JPS6184220A - 電子部品封止成形金型装置 - Google Patents

電子部品封止成形金型装置

Info

Publication number
JPS6184220A
JPS6184220A JP20737284A JP20737284A JPS6184220A JP S6184220 A JPS6184220 A JP S6184220A JP 20737284 A JP20737284 A JP 20737284A JP 20737284 A JP20737284 A JP 20737284A JP S6184220 A JPS6184220 A JP S6184220A
Authority
JP
Japan
Prior art keywords
mold
plate
plunger
die plate
die
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP20737284A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0338097B2 (2
Inventor
Teruyoshi Shibata
柴田　輝義
Hirokuni Mamiya
間宮　洋邦
Chuichi Nishikawa
西河　忠一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP20737284A priority Critical patent/JPS6184220A/ja
Publication of JPS6184220A publication Critical patent/JPS6184220A/ja
Publication of JPH0338097B2 publication Critical patent/JPH0338097B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
JP20737284A 1984-10-03 1984-10-03 電子部品封止成形金型装置 Granted JPS6184220A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20737284A JPS6184220A (ja) 1984-10-03 1984-10-03 電子部品封止成形金型装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20737284A JPS6184220A (ja) 1984-10-03 1984-10-03 電子部品封止成形金型装置

Publications (2)

Publication Number Publication Date
JPS6184220A true JPS6184220A (ja) 1986-04-28
JPH0338097B2 JPH0338097B2 (2) 1991-06-07

Family

ID=16538631

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20737284A Granted JPS6184220A (ja) 1984-10-03 1984-10-03 電子部品封止成形金型装置

Country Status (1)

Country Link
JP (1) JPS6184220A (2)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5839889A (ja) * 1981-09-01 1983-03-08 八代　勉 パイプ固定具

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5839889A (ja) * 1981-09-01 1983-03-08 八代　勉 パイプ固定具

Also Published As

Publication number Publication date
JPH0338097B2 (2) 1991-06-07

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