JPS62140796U - - Google Patents

Info

Publication number
JPS62140796U
JPS62140796U JP1986027311U JP2731186U JPS62140796U JP S62140796 U JPS62140796 U JP S62140796U JP 1986027311 U JP1986027311 U JP 1986027311U JP 2731186 U JP2731186 U JP 2731186U JP S62140796 U JPS62140796 U JP S62140796U
Authority
JP
Japan
Prior art keywords
wiring
utility
model registration
support plate
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986027311U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986027311U priority Critical patent/JPS62140796U/ja
Publication of JPS62140796U publication Critical patent/JPS62140796U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Description

【図面の簡単な説明】
第１図は本考案の一実施例を示し、ａは要部斜
視図、ｂ，ｃ，ｄ，ｅは半導体チツプの異なる接
続法をそれぞれ示す側面図、第２図は別の実施例
を示し、ａは要部斜視図、ｂ，ｃ，ｄは半導体チ
ツプの異なる接続法をそれぞれ示す側面図、第３
図、第４図、第５図はそれぞれ本考案のさらに異
なる実施例を示す要部斜視図である。 １：セラミツク基板、２：配線導体、３：半導
体チツプ、４：導線、５：フインガ、６：バンプ
電極、７：プリント基板、８：プリント配線、９
：可撓性基板、１０：金属板、１１：冷却フイン
。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) 半導体素体が、半導体材料に近似した熱膨
    張係数を有する材料からなり、少なくとも表面が
    絶縁性の支持板に固定され、さらに一つまたは複
    数の支持板が配線板に垂直に固定され、半導体素
    体の電極と配線板上の配線とが直接あるいは支持
    板上の配線を介して接続されたことを特徴とする
    電子装置。 (2) 実用新案登録請求の範囲第１項記載の装置
    において、支持板が絶縁材料からなる板と熱良導
    性材料からなる放熱板との積層体であることを特
    徴とする電子装置。 (3) 実用新案登録請求の範囲第１項記載の装置
    において、配線板がプリント板であることを特徴
    とする電子装置。
JP1986027311U 1986-02-26 1986-02-26 Pending JPS62140796U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986027311U JPS62140796U (ja) 1986-02-26 1986-02-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986027311U JPS62140796U (ja) 1986-02-26 1986-02-26

Publications (1)

Publication Number Publication Date
JPS62140796U true JPS62140796U (ja) 1987-09-05

Family

ID=30829218

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986027311U Pending JPS62140796U (ja) 1986-02-26 1986-02-26

Country Status (1)

Country Link
JP (1) JPS62140796U (ja)

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