JPS6196555U - - Google Patents

Info

Publication number
JPS6196555U
JPS6196555U JP1984181716U JP18171684U JPS6196555U JP S6196555 U JPS6196555 U JP S6196555U JP 1984181716 U JP1984181716 U JP 1984181716U JP 18171684 U JP18171684 U JP 18171684U JP S6196555 U JPS6196555 U JP S6196555U
Authority
JP
Japan
Prior art keywords
resin
lead wire
utility
model registration
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1984181716U
Other languages
English (en)
Other versions
JPH0115182Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984181716U priority Critical patent/JPH0115182Y2/ja
Publication of JPS6196555U publication Critical patent/JPS6196555U/ja
Application granted granted Critical
Publication of JPH0115182Y2 publication Critical patent/JPH0115182Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07354—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/341—Dispositions of die-attach connectors, e.g. layouts
    • H10W72/347—Dispositions of multiple die-attach connectors

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】
第１図は従来装置の構造図、第２図、第３図は
本考案の一実施例を示す断面図及び組立説明図、
第４図は本考案に使用するリード線の構造図。図
において１は半導体チツプ、２，７は半田、３，
３′は接続子（金属片）、４，４′はリード線、
４ａ，４ｂは凹部、５，８は封止樹脂、６はケー
スである。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) 少くともチツプ側もしくは両端部に凹部が
    形成された断面円形状リード線に直接もしくは接
    続子を介して半導体チツプを接合し、該接合部を
    含む半導体チツプを樹脂封止したことを特徴とす
    る樹脂モールド型半導体装置。 (2) 封止樹脂外に延在するリード線の凹部に半
    田を充填せしめたことを特徴とする実用新案登録
    請求の範囲第(1)項記載の樹脂モールド型半導体
    装置。
JP1984181716U 1984-11-30 1984-11-30 Expired JPH0115182Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984181716U JPH0115182Y2 (ja) 1984-11-30 1984-11-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984181716U JPH0115182Y2 (ja) 1984-11-30 1984-11-30

Publications (2)

Publication Number Publication Date
JPS6196555U true JPS6196555U (ja) 1986-06-21
JPH0115182Y2 JPH0115182Y2 (ja) 1989-05-08

Family

ID=30739257

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984181716U Expired JPH0115182Y2 (ja) 1984-11-30 1984-11-30

Country Status (1)

Country Link
JP (1) JPH0115182Y2 (ja)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4946664U (ja) * 1972-07-28 1974-04-24
JPS5043850U (ja) * 1973-08-21 1975-05-02
JPS5651847A (en) * 1979-10-05 1981-05-09 Hitachi Ltd Preparation of semiconductor device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4946664U (ja) * 1972-07-28 1974-04-24
JPS5043850U (ja) * 1973-08-21 1975-05-02
JPS5651847A (en) * 1979-10-05 1981-05-09 Hitachi Ltd Preparation of semiconductor device

Also Published As

Publication number Publication date
JPH0115182Y2 (ja) 1989-05-08

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