JPS6181168U - - Google Patents
Info
- Publication number
- JPS6181168U JPS6181168U JP16703484U JP16703484U JPS6181168U JP S6181168 U JPS6181168 U JP S6181168U JP 16703484 U JP16703484 U JP 16703484U JP 16703484 U JP16703484 U JP 16703484U JP S6181168 U JPS6181168 U JP S6181168U
- Authority
- JP
- Japan
- Prior art keywords
- light
- semiconductor
- emitting element
- metal plate
- photocoupler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 9
- 239000004065 semiconductor Substances 0.000 claims description 7
- 238000010586 diagram Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
Description
第１図は本考案の一実施例による半導体フオト
カプラーの断面図、第２図は第１図の金属板の斜
視図、第３図は第１図の実施例においてＬＥＤチ
ツプをフイルムから金属板へ接着する工程を示す
説明図、第４図はそのＬＥＤチツプを接着した金
属板を搭載用金属フレームに接着した状態を示す
図、第５図ａおよびｂは従来例による半導体フオ
トカプラーの斜視図および断面図、第６図は第５
図ｂのＬＥＤチツプのずれと傾きの状態を示す図
、第７図は通常のダイボンダーのボンデイング機
構を示す説明図である。
１……ＬＥＤチツプ（発光素子）、２……受光
チツプ（受光素子）、３……ＬＥＤ搭載金属フレ
ーム、４……受光チツプ搭載金属フレーム、５…
…黒色エポキシ樹脂、６……透明シリコン樹脂、
７……金属板、８……凹部、９，９ａ……Ａｇペ
ースト。
FIG. 1 is a sectional view of a semiconductor photocoupler according to an embodiment of the present invention, FIG. 2 is a perspective view of the metal plate shown in FIG. 1, and FIG. FIG. 4 is a diagram showing the state in which the metal plate to which the LED chip is adhered is adhered to the mounting metal frame. FIGS. 5 a and 5 b are perspective views of a conventional semiconductor photocoupler. and cross-sectional view, Figure 6 is the 5th
FIG. 7 is an explanatory diagram showing the bonding mechanism of a conventional die bonder. 1... LED chip (light emitting element), 2... Light receiving chip (light receiving element), 3... Metal frame mounted with LED, 4... Metal frame mounted with light receiving chip, 5...
...Black epoxy resin, 6...Transparent silicone resin,
7...Metal plate, 8...Recess, 9, 9a...Ag paste.
Claims (1)
置させて一体構造とした半導体フオトカプラーに
おいて、前記発光素子とその搭載用金属フレーム
の間に、該発光素子より大きくかつ導電性の金属
板を組入れたことを特徴とする半導体フオトカプ
ラー。 (2) 金属板に発光素子搭載用の凹部を設けたこ
とを特徴とする実用新案登録請求の範囲第１項記
載の半導体フオトカプラー。[Claims for Utility Model Registration] (1) In a semiconductor photocoupler having an integrated structure in which a semiconductor light-emitting element and a semiconductor light-receiving element are disposed facing each other, there is a space between the light-emitting element and the metal frame for mounting it, which is larger than the light-emitting element. A semiconductor photocoupler characterized by incorporating a conductive metal plate. (2) The semiconductor photocoupler according to claim 1, which is a utility model, characterized in that a metal plate is provided with a recess for mounting a light emitting element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16703484U JPS6181168U (en) | 1984-11-02 | 1984-11-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16703484U JPS6181168U (en) | 1984-11-02 | 1984-11-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6181168U true JPS6181168U (en) | 1986-05-29 |
Family
ID=30724837
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16703484U Pending JPS6181168U (en) | 1984-11-02 | 1984-11-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6181168U (en) |
-
1984
- 1984-11-02 JP JP16703484U patent/JPS6181168U/ja active Pending
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