a mounting structure diagram of the conventional device, Figure 3 a, b
4 is a plan view and a side view showing the structure of an embodiment of the present invention, and FIG. 4 is a diagram of the mounting structure of the present invention. In the figure, 1 is a silicon chip, 2 is a bump, 3 is a substrate,
4 is a metal part for heat radiation.
Claims (1)
ツプチツプ型半導体装置において、前記表面の所
要面に前記電気接続用バンプと独立した放熱用金
属部を設けたことを特徴とするフリツプ型半導体
装置。 (2) 放熱用金属部が電気接続用バンプに囲まれ
て配設されたことを特徴とする実用新案登録請求
の範囲第(1)項記載のフリツプチツプ型半導体装
置。[Claims for Utility Model Registration] (1) In a flip-chip type semiconductor device in which bumps for electrical connection are provided on the surface thereof, a metal part for heat dissipation independent of the bumps for electrical connection is provided on a required surface of the surface. Flip type semiconductor device with special features. (2) The flip-chip semiconductor device according to claim 1, wherein the heat dissipation metal portion is surrounded by electrical connection bumps.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984142967U JPS6157534U (en) | 1984-09-21 | 1984-09-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984142967U JPS6157534U (en) | 1984-09-21 | 1984-09-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6157534U true JPS6157534U (en) | 1986-04-17 |
Family
ID=30701279
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984142967U Pending JPS6157534U (en) | 1984-09-21 | 1984-09-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6157534U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4918598U (en) * | 1972-05-18 | 1974-02-16 | ||
| JPS5028794A (en) * | 1973-07-13 | 1975-03-24 |
-
1984
- 1984-09-21 JP JP1984142967U patent/JPS6157534U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4918598U (en) * | 1972-05-18 | 1974-02-16 | ||
| JPS5028794A (en) * | 1973-07-13 | 1975-03-24 |