JPS6183913U - - Google Patents
Info
- Publication number
- JPS6183913U JPS6183913U JP16957484U JP16957484U JPS6183913U JP S6183913 U JPS6183913 U JP S6183913U JP 16957484 U JP16957484 U JP 16957484U JP 16957484 U JP16957484 U JP 16957484U JP S6183913 U JPS6183913 U JP S6183913U
- Authority
- JP
- Japan
- Prior art keywords
- tetrafluoroethylene resin
- circuit board
- printed circuit
- porous tetrafluoroethylene
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010410 layer Substances 0.000 claims description 11
- 239000011347 resin Substances 0.000 claims description 10
- 229920005989 resin Polymers 0.000 claims description 10
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 claims description 10
- 239000012790 adhesive layer Substances 0.000 claims description 2
- 239000000155 melt Substances 0.000 claims 1
- 230000008018 melting Effects 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
Landscapes
- Laminated Bodies (AREA)
Description
第１図、第２図及び第３図はそれぞれこの考案
による異なる実施例を示すプリント基板の断面図
である。
１，５，１０：プリント基板、２，７，１１：
多孔質四弗化エチレン樹脂層、３，８，１２：溶
融接着層、４，９，１３：導電回路層、６：貫通
孔。
1, 2, and 3 are sectional views of printed circuit boards showing different embodiments of this invention, respectively. 1, 5, 10: Printed circuit board, 2, 7, 11:
Porous tetrafluoroethylene resin layer, 3, 8, 12: melt adhesive layer, 4, 9, 13: conductive circuit layer, 6: through hole.
Claims (1)
けられる多孔質四弗化エチレン樹脂層と、前記導
電回路層と多孔質四弗化エチレン樹脂層との間に
設けられ、四弗化エチレン樹脂よりも融点の低い
弗素樹脂よりなる溶融接着層とを備えるプリント
基板。 (2) 実用新案登録請求の範囲第１項に記載のプ
リント基板において、多孔質四弗化エチレン樹脂
層は延伸多孔質四弗化エチレン樹脂シートからな
ることを特徴とするプリント基板。 (3) 実用新案登録請求の範囲第１項に記載のプ
リント基板において、多孔質四弗化エチレン樹脂
層は延伸多孔質四弗化エチレン樹脂シートに多数
の貫通孔を設けたものからなることを特徴とする
プリント基板。 (4) 実用新案登録請求の範囲第１項に記載のプ
リント基板において、多孔質四弗化エチレン樹脂
層は延伸多孔質四弗化エチレン樹脂線条体をもつ
て織つた布状体からなることを特徴とするプリン
ト基板。[Claims for Utility Model Registration] (1) A conductive circuit layer, a porous tetrafluoroethylene resin layer provided along the conductive circuit layer, and a combination of the conductive circuit layer and the porous tetrafluoroethylene resin layer. A printed circuit board comprising a melt adhesive layer provided between the layers and made of a fluororesin having a melting point lower than that of tetrafluoroethylene resin. (2) Utility Model Registration The printed circuit board according to claim 1, wherein the porous tetrafluoroethylene resin layer is made of a stretched porous tetrafluoroethylene resin sheet. (3) Scope of Utility Model Registration In the printed circuit board according to claim 1, the porous tetrafluoroethylene resin layer is composed of a stretched porous tetrafluoroethylene resin sheet with a large number of through holes. Characteristic printed circuit board. (4) In the printed circuit board according to claim 1 of the utility model registration claim, the porous tetrafluoroethylene resin layer is made of a cloth-like body woven with stretched porous tetrafluoroethylene resin filaments. A printed circuit board featuring:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984169574U JPH0229732Y2 (en) | 1984-11-08 | 1984-11-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984169574U JPH0229732Y2 (en) | 1984-11-08 | 1984-11-08 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6183913U true JPS6183913U (en) | 1986-06-03 |
| JPH0229732Y2 JPH0229732Y2 (en) | 1990-08-09 |
Family
ID=30727298
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984169574U Expired JPH0229732Y2 (en) | 1984-11-08 | 1984-11-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0229732Y2 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62283694A (en) * | 1986-06-02 | 1987-12-09 | ジヤパンゴアテツクス株式会社 | Manufacture of printed wiring board |
| JPS6347136A (en) * | 1986-08-15 | 1988-02-27 | 松下電工株式会社 | Manufacture of laminated board |
| JPS6358987A (en) * | 1986-08-29 | 1988-03-14 | 日立化成工業株式会社 | Radio frequency circuit board |
| JPS6358988A (en) * | 1986-08-29 | 1988-03-14 | 日立化成工業株式会社 | Manufacture of radio frequency circuit board |
| JPS63183247U (en) * | 1987-05-15 | 1988-11-25 | ||
| WO2007066788A1 (en) * | 2005-12-05 | 2007-06-14 | Junkosha Inc. | Fluororesin laminate substrate |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60214941A (en) * | 1984-04-10 | 1985-10-28 | 株式会社 潤工社 | Printed substrate |
-
1984
- 1984-11-08 JP JP1984169574U patent/JPH0229732Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60214941A (en) * | 1984-04-10 | 1985-10-28 | 株式会社 潤工社 | Printed substrate |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62283694A (en) * | 1986-06-02 | 1987-12-09 | ジヤパンゴアテツクス株式会社 | Manufacture of printed wiring board |
| JPS6347136A (en) * | 1986-08-15 | 1988-02-27 | 松下電工株式会社 | Manufacture of laminated board |
| JPS6358987A (en) * | 1986-08-29 | 1988-03-14 | 日立化成工業株式会社 | Radio frequency circuit board |
| JPS6358988A (en) * | 1986-08-29 | 1988-03-14 | 日立化成工業株式会社 | Manufacture of radio frequency circuit board |
| JPS63183247U (en) * | 1987-05-15 | 1988-11-25 | ||
| WO2007066788A1 (en) * | 2005-12-05 | 2007-06-14 | Junkosha Inc. | Fluororesin laminate substrate |
| JP2007157965A (en) * | 2005-12-05 | 2007-06-21 | Junkosha Co Ltd | Fluorine resin laminated substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0229732Y2 (en) | 1990-08-09 |