JPS62106651A - 電子部品の実装構造 - Google Patents

電子部品の実装構造

Info

Publication number
JPS62106651A
JPS62106651A JP60247619A JP24761985A JPS62106651A JP S62106651 A JPS62106651 A JP S62106651A JP 60247619 A JP60247619 A JP 60247619A JP 24761985 A JP24761985 A JP 24761985A JP S62106651 A JPS62106651 A JP S62106651A
Authority
JP
Japan
Prior art keywords
heat sink
heat
tab
connection terminal
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60247619A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0426785B2 (2
Inventor
Fumio Mori
森　史男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP60247619A priority Critical patent/JPS62106651A/ja
Publication of JPS62106651A publication Critical patent/JPS62106651A/ja
Publication of JPH0426785B2 publication Critical patent/JPH0426785B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07651—Connecting or disconnecting of strap connectors characterised by changes in properties of the strap connectors during connecting
    • H10W72/07653—Connecting or disconnecting of strap connectors characterised by changes in properties of the strap connectors during connecting changes in shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/764—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP60247619A 1985-11-05 1985-11-05 電子部品の実装構造 Granted JPS62106651A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60247619A JPS62106651A (ja) 1985-11-05 1985-11-05 電子部品の実装構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60247619A JPS62106651A (ja) 1985-11-05 1985-11-05 電子部品の実装構造

Publications (2)

Publication Number Publication Date
JPS62106651A true JPS62106651A (ja) 1987-05-18
JPH0426785B2 JPH0426785B2 (2) 1992-05-08

Family

ID=17166201

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60247619A Granted JPS62106651A (ja) 1985-11-05 1985-11-05 電子部品の実装構造

Country Status (1)

Country Link
JP (1) JPS62106651A (2)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0524763A3 (2) * 1991-07-22 1994-02-16 Motorola Inc
JP2007234886A (ja) * 2006-03-01 2007-09-13 Compal Communications Inc 散熱構成を有する電子素子アセンブリ

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0524763A3 (2) * 1991-07-22 1994-02-16 Motorola Inc
JP2007234886A (ja) * 2006-03-01 2007-09-13 Compal Communications Inc 散熱構成を有する電子素子アセンブリ

Also Published As

Publication number Publication date
JPH0426785B2 (2) 1992-05-08

Similar Documents

Publication Publication Date Title
JP2974552B2 (ja) 半導体装置
US10249552B2 (en) Semiconductor package having double-sided heat dissipation structure
US5455457A (en) Package for semiconductor elements having thermal dissipation means
JPH06252285A (ja) 回路基板
JP2591499B2 (ja) 半導体装置
JPS6221249A (ja) 半導体装置
JPS62106651A (ja) 電子部品の実装構造
JP2590521B2 (ja) チップキャリア
JP2793356B2 (ja) パワーデバイス実装板
JPS63308943A (ja) 半導体装置
JPH04180689A (ja) パワーデバイス実装板
JP2691352B2 (ja) 電子部品塔載装置
JP2841945B2 (ja) 半導体装置
JPS61147554A (ja) ハイブリツドｉｃモジユ−ル
JPH0196952A (ja) 気密封止チツプキヤリア
JPH07235633A (ja) マルチチップモジュール
JP2551349B2 (ja) 樹脂封止型半導体装置
JP3013612B2 (ja) 半導体装置
JPH04299849A (ja) 半導体装置
JP2000223629A (ja) ベアｉｃの放熱構造
JP2539192B2 (ja) 表示装置
JPH03292799A (ja) プリント配線板ユニットの放熱構造
JP2730388B2 (ja) 混成集積回路装置
JPH03235357A (ja) ヒートシンク構造体
JPS62189798A (ja) ハイブリツドｉｃの構成方法

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees