JPS6247156U - - Google Patents

Info

Publication number
JPS6247156U
JPS6247156U JP1985139996U JP13999685U JPS6247156U JP S6247156 U JPS6247156 U JP S6247156U JP 1985139996 U JP1985139996 U JP 1985139996U JP 13999685 U JP13999685 U JP 13999685U JP S6247156 U JPS6247156 U JP S6247156U
Authority
JP
Japan
Prior art keywords
light emitting
lead frame
emitting element
envelope
resin layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985139996U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985139996U priority Critical patent/JPS6247156U/ja
Publication of JPS6247156U publication Critical patent/JPS6247156U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の一実施例に係る半導体発光装
置の断面図、第２図は従来の半導体発光装置の断
面図、第３図〜第５図は本考案の他の実施例に係
る半導体発光装置の断面図、第６図は第１図の部
分拡大断面図である。 １……発光素子、３……導電性エポキシペース
ト、４……樹脂層、５……外囲器、５ａ……突出
部、６……ボンデイングワイヤ、１１〜１４……
リードフレーム、１１ａ……凹凸部。 FIG. 1 is a sectional view of a semiconductor light emitting device according to an embodiment of the present invention, FIG. 2 is a sectional view of a conventional semiconductor light emitting device, and FIGS. 3 to 5 are semiconductors according to other embodiments of the present invention. A sectional view of the light emitting device, FIG. 6 is a partially enlarged sectional view of FIG. 1. DESCRIPTION OF SYMBOLS 1...Light emitting element, 3...Conductive epoxy paste, 4...Resin layer, 5...Envelope, 5a...Protrusion part, 6...Bonding wire, 11-14...
Lead frame, 11a... uneven portion.

Claims (1)

【実用新案登録請求の範囲】 (1) リードフレームと、このリードフレーム上
にマウントされた発光素子と、この発光素子を封
止する透明な樹脂層と、この樹脂層を前記発光素
子の発光面側を除いて囲むとともに、前記リード
フレームと一体成型された外囲器とを具備し、前
記外囲器内のリードフレームをジクザク状又は階
段状にすることを特徴とする半導体発光装置。 (2) 外囲器内のジグザク状又は階段状のリード
フレームの表面が粗面化されていることを特徴と
する実用新案登録請求の範囲第１項記載の半導体
発光装置。[Claims for Utility Model Registration] (1) A lead frame, a light emitting element mounted on the lead frame, a transparent resin layer sealing the light emitting element, and a transparent resin layer sealing the light emitting element on the light emitting surface of the light emitting element. What is claimed is: 1. A semiconductor light emitting device comprising: an envelope surrounding the lead frame except for the sides thereof and integrally molded with the lead frame, the lead frame inside the envelope having a zigzag shape or a stepped shape. (2) The semiconductor light emitting device according to claim 1, wherein the surface of the zigzag or stepped lead frame in the envelope is roughened.
JP1985139996U 1985-09-12 1985-09-12 Pending JPS6247156U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985139996U JPS6247156U (en) 1985-09-12 1985-09-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985139996U JPS6247156U (en) 1985-09-12 1985-09-12

Publications (1)

Publication Number Publication Date
JPS6247156U true JPS6247156U (en) 1987-03-23

Family

ID=31046424

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985139996U Pending JPS6247156U (en) 1985-09-12 1985-09-12

Country Status (1)

Country Link
JP (1) JPS6247156U (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7432589B2 (en) 2006-04-19 2008-10-07 Nichia Corporation Semiconductor device
JP2009170625A (en) * 2008-01-16 2009-07-30 Toyoda Gosei Co Ltd Light emitting device
EP1928033A3 (en) * 2006-11-30 2010-09-01 Nichia Corporation Light-emitting apparatus and method of producing the same
JP2011205100A (en) * 2010-03-25 2011-10-13 Lg Innotek Co Ltd Light-emitting element package and illumination system equipped with the same
JP2012515440A (en) * 2009-01-14 2012-07-05 クリー ホイチョウ オプト リミテッド Multiple light emitting device package
JP2021027144A (en) * 2019-08-05 2021-02-22 ローム株式会社 Semiconductor light-emitting device

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7432589B2 (en) 2006-04-19 2008-10-07 Nichia Corporation Semiconductor device
EP1928033A3 (en) * 2006-11-30 2010-09-01 Nichia Corporation Light-emitting apparatus and method of producing the same
JP2009170625A (en) * 2008-01-16 2009-07-30 Toyoda Gosei Co Ltd Light emitting device
JP2012515440A (en) * 2009-01-14 2012-07-05 クリー ホイチョウ オプト リミテッド Multiple light emitting device package
JP2011205100A (en) * 2010-03-25 2011-10-13 Lg Innotek Co Ltd Light-emitting element package and illumination system equipped with the same
EP2369652A3 (en) * 2010-03-25 2015-05-06 LG Innotek Co., Ltd. Light emitting device package and lighting system having the same
JP2021027144A (en) * 2019-08-05 2021-02-22 ローム株式会社 Semiconductor light-emitting device

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