JPS6181647A - Testing apparatus for semiconductor wafer - Google Patents

Abstract

PURPOSE:To facilitate attaching, adjusting and maintenance works, by disposing the operating body of a semiconductor wafer marking apparatus within the space in a measuring section such that the position of the operating body can be adjusted from the outside of the measuring section. CONSTITUTION:A semiconductor wafer marking apparatus 11 comprises an operating body 12 and an arm 13. The arm 13 is provided withseats 15 having slots 14 at both ends thereof, and the operating body 12 having a probe 16 is set on the bottom surface of the central portion of the arm. The seats 15 of the arm 13 are seated on the upper surfaces of bearing plates 1, and set screws 17 engaged in the slots 14 are fixed to the bearing plates 1. The operating body 12 is fitted in the space 2 of a measuring section and the probe 16 is opposed to a probe card 3. A semiconductor wafer mounted on a loading table is positioned below the probe card. Since the bearing plate 1 has only a slightly upstanding portion produced by the arm 13 on its upper surface, a part 4 of a measuring system can be disposed over the space 2 without interference of the marking apparatus.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a semiconductor wafer inspection apparatus, and more particularly to a semiconductor wafer defect marking apparatus for marking defective dot marks on defective chips on a semiconductor wafer.

Currently, in the electronics field, especially in the computer field, efforts are being made to increase the operating speed of devices.
The reality is that research and development of ICs that operate at high speeds is progressing. In line with this current situation, there is a growing demand for faster measurement in semiconductor wafer inspection equipment, and various improvements have been made to the measurement mechanisms of inspection equipment. It is becoming more prone than before.

FIGS. 1(A) and 1(B) show the measurement part gaps in a conventional inspection device and a recent inspection device. That is, the glove card 3 is installed so as to face into the measurement part gap 2 between the pair of support plates 1, 1.

A loading table on which a semiconductor wafer to be inspected is mounted is provided below. The width 12 of the gap 2 in the recent inspection device shown in FIG. 1(b) is much narrower than the width 11 of the gap 2 in the conventional inspection device shown in FIG. At the top, a part 4 of the measuring system equipment (for example a tester, conventionally placed on the side of the gap 2) is installed. Figure @2 shows a conventional semiconductor wafer defect marking device. This marking device consists of a main body 5 and a needle 6 provided at its tip.
and position adjustment parts 7, 7. The main body 5 is fixed on one support plate 1 with screws 8, and a part of the main body 5 projects into the gap 2, so that the needle 5 faces into the gap 2'. It was a structural thing. Therefore, when this device is applied to the conventional inspection device shown in Figure 1 (a), the same problem does not occur, but when applied to the recent inspection device shown in Figure 1 (b), the measurement system equipment A problem arises in that part 4 is obstructed, making installation, adjustment, and maintenance difficult, which impedes work.

The present invention solves the above-mentioned problems, and includes an arm rod that is movably attached to the upper surface of the support plate, and is used to connect the measuring section gap where the probe card faces and the semiconductor wafer to be inspected therebelow. The device is characterized in that it extends above the table, and that the main body of the operating section of the semiconductor wafer marking device is provided on the lower surface of the arm rod, and the main body of the operating section is fitted into the gap.

Embodiments of the present invention will be described below with reference to the drawings.

In FIG. 3, the semiconductor wafer marking device 11 consists of an operating section main body 12 and an arm rod 13. The arm rod 13 has a seat portion 15 with a long hole 14 at both ends thereof.
3, an operating part main body 12 equipped with a needle 16 is installed on the lower center surface of the main body 3. Both seats 15, 15 of this arm rod 13 are seated on the upper surface of the support plate 1.1, and the setscrews 17 engaged in the elongated holes 14 are fixed to the support plate 1. The length of the elongated hole 14 is larger than the diameter of the set screw 17, and the arm rod 13 is moved and adjusted relative to the set screw 17 to be tightened at a predetermined position. By this attachment, the operating part main body 12 is dedicated within the measuring part gap 2 of the support plate l, and the needle 16 is faced to the probe card 3. A semiconductor wafer mounted on a rotary/groove pulley is located below the glove card. In FIG. 4, only a slight rising part is formed by the arm rod 13 on the upper surface of the support plate 1, and a part 4 of the measuring system device is installed above the gap 2 without being obstructed by the marking device 11. can. In addition, armrest 13
When the upper part of the seat 15 of
In the above embodiments, an example in which both ends of the arm rod 13 are fixed on the support plate 1 is explained, but alternatively, it may be a cantilever type as shown in Fig. 5. . In short, it is sufficient to install the main body of the operating section of the Mah-Young device on the lower surface of the arm rod that extends above the gap above the support plate, and to fit this into the gap.

Therefore, according to the present invention, the main body of the operating section of the semiconductor wafer marking device is accommodated within the gap of the measuring section, and the position of the main body of the operating section can be adjusted outside the measuring section, so that installation, adjustment, and maintenance work thereof can be facilitated. This has the effect of speeding up the work.

[Brief explanation of drawings]

FIG. 1(A) is a cross-sectional view showing the measurement part gap in a conventional inspection device, FIG. 1(B) is a cross-sectional view showing the measurement part gap in the test device of the present invention, and FIG. FIG. 3 is a perspective view of a wafer marking device, FIG. 3 is a perspective view showing one embodiment of the present invention, FIG. 4 is a sectional view showing the installation situation of the device of the present invention, and FIG. 5 is a perspective view of another embodiment of the present invention. FIG. 1...Support plate, 2...r measurement part gap, 3
. . . Globe card, 11 . . . Semiconductor wafer marking device, 12 . . . Operating unit main body. Figure 1 (b) Figure 2 Figure 3

Claims (1)

[Claims] a support plate having a predetermined gap; an arm rod attached to the support plate and projecting above the gap; means for installing a semiconductor wafer under the gap; 1. A semiconductor wafer inspection device comprising: a defect marking device for detecting defects.