JPS6157537U - - Google Patents

Info

Publication number
JPS6157537U
JPS6157537U JP1984142213U JP14221384U JPS6157537U JP S6157537 U JPS6157537 U JP S6157537U JP 1984142213 U JP1984142213 U JP 1984142213U JP 14221384 U JP14221384 U JP 14221384U JP S6157537 U JPS6157537 U JP S6157537U
Authority
JP
Japan
Prior art keywords
semiconductor chip
wiring board
heat
semiconductor device
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984142213U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984142213U priority Critical patent/JPS6157537U/ja
Publication of JPS6157537U publication Critical patent/JPS6157537U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/681—Shapes or dispositions thereof comprising holes not having chips therein, e.g. for outgassing, underfilling or bond wire passage
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
JP1984142213U 1984-09-21 1984-09-21 Pending JPS6157537U (he)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984142213U JPS6157537U (he) 1984-09-21 1984-09-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984142213U JPS6157537U (he) 1984-09-21 1984-09-21

Publications (1)

Publication Number Publication Date
JPS6157537U true JPS6157537U (he) 1986-04-17

Family

ID=30700540

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984142213U Pending JPS6157537U (he) 1984-09-21 1984-09-21

Country Status (1)

Country Link
JP (1) JPS6157537U (he)

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