JPS6183097U - - Google Patents
Info
- Publication number
- JPS6183097U JPS6183097U JP16874784U JP16874784U JPS6183097U JP S6183097 U JPS6183097 U JP S6183097U JP 16874784 U JP16874784 U JP 16874784U JP 16874784 U JP16874784 U JP 16874784U JP S6183097 U JPS6183097 U JP S6183097U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- mounting structure
- heat
- casing
- structure according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Mounting Components In General For Electric Apparatus (AREA)
Description
第１〜１０図は本考案に係る電子部品の放熱取
付構造をいずれも示すものであり、第１及び２図
は放熱板を筐体から切り起し成形し、第３及び４
，５及び６図は別の金属板材で裁断した放熱板を
筐体に取付け、第７及び８，９及び１０図ａ，ｂ
は押出し成形した放熱板を筐体に取付けた場合の
各実施例を示し、第１１図は従来例に係る電子部
品の放熱取付構造を示す斜視図である。
１０，２０，３０，４０，５０：放熱板、１１
，２１，３１，４１，５１：実装基板、１２，２
２，３２，４２，５２：筐体、１３，２３，３３
，４３，５３：スリツト、１４，２４，３４，４
４，５４：電子部品、１９，２９，３９，４９，
５９：ストツパ。
Figures 1 to 10 show the heat dissipation mounting structure for electronic components according to the present invention.
, 5 and 6, a heat dissipation plate cut from another metal plate is attached to the casing.
11 shows each embodiment in which an extruded heat dissipation plate is attached to a housing, and FIG. 11 is a perspective view showing a conventional heat dissipation mounting structure for an electronic component. 10, 20, 30, 40, 50: heat sink, 11
, 21, 31, 41, 51: Mounting board, 12, 2
2, 32, 42, 52: Housing, 13, 23, 33
, 43, 53: Slits, 14, 24, 34, 4
4, 54: Electronic parts, 19, 29, 39, 49,
59: Stoppa.
Claims (1)
放熱板を起立し、この放熱板を実装基板のスリツ
トより板面上に突出し、その突出面にトランジス
タ等の帯熱する電子部品をあてがい装着するよう
構成したことを特徴とする電子部品の放熱取付構
造。 (2) 上記放熱板が、筐体の一部を切り起して連
続成形されているところの実用新案登録請求の範
囲第１項記載の放熱取付構造。 (3) 上記放熱板が、その下端辺を筐体に取付け
て起立装着されているところの実用新案登録請求
の範囲第１項記載の放熱取付構造。 (4) 上記放熱板が、実装基板を下面で支持する
ストツパを持つているところの実用新案登録請求
の範囲第１項記載の放熱取付構造。[Scope of Claim for Utility Model Registration] (1) A heat sink is erected from a metal casing in which the circuit assembly is assembled, and this heat sink is protruded from the slit of the mounting board onto the board surface, and a transistor is mounted on the protruding surface. 1. A heat dissipation mounting structure for electronic components, characterized in that the heat dissipation mounting structure is configured such that heat-generating electronic components such as the following are mounted on the heat dissipation mounting structure. (2) The heat dissipation mounting structure according to claim 1, wherein the heat dissipation plate is continuously molded by cutting and raising a part of the casing. (3) The heat dissipation mounting structure according to claim 1, wherein the heat dissipation plate is mounted upright with its lower end side attached to the casing. (4) The heat dissipation mounting structure according to claim 1, wherein the heat dissipation plate has a stopper that supports the mounting board on the lower surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16874784U JPS6183097U (en) | 1984-11-06 | 1984-11-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16874784U JPS6183097U (en) | 1984-11-06 | 1984-11-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6183097U true JPS6183097U (en) | 1986-06-02 |
Family
ID=30726507
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16874784U Pending JPS6183097U (en) | 1984-11-06 | 1984-11-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6183097U (en) |
-
1984
- 1984-11-06 JP JP16874784U patent/JPS6183097U/ja active Pending
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